Inert Anode Roadmap

1998 ◽  
Author(s):  
none,
Keyword(s):  
Inert Anode

Effect of TiN content on properties of NiFe 2 O 4 based ceramic inert anode for aluminum electrolysis

2021 ◽  
Author(s):  
Zhigang Zhang ◽  
Yukun Wang ◽  
Guoyin Zu ◽  
Zhuokun Cao ◽  
Jinli Liu ◽  
...  
Keyword(s):  
Inert Anode ◽  
Aluminum Electrolysis ◽  
Tin Content

Effects of the Additive ZrO2on Properties of Nickel Ferrite Cermet Inert Anode

2011 ◽  
pp. 1129-1134 ◽  
Author(s):  
Xiao Zhang ◽  
Guangchun Yao ◽  
Yihan Liu ◽  
Jia Ma ◽  
Zhigang Zhang
Keyword(s):  
Nickel Ferrite ◽  
Inert Anode

Formation of Solid Solution and Metallic Nickel Phases During Suspension Plasma Spraying of Co Oxide and Ni Oxide

2021 ◽  
Author(s):  
Vahid Jalilvand ◽  
Ali Dolatabadi ◽  
Christian Moreau ◽  
Saeed Mohammadkhani ◽  
Lionel Roué ◽  
...  
Keyword(s):  
Solid Solution ◽  
Inert Anode ◽  
Metallic Nickel ◽  
Aluminum Production ◽  
X Ray Diffraction ◽  
Oxide Coatings ◽  
Cobalt Nickel ◽  
Sprayed Coatings ◽  
Insight Into

Abstract The focus of this study is the formation of a solid solution and metallic nickel in the cobalt-nickel mixed oxide coatings during suspension plasma spray (SPS) deposition. The (Co,Ni)O solid solution is a potential material for inert anode applications in aluminum production. SPS coatings and in-flight collected particles are studied to gain further insight into the melting and mixing phenomena of the NiO and CoO powders as well as phase formation in the deposited coatings. Moreover, the role of suspension feedstock particle sizes on the microstructure of coatings is discussed. SEM, EDS and X-ray diffraction studies helped better understanding the formation of different crystalline phases within the as-sprayed coatings. It was found that the formation of metallic nickel is possible in the coatings. The results support the importance of substrate temperature on the formation of metallic Ni, so that keeping the substrate at low temperature results in an increase of the Ni content in the coatings. In this study, possible causes for the formation of metallic Ni during spraying are discussed.

Lunar Soil Simulant Electrolysis Using Inert Anode for Al-Si Alloy and Oxygen Production

2017 ◽  
Vol 164 (2) ◽  
pp. H126-H133 ◽  
Author(s):  
Aimin Liu ◽  
Zhongning Shi ◽  
Xianwei Hu ◽  
Bingliang Gao ◽  
Zhaowen Wang
Keyword(s):  
Inert Anode ◽  
Lunar Soil ◽  
Oxygen Production

Mechanically Alloyed Cu-Ni-Fe-Y Material as Inert Anode for Al Production

2013 ◽  
pp. 1275-1281 ◽  
Author(s):  
V. Ouvarov-Bancalero ◽  
D. Guay ◽  
L. Roué
Keyword(s):  
Inert Anode ◽  
Mechanically Alloyed

Effect of Nanopowder Content on Properties of NiFe2O4 Matrix Inert Anode for Aluminum Electrolysis

2012 ◽  
pp. 1381-1384 ◽  
Author(s):  
Zhigang Zhang ◽  
Yihan Liu ◽  
Guangchun Yao ◽  
Di Wu ◽  
Junfei Ma
Keyword(s):  
Inert Anode ◽  
Aluminum Electrolysis

Consumable Anode Process for SnAg Electroplating

2014 ◽  
Vol 2014 (1) ◽  
pp. 000117-000121
Author(s):  
Marvin Bernt ◽  
Adam McClure
Keyword(s):  
Inert Anode ◽  
Alloy System ◽  
Deposition Potential ◽  
Wafer Level ◽  
Plating Bath ◽  
Wafer Level Packaging ◽  
Free Solder ◽  
Semiconductor Packaging ◽  
Sn Anode ◽  
Liquid Concentrate

Near eutectic tin-silver (SnAg) is currently the alloy of choice for electroplated lead-free solder bumping and Cu pillar capping. While lead-tin (PbSn) is still used in some applications, there has been considerable momentum in moving away from the use of lead in semiconductor packaging. Both solders are normally electroplated as alloys with specific compositions to target a desired melting point. Since the deposition potentials of lead and tin are very close together, they plate with similar characteristics. This makes it possible for PbSn plating systems to use a consumable anode system where the anode composition matches the desired deposit composition. Metals are replenished into the bath in much the same ratio they are consumed. In a SnAg plating bath, the deposition potential of Ag is much more positive than Sn, so very low potential is required for Ag deposition. The plating rate of Ag is generally mass transfer limited. The plating rate of Sn is current controlled. While similar in concept to systems using consumable anodes for plating other metals, the SnAg alloy system presents some unique challenges. Because it is more noble, the Ag+ will deposit onto the Sn anode material by displacement reaction, and passivation will occur. Thus, the Sn anodes cannot come in contact with the Ag+ in the bath. Historically this problem is overcome by using an inert anode and metals replenishment by liquid concentrate. This paper outlines a method for plating SnAg using a consumable Sn anode, thereby reducing cost of ownership (CoO) and increasing bath stability compared to conventional SnAg wafer level packaging (WLP) plating.

Preparation NiFe2O4 Matrix Inert Anode Used in Aluminum Electrolysis by Adding Nanopowder

2011 ◽  
pp. 1149-1153
Author(s):  
Zhigang Zhang ◽  
Guangchun Yao ◽  
Yihan Liu ◽  
Xiao Zhang
Keyword(s):  
Inert Anode ◽  
Aluminum Electrolysis

Effects of the Additive ZrO2 on Properties of Nickel Ferrite Cermet Inert Anode

2011 ◽  
pp. 1129-1134
Author(s):  
Xiao Zhang ◽  
Guangchun Yao ◽  
Yihan Liu ◽  
Jia Ma ◽  
Zhigang Zhang
Keyword(s):  
Nickel Ferrite ◽  
Inert Anode
Sign in / Sign up

Export Citation Format

Share Document