scholarly journals PVMaT cost reductions in the EFG high volume PV manufacturing line: Annual report, 5 August 1998--4 August 1999[PhotoVoltaic Manufacturing Technology, Edge-defined Film-fed Growth]

1999 ◽  
Author(s):  
B Bathey ◽  
B Brown ◽  
J Cao ◽  
S Ebers ◽  
R Gonsiorawski ◽  
...  
2001 ◽  
Author(s):  
B Bathey ◽  
B Brown ◽  
J Cao ◽  
S Ebers ◽  
R Gonsiorawski ◽  
...  

2002 ◽  
Author(s):  
J. Kalejs ◽  
B. Bathey ◽  
B. Brown ◽  
J. Cao ◽  
J. Doedderlein ◽  
...  

Author(s):  
Roberto Yumbla ◽  
Stuart Lumley ◽  
M. Khurshid Khan

This paper proposes an innovative factory planning methodology to achieve the objectives that were defined by Flexitallic for the future expansion of the Thermiculite production line. The concepts under investigation extend to the analysis of flow benefits and restrictions considering product features and demands addressed in a proposed Batch/Flow Comparative Matrix. Furthermore, this paper introduces the Quality Function Deployment (QFD) concept to support the manufacturing line design using a mechanism of incorporating commercial awareness in all stages of the product deployment. The original QFD ensures process planning by bringing parts deployment into parts characteristics through the House of Quality. This study renews the original QFD by developing the Strategic Alignment of Quality Function Deployment (SAQFD) to achieve proactive management of Houses III and House IV. The case study demonstrates the utilization and applicability of the proposed methodologies, and demonstrates their importance during the design of a high volume production line.


2015 ◽  
Vol 2015 (DPC) ◽  
pp. 000995-001015
Author(s):  
Tom Strothmann

The potential of Thermo compression Bonding (TCB) has been widely discussed for several years, but it has not previously achieved widespread production use. TCB has now begun the transition to an accepted high volume manufacturing technology driven primarily by the memory market, but with wider adoption close for non-memory applications. Several key factors have enabled this transition, including advanced TCB equipment with higher UPH for cost reduction and advanced methods of inline process control. The unique requirements of TCB demand absolute process control, simultaneous data logging capability for multiple key factors in the process and portability of the process between tools. This introduces a level of sophistication that has not previously been required for BE assembly processes. This presentation will review state of the art TCB technology and the fundamental equipment requirements to support the transition to HVM.


Author(s):  
T. Hook ◽  
B. Chen ◽  
G. Starkey ◽  
A. Bhattacharyya ◽  
M. Faucher ◽  
...  

Author(s):  
Hyoung H. Kang ◽  
John F. King ◽  
Oliver D. Patterson ◽  
Steven B. Herschbein ◽  
James P. Nadeau ◽  
...  

Abstract This paper introduces a high volume and fast turnaround TEM sample preparation method and requirements for a 300 mm inline DualBeam (FIB/SEM) system with “hands-off” full automation. It requires a factory automation system, robust automated recipes, and an ex-situ TEM lamella liftout system. It describes the recipe structure and TEM lamella lift out procedures. The focus is on fully automated TEM sample preparation for process monitoring in manufacturing line. Two successful examples are described to demonstrate the benefit of this method. The first one is TEM sample for CA profile at M1 level. The second is TEM sample for poly crystalline (PC) line profile at post-etch.


Author(s):  
M.D. Rosenblum ◽  
B.R. Bathey ◽  
J. Cao ◽  
R. Gonsiorawski ◽  
B.H. Mackintosh ◽  
...  

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