scholarly journals Thermal expansion, thermal conductivity, and heat capacity measurements for boreholes UE25 NRG-4, UE25 NRG-5, USW NRG-6, and USW NRG-7/7A

1997 ◽  
Author(s):  
N.S. Brodsky ◽  
M. Riggins ◽  
J. Connolly ◽  
P. Ricci
2013 ◽  
Vol 115 (2) ◽  
pp. 1883-1891 ◽  
Author(s):  
Benigno Barbés ◽  
Ricardo Páramo ◽  
Eduardo Blanco ◽  
Carlos Casanova

10.14311/626 ◽  
2004 ◽  
Vol 44 (5-6) ◽  
Author(s):  
P. Tesárek ◽  
J. Drchalová ◽  
J. Kolísko ◽  
P. Rovnaníková ◽  
R. Černý

The reference measurements of basic mechanical, thermal and hygric parameters of hardened flue gas desulfurization gypsum are carried out. Moisture diffusivity, water vapor diffusion coefficient, thermal conductivity, volumetric heat capacity and linear thermal expansion coefficient are determined with the primary aim of comparison with data obtained for various types of modified gypsum in the future. 


2011 ◽  
Vol 106 (3) ◽  
pp. 875-879 ◽  
Author(s):  
Hrudananda Jena ◽  
R. Venkata Krishnan ◽  
R. Asuvathraman ◽  
K. Nagarajan ◽  
K. V. Govindan Kutty

2004 ◽  
Vol 19 (12) ◽  
pp. 3556-3559 ◽  
Author(s):  
G.S. Nolas ◽  
J.L. Cohn ◽  
J.S. Dyck ◽  
C. Uher ◽  
G.A. Lamberton ◽  
...  

Low-temperature resistivity, Seebeck coefficient, thermal conductivity, and heat-capacity measurements were performed on Ba8Ga16Sn30. This compound crystallizes in a cubic type-VIII clathrate phase, space group I¯43m, with the Baatoms residing inside voids created by a tetrahedrally bonded network of Ga andSn atoms. Ba8Ga16Sn30 exhibits semiconducting behavior above 150 K with a low thermal conductivity and thus may hold potential for thermoelectric applications.


2009 ◽  
Vol 42 (2) ◽  
pp. 284-294 ◽  
Author(s):  
Hengjiang Cong ◽  
Huaijin Zhang ◽  
Jiyang Wang ◽  
Wentao Yu ◽  
Jiandong Fan ◽  
...  

The crystal structure of monoclinic Lu2SiO5(LSO) crystals, grown by the Czochralski method, was determined at room temperature by X-ray diffraction. The unit-cell parameters area= 10.2550 (2),b= 6.6465 (2),c= 12.3626 (4) Å, β = 102.422 (1)° in space groupI2/a. The linear thermal expansion tensor was determined along thea,b,candc* directions over the temperature range from 303.15 to 768.15 K, and the principal coefficients of the thermal expansion tensor are found to be αI= −1.0235 × 10−6 K, αII= 4.9119 × 10−6 K and αIII= 10.1105 × 10−6 K. The temperature dependence of the cell volume and monoclinic angle were also evaluated. In addition, the specific heat and the thermal diffusivity were measured over the temperature ranges from 293.15 to 673.15 K and from 303.15 to 572.45 K, respectively. As a result, the anisotropic thermal conductivity could be calculated and is reported for the first time, to the best of the authors' knowledge. The specific heat capacity of LSO is 139.54 J mol−1 K−1, and the principal components of the thermal conductivity arekI= 2.26 W m−1 K−1,kII= 3.14 W m−1 K−1andkII= 3.67 W m−1 K−1at 303.15 K. A new structure model was proposed to better understand the relationships between the crystal structure and anisotropic thermal properties. In comparison with other laser matrix crystals, it is found that LSO possesses relatively large anisotropic thermal properties, and owing to its small heat capacity it has a moderate thermal conductivity, which is similar to those of the tungstates but lower than those of the vanadates.


2010 ◽  
Vol 24 (29) ◽  
pp. 5821-5832 ◽  
Author(s):  
O. I. PURSKY ◽  
V. A. KONSTANTINOV

The isobaric thermal conductivity of solid β- SF 6, CCl 4 (Ib) , and C 6 H 6 is investigated by using the Debye thermal conductivity model and taking into account the effect of minimum thermal conductivity. The simulation was carried out in the framework of a model where heat is transferred by phonons and "diffusive" modes with regard to the thermal expansion and phonon–rotation coupling. For this purpose the temperature dependences of the isobaric heat capacity components have been calculated numerically for β- SF 6, CCl 4 (Ib) , and C 6 H 6. The contributions of phonon–phonon and phonon–rotational interactions to the total thermal resistance are discussed.


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