scholarly journals Investigation of the influence of grain boundary chemistry, test temperatures, and strain rate on the fracture behavior of ITER copper alloys

1997 ◽  
Author(s):  
K Leedy ◽  
J F Stubbins ◽  
D Krus
Keyword(s):  
Grain Boundary ◽  
Strain Rate ◽  
Fracture Behavior ◽  
Copper Alloys ◽  
Boundary Chemistry

Mechanisms of Dynamic Recrystallization in Cu-Sn-P Alloy

2010 ◽  
Vol 654-656 ◽  
pp. 1267-1270 ◽  
Author(s):  
Hiromi Miura ◽  
Masato Watanabe ◽  
Takashi Shirai ◽  
Akihiko Ishibashi
Keyword(s):  
Grain Boundary ◽  
Dynamic Recrystallization ◽  
Strain Rate ◽  
Boundary Migration ◽  
True Strain ◽  
Copper Alloys ◽  
Peak Stress ◽  
High Strength ◽  
Columnar Grains ◽  
Almost All

Dynamic recrystallization (DRX) behavior in a Cu-0.65Sn-0.025P (mass%) alloy (Cu-Sn-P), which had been newly developed for high strength copper tubes, was systematically investigated. For this purpose, an orientation-controlled bicrystal ( =28o); a model samples of the as-casted billet having coarse columnar grains, was hot deformed in compression at 1073 K at true strain rates from 2 x 10-3 s-1 to 2 x 10-1 s-1 in vacuum. Appearance of peak stress, where DRX sets in, was much delayed in Cu-Sn-P alloy compared with that in Cu and the other copper alloys. While nucleation of new grains preferentially took place at grain boundary, this tendency became more significant with decreasing strain rate. Almost all the new grains were annealing twins (3) formed behind the migrating grain boundary. The more preferential nucleation at grain boundary with decreasing strain rate could be, therefore, reasonably understood by easier and more extensive occurrence of grain boundary migration at lower strain rate.

Effect of boron on the fracture behavior and grain boundary chemistry of Ni3Fe

2011 ◽  
Vol 64 (3) ◽  
pp. 303-306 ◽  
Author(s):  
Y. Liu ◽  
C.T. Liu ◽  
L. Heatherly ◽  
E.P. George
Keyword(s):  
Grain Boundary ◽  
Fracture Behavior ◽  
Boundary Chemistry

Observations of dislocation interactions with recrystallized grain boundaries

1988 ◽  
Vol 46 ◽  
pp. 628-629
Author(s):  
C. W. Price
Keyword(s):  
Dislocation Density ◽  
Grain Boundary ◽  
Strain Rate ◽  
Grain Boundaries ◽  
Dislocation Structure ◽  
Hot Deformation ◽  
Static Recrystallization ◽  
High Dislocation Density ◽  
High Angle ◽  
Dislocation Interactions

Little evidence exists on the interaction of individual dislocations with recrystallized grain boundaries, primarily because of the severely overlapping contrast of the high dislocation density usually present during recrystallization. Interesting evidence of such interaction, Fig. 1, was discovered during examination of some old work on the hot deformation of Al-4.64 Cu. The specimen was deformed in a programmable thermomechanical instrument at 527 C and a strain rate of 25 cm/cm/s to a strain of 0.7. Static recrystallization occurred during a post anneal of 23 s also at 527 C. The figure shows evidence of dissociation of a subboundary at an intersection with a recrystallized high-angle grain boundary. At least one set of dislocations appears to be out of contrast in Fig. 1, and a grainboundary precipitate also is visible. Unfortunately, only subgrain sizes were of interest at the time the micrograph was recorded, and no attempt was made to analyze the dislocation structure.

Morphology and atomic structure of segregated grain boundaries in Cu-Sb

1992 ◽  
Vol 50 (1) ◽  
pp. 254-255
Author(s):  
R. W. Fonda ◽  
D. E. Luzzi
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Intergranular Fracture ◽  
Atomic Structure ◽  
Copper Alloys ◽  
Polycrystalline Materials ◽  
Grain Boundary Embrittlement ◽  
Boundary Embrittlement

The properties of polycrystalline materials are strongly dependant upon the strength of internal boundaries. Segregation of solute to the grain boundaries can adversely affect this strength. In copper alloys, segregation of either bismuth or antimony to the grain boundary will embrittle the alloy by facilitating intergranular fracture. Very small quantities of bismuth in copper have long been known to cause severe grain boundary embrittlement of the alloy. The effect of antimony is much less pronounced and is observed primarily at lower temperatures. Even though moderate amounts of antimony are fully soluble in copper, concentrations down to 0.14% can cause grain boundary embrittlement.

Effect of thermal annealing on grain boundary chemistry of polycrystalline TiBa2Ca2Cu3Oy films

1994 ◽  
Vol 52 ◽  
pp. 968-969
Author(s):  
Z. L. Wang ◽  
C. L. Briant ◽  
J. DeLuca ◽  
A. Goyal ◽  
D. M. Kroeger ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Weak Link ◽  
Zero Field ◽  
Stabilized Zirconia ◽  
Local Texture ◽  
Transmission Electron ◽  
Axis Alignment ◽  
Boundary Chemistry ◽  
Small Misorientation ◽  
Misorientation Angles

Recent studies have shown that spray-pyrolyzed films of the Tl-1223 compound (TlxBa2Ca2Cu3Oy, with 0.7 < × < 0.95) on polycrystalline yttrium stabilized zirconia substrates can be prepared which have critical current density Jc near 105 A/cm2 at 77 K, in zero field. The films are polycrystalline, have excellent c-axis alignment, and show little evidence of weak-link behavior. Transmission electron microscopy (TEM) studies have shown that most grain boundaries have small misorientation angles. It has been found that the films have a nigh degree of local texture indicative of colonies of similarly oriented grains. It is believed that inter-colony conduction is enhanced by a percolative network of small angle boundaries at colony interfaces. It has also been found that Jc is increased by a factor of 4 - 5 after the films were annealed at 600 °C in oxygen. This study is thus carried out to determine the effect on grain boundary chemistry of the heat treatment.

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