A low-temperature solid-state bonding method based on copper bump coated with nickel microcones and silver buffer

2016 ◽  
Vol 181 ◽  
pp. 165-168 ◽  
Author(s):  
Fengtian Hu ◽  
Penghui Xu ◽  
Wenqi Zhang ◽  
Anmin Hu ◽  
Ming Li
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Solid State Bonding ◽  
Bonding Method

Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones

2013 ◽  
Vol 268 ◽  
pp. 368-372 ◽  
Author(s):  
Qin Lu ◽  
Zhuo Chen ◽  
Wenjing Zhang ◽  
Anmin Hu ◽  
Ming Li
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Solid State Bonding ◽  
Bonding Method

Study on rigid restraint thermal self-compressing bonding – A new solid state bonding method

2014 ◽  
Vol 129 ◽  
pp. 43-45 ◽  
Author(s):  
Yunhua Deng ◽  
Qiao Guan ◽  
Bing Wu ◽  
Xichang Wang ◽  
Jun Tao
Keyword(s):  
Solid State ◽  
Solid State Bonding ◽  
Bonding Method

Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection

2012 ◽  
Vol 1 (1) ◽  
pp. P7-P10 ◽  
Author(s):  
Z. Chen ◽  
T. Luo ◽  
T. Hang ◽  
M. Li ◽  
A. Hu
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Solid State Bonding

A Study of Solid State Bonding Strength of Nonferrous Metals by Using Metal Salt Generation Bonding Method

2014 ◽  
Vol 783-786 ◽  
pp. 2450-2455
Author(s):  
Shinji Koyama
Keyword(s):  
Solid State ◽  
Formic Acid ◽  
Metal Salt ◽  
Bonding Temperature ◽  
Copper Surface ◽  
Solid State Bonding ◽  
Bonded Joint ◽  
Set Up ◽  
Bonding Method ◽  
Aluminum Surfaces

In recent years, an enormous pressure was put on the need to design and develop products that are compliant with the stringent environmental regulations set up various countries. Among the problems that need to be addressed is the need to design and develop environmentally friendly products that are energy efficient and easy to recycle. In this study, the effect of metal salt generation processing on the tensile strength of the bonded interface of Al/Al and Al/Cu was investigated by SEM observations of interfacial microstructures and fractured surfaces. Aluminum surfaces were modified by boiling in 5% aqueous solution of NaOH for 30 s and 98% formic acid for 60 s. Copper surface were modified by boiling 98% formic acid for 60 s. Solid-state bonding was performed at bonding temperature of 673 ~ 813 K and under a pressure of 6 MPa ( bonding time of 1.8 ks). Using metal salt generation bonding technique, the bonded joint is able to reach 0.2% proof stress at lower bonding temperature and with less deformation.

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