scholarly journals Characterization of the thermosonic wire bonding technique. [Combination of ultrasonic energy and thermocompression]

1976 ◽  
Author(s):  
D.R. Johnson ◽  
E.L. Chavez
Keyword(s):  
Wire Bonding ◽  
Ultrasonic Energy ◽  
Thermosonic Wire Bonding ◽  
Bonding Technique

Reliability characterization of heavy wire bonding materials

2012 ◽  
Author(s):  
F. Naumann ◽  
J. Schischka ◽  
S. Koetter ◽  
E. Milke ◽  
M. Petzold
Keyword(s):  
Wire Bonding

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

2015 ◽  
Vol 137 (1) ◽  
Author(s):  
Fuliang Wang ◽  
Dengke Fan
Keyword(s):  
Experimental Study ◽  
Finite Element ◽  
Energy Conservation ◽  
Design Process ◽  
Gold Wire ◽  
Wire Bonding ◽  
Fe Model ◽  
Amplification Ratio ◽  
Model Studies ◽  
Thermosonic Wire Bonding

A wire clamp is used to grip a gold wire with in 1–2 ms during thermosonic wire bonding. Modern wire bonders require faster and larger opening wire clamps. In order to simplify the design process and find the key parameters affecting the opening of wire clamps, a model analysis based on energy conservation was developed. The relation between geometric parameters and the amplification ratio was obtained. A finite element (FE) model was also developed in order to calculate the amplification ratio and natural frequency. Experiments were carried out in order to confirm the results of these models. Model studies show that the arm length was the major factor affecting the opening of the wire clamp.

Understanding the Role of Ultrasonic Welding in Wire Bonding

2015 ◽  
Vol 2015 (1) ◽  
pp. 000430-000433
Author(s):  
Lee Levine
Keyword(s):  
Ultrasonic Welding ◽  
Wire Bonding ◽  
Ultrasonic Energy ◽  
Weld Formation ◽  
Bonding Parameter ◽  
Key Factor

Wire bonding is the dominant chip interconnection method. Ultrasonic energy is the most important bonding parameter effecting the quality and the reliability of the intermetallic weld. Understanding the mechanism enabling weld formation is a key factor in maintaining the reliability and productivity that wire bonding provides.

Experimental Study of Kick up Phenomenon in Thermosonic Wire-Bonding

2012 ◽  
Vol 160 ◽  
pp. 77-81
Author(s):  
Jing Jing Tian ◽  
Lei Han
Keyword(s):  
Image Processing ◽  
Experimental Study ◽  
High Speed ◽  
Gold Wire ◽  
Wire Bonding ◽  
Processing Method ◽  
Experimental Results ◽  
High Speed Camera ◽  
Depth Study ◽  
Thermosonic Wire Bonding

Kick-up phenomenon during looping is an important factor in thermosonic wire bonding. In this study, the loping process during wire bonding was recorded by using high-speed camera, and wire profiles evolution was obtained from images sequence by image processing method. With a polynomial fitting, the wire loop profiling was described by the curvature changing, and kick-up phenomenon on gold wire was found between the instant of 290th frame(0.0537s) to 380th frame (0.0703s), the change of curvature is divided into three phases, a looping phase, a mutation phase and a kick-up phase. While in the kick-up phase, the kick up phenomenon is the most obvious. These experimental results were useful for in-depth study of kick-up phenomenon by simulation.

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