Effective Passive Phase-Change Light-Emitting Diode Cooling System Using Graphene Nanoplatelets Coatings

2021 ◽  
Author(s):  
Kai Yen Yong ◽  
Yen Keat Chan ◽  
Ee Von Lau ◽  
Yew Mun Hung
Keyword(s):  
Phase Change ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Graphene Nanoplatelets ◽  
Light Emitting ◽  
Passive Phase

Thermal Performance of Domestic Replacement A19 LED Lighting Products

2016 ◽  
Author(s):  
Thomas Storey ◽  
Robin Rackerby ◽  
Heather Dillon ◽  
Lydia Gingerich
Keyword(s):  
Heat Exchanger ◽  
Thermal Performance ◽  
Heat Dissipation ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Research Process ◽  
Light Emitting ◽  
Led Lighting ◽  
Proper Design ◽  
The Cost

In an effort to create a Light Emitting Diode (LED) lighting system that is as efficient as possible, the heat dissipation system must be accurately measured for proper design and operation. Because LED lighting technology is new, little optimization has been performed on typical cooling system required for most A19 replacement products. This paper describes the research process for evaluating the thermal performance of over 15 LED lighting products and compares their performance to traditional lighting sources, namely incandescent and compact fluorescent (CFL). This process uses radiation and convection to model typical cooling mechanisms for domestic A19 type replacement LED products. The A19 products selected for this investigation had input wattages ranging between 7 to 60 Watts, with outputs ranging from 450 to 1100 lumens. The average LED tested dissipated 43% (± 5%) of the total heat generated in the lighting product through the heat exchanger. The best thermal performance was observed in an LED product that dissipated approximately 58% of the total product heat through the heat exchanger. Results indicate that significant improvements to the current LED heat exchanger designs are possible, which will help lower the cost of future LED products, improve performance, and reduce the environmental footprint of the products.

Application of Micro-Tube Water-Cooling Device for the Improvement of Heat Management in Mixed White Light Emitting Diode Modules

2011 ◽  
Vol 308-310 ◽  
pp. 2422-2427 ◽  
Author(s):  
Maw Tyan Sheen ◽  
Ming Der Jean ◽  
Yu Tsun Lai
Keyword(s):  
Thermal Management ◽  
White Light ◽  
Heat Dissipation ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Thermal Dissipation ◽  
Water Cooling ◽  
Cooling Device ◽  
Heat Management ◽  
Light Emitting

This paper introduces a module using the RGB-based LED design to improve the thermal management of a mixied white light LED and describes a system for heat dissipation in illuminated, high-power LED arrays. Mixed light LEDs can be produced by combining appropriate amounts of light from the red, green and blue LEDs in an array. A LED cooling system, using a micro- tube water-cooling device, was fabricated. Recycling water in the system, gave more efficient convection and the heat created by the LEDs was easily removed, in the experiments. It was shown that micro-tube water-cooling systems rendered an improvement in thermal management that effectively decreases the thermal resistance and provides very good thermal dissipation. Furthermore, the results of experiment and simulation demonstrated that a micro-tube water-cooling system is very effective in heat dissipation in LEDs and the fabrication of practical micro-water tube cooling devices for mixing light LEDs was feasible and useful

Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
James Petroski
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Energy Savings ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Point Of View ◽  
Light Bulb ◽  
Light Emitting ◽  
Size And Shape ◽  
Liquid Cooling System

The movement to light-emitting diode (LED) lighting systems worldwide is accelerating quickly as energy savings and reduction in hazardous materials increase in importance. Government regulations and rapidly lowering prices help to further this trend. Today's strong drive is to replace light bulbs of common outputs (60 W, 75 W, and 100 W) without resorting to compact fluorescent (CFL) bulbs containing mercury while maintaining the standard industry bulb size and shape referred to as A19. For many bulb designs, this A19 size and shape restriction forces a small heat sink which is barely capable of dissipating heat for 60 W equivalent LED bulbs with natural convection for today's LED efficacies. 75 W and 100 W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches are desirable for light bulbs from a consumer point of view. Thus, there is interest in developing natural convection cooled A19 light bulb designs for LEDs that cool far more effectively than today's current designs. Current A19 size heat sink designs typically have thermal resistances of 5–7 °C/W. This paper presents designs utilizing the effects of chimney cooling, well developed for other fields that reduce heat sink resistances by significant amounts while meeting all other requirements for bulb system design. Numerical studies and test data show performance of 3–4 °C/W for various orientations including methods for keeping the chimney partially active in horizontal orientations. Significant parameters are also studied with effects upon performance. The simulations are in good agreement with the experimental data. Such chimney-based designs are shown to enable 75 W and 100 W equivalent LED light bulb designs critical for faster penetration of LED systems into general lighting applications.

A Novel Heat Sink for High Power Light Emitting Diode-Phase Change Heat Sink

2011 ◽  
Vol 50-51 ◽  
pp. 278-282
Author(s):  
J.H. Xiang ◽  
Xiao Chu Liu ◽  
Chun Liang Zhang ◽  
Yong Tang
Keyword(s):  
Phase Change ◽  
High Power ◽  
Heat Sink ◽  
Light Emitting Diode ◽  
Internal Surface ◽  
Input Power ◽  
Light Emitting ◽  
Sintered Copper ◽  
Transfer Capability ◽  
Enhanced Boiling

A novel heat sink was fabricated for packaging cooling of high power LED. Enhanced boiling structures in the evaporation surface were processed by ploughing-extrusion (P-E) and stamping methods, respectively. The cycle power of refrigerant was supplied by wick of sintered copper powder on internal surface of phase change heat sink. The experimental results showed that phase change heat sink was provided with a good heat transfer capability and the temperature of phase change heat sink reached 86.8°C under input power of 10W LED at ambient temperature of 20°C.

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