scholarly journals Progress report on the influence of test temperature and grain boundary chemistry on the fracture behavior of ITER copper alloys

1998 ◽  
Author(s):  
M Li ◽  
J F Stubbins ◽  
D J Edwards
Keyword(s):  
Grain Boundary ◽  
Test Temperature ◽  
Fracture Behavior ◽  
Copper Alloys ◽  
Progress Report ◽  
Boundary Chemistry

Effect of boron on the fracture behavior and grain boundary chemistry of Ni3Fe

2011 ◽  
Vol 64 (3) ◽  
pp. 303-306 ◽  
Author(s):  
Y. Liu ◽  
C.T. Liu ◽  
L. Heatherly ◽  
E.P. George
Keyword(s):  
Grain Boundary ◽  
Fracture Behavior ◽  
Boundary Chemistry

Morphology and atomic structure of segregated grain boundaries in Cu-Sb

1992 ◽  
Vol 50 (1) ◽  
pp. 254-255
Author(s):  
R. W. Fonda ◽  
D. E. Luzzi
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Intergranular Fracture ◽  
Atomic Structure ◽  
Copper Alloys ◽  
Polycrystalline Materials ◽  
Grain Boundary Embrittlement ◽  
Boundary Embrittlement

The properties of polycrystalline materials are strongly dependant upon the strength of internal boundaries. Segregation of solute to the grain boundaries can adversely affect this strength. In copper alloys, segregation of either bismuth or antimony to the grain boundary will embrittle the alloy by facilitating intergranular fracture. Very small quantities of bismuth in copper have long been known to cause severe grain boundary embrittlement of the alloy. The effect of antimony is much less pronounced and is observed primarily at lower temperatures. Even though moderate amounts of antimony are fully soluble in copper, concentrations down to 0.14% can cause grain boundary embrittlement.

Effect of thermal annealing on grain boundary chemistry of polycrystalline TiBa2Ca2Cu3Oy films

1994 ◽  
Vol 52 ◽  
pp. 968-969
Author(s):  
Z. L. Wang ◽  
C. L. Briant ◽  
J. DeLuca ◽  
A. Goyal ◽  
D. M. Kroeger ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Weak Link ◽  
Zero Field ◽  
Stabilized Zirconia ◽  
Local Texture ◽  
Transmission Electron ◽  
Axis Alignment ◽  
Boundary Chemistry ◽  
Small Misorientation ◽  
Misorientation Angles

Recent studies have shown that spray-pyrolyzed films of the Tl-1223 compound (TlxBa2Ca2Cu3Oy, with 0.7 < × < 0.95) on polycrystalline yttrium stabilized zirconia substrates can be prepared which have critical current density Jc near 105 A/cm2 at 77 K, in zero field. The films are polycrystalline, have excellent c-axis alignment, and show little evidence of weak-link behavior. Transmission electron microscopy (TEM) studies have shown that most grain boundaries have small misorientation angles. It has been found that the films have a nigh degree of local texture indicative of colonies of similarly oriented grains. It is believed that inter-colony conduction is enhanced by a percolative network of small angle boundaries at colony interfaces. It has also been found that Jc is increased by a factor of 4 - 5 after the films were annealed at 600 °C in oxygen. This study is thus carried out to determine the effect on grain boundary chemistry of the heat treatment.

Observations of grain boundary chemistry variations in a boron carbide processed with oxide additives

2018 ◽  
Vol 142 ◽  
pp. 106-110 ◽  
Author(s):  
Kristopher D. Behler ◽  
Christopher J. Marvel ◽  
Jerry C. LaSalvia ◽  
Scott D. Walck ◽  
Martin P. Harmer
Keyword(s):  
Grain Boundary ◽  
Boron Carbide ◽  
Boundary Chemistry
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