Role of Yttrium Addition and Annealing Temperature on Thermal Stability and Hardness of Nanocrystalline CoCrFeNi High Entropy Alloy

2021 ◽  
Author(s):  
Gökhan Polat ◽  
Mustafa Teki̇n ◽  
Hasan Kotan
2015 ◽  
Vol 2015 ◽  
pp. 1-7 ◽  
Author(s):  
Ruei-Cheng Lin ◽  
Tai-Kuang Lee ◽  
Der-Ho Wu ◽  
Ying-Chieh Lee

Ni-Cr-Si-Al-Ta resistive thin films were prepared on glass and Al2O3substrates by DC magnetron cosputtering from targets of Ni0.35-Cr0.25-Si0.2-Al0.2casting alloy and Ta metal. Electrical properties and microstructures of Ni-Cr-Si-Al-Ta films under different sputtering powers and annealing temperatures were investigated. The phase evolution, microstructure, and composition of Ni-Cr-Si-Al-Ta films were characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). When the annealing temperature was set to 300°C, the Ni-Cr-Si-Al-Ta films with an amorphous structure were observed. When the annealing temperature was at 500°C, the Ni-Cr-Si-Al-Ta films crystallized into Al0.9Ni4.22, Cr2Ta, and Ta5Si3phases. The Ni-Cr-Si-Al-Ta films deposited at 100 W and annealed at 300°C which exhibited the higher resistivity 2215 μΩ-cm with −10 ppm/°C of temperature coefficient of resistance (TCR).


2017 ◽  
Vol 134 ◽  
pp. 426-433 ◽  
Author(s):  
Praveen Sathiyamoorthi ◽  
Joysurya Basu ◽  
Sanjay Kashyap ◽  
K.G. Pradeep ◽  
Ravi Sankar Kottada

2019 ◽  
Vol 30 (29) ◽  
pp. 294004 ◽  
Author(s):  
Yanwen Zhang ◽  
Matheus A Tunes ◽  
Miguel L Crespillo ◽  
Fuxiang Zhang ◽  
Walker L Boldman ◽  
...  

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