scholarly journals Supported growth of polycrystalline silicon sheet on low-cost ceramic, carbon, or reusable substrate. Quarterly report No. 1, September 26-December 31, 1979

1980 ◽  
Author(s):  
P.W. Chapman ◽  
J.D. Heaps ◽  
S.B. Schuldt ◽  
J.D. Zook
1981 ◽  
Vol 5 ◽  
Author(s):  
Y.S. Tsuo ◽  
J.B. Milstein ◽  
T. Surek

ABSTRACTThe method of preparation of polycrystalline silicon can have a strong influence on the types and distributions of grain boundaries, and thereby influence the electrical properties of devices made from such materials. Examples of methods employed in the preparation of polycrystalline silicon for solar cell applications include directional solidification (Czochralski pulling and various casting techniques), ribbon growth techniques (ribbon-to-ribbon, edgedefined film-fed growth, low-angle silicon sheet growth, edge supported pulling, silicon-on-ceramic), chemical and physical vapor deposition (CVD and PVD) on silicon and foreign substrates, recrystallization techniques (laser, electron beam), and others such as graphoepitaxy and electrodeposition. This paper reviews the important morphological features such as grain size and defect structures of the various polycrystalline silicon materials and the influence of growth parameters on these features. The effects of grain boundaries on the electrical and photovoltaic properties of various polycrystalline silicon materials will also be discussed.


1982 ◽  
Author(s):  
W. Gass ◽  
R. Witkowski ◽  
I. Kanter ◽  
A. Berringer ◽  
T. Temofonte, II

Author(s):  
K. M. Koliwad ◽  
T. Daud ◽  
J. K. Liu
Keyword(s):  
Low Cost ◽  

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 1080
Author(s):  
Vladislav Komenko ◽  
Andrey Kravchenko ◽  
Wolf-Joachim Fischer

Within the current work, we present a miniaturized IR-Emitter based on Silicon-On-Nothing (SON) technology capable of producing 10 ms pulses. Transition to monocrystalline silicon, as the material choice for the filament, is governed by improved reliability and greater thermal stability as opposed to polycrystalline silicon alternative, commonly used in such class of devices. Compact design, low-cost processing and exceptional filament material properties make the presented device a favorite solution for integrated gas sensing applications. Numerical modeling and measurements of the IR-Emitter are performed to investigate the heating dynamics and assess the structure’s behavior at extreme temperatures as well as confirm the target performance. Additionally, a part of the work is dedicated to cover the insight of used fabrication process and the discussion of further improvements.


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