Outsourcing and Performance: Evidence from the Global Semiconductor Industry

2010 ◽  
Author(s):  
Nandini Lahiri ◽  
Sriram Narayanan
Keyword(s):  
Semiconductor Industry ◽  
And Performance

scholarly journals Design, modeling, and performance analysis of a new dispensing system based on compliant mechanism

2020 ◽  
Vol 103 (2) ◽  
pp. 003685042092389
Author(s):  
Junfeng Hu ◽  
Xinying Zhao
Keyword(s):  
Life Science ◽  
Compliant Mechanism ◽  
Semiconductor Industry ◽  
Future Application ◽  
Rapid Manufacturing ◽  
Driving Voltage ◽  
Droplet Volume ◽  
Forming Process ◽  
And Performance ◽  
Good Agreement

Jet dispenser is widely used in microelectronic packaging, semiconductor industry, life science, and rapid manufacturing fields. As the requirement for dispensing accuracy and speed become higher and higher, especially for viscous materials, the traditional mechanisms cannot meet the high precision dispensing. This paper presents a new jetting dispenser using the complaint mechanism with amplifier components to design the dispenser, which gain the motion and force from the elastic deformation of flexible hinges. To describe the mechanical property of the jetting dispenser, the model of the jetting dispenser was built by employing a pseudo-rigid-body method. To predict accurately droplet volume, we established the model by describing the forming process of droplet. Furthermore, the errors of the droplet volume were analyzed based on the model. The prototype of the dispenser was built and the effects of driving voltage, radius of spray chamber, glue supply pressure, glue viscosity, and turn-on time of hammer on the droplet were analyzed experimentally. The analytical results are in good agreement with experimental results, which the advantages of the presented jetting dispenser with a new design concept are validated. This research provided a new idea and modeling method for the future application of the dispensing system.

scholarly journals Between promise and performance: Science and technology policy implementation through network governance

2019 ◽  
Vol 47 (1) ◽  
pp. 78-91 ◽  
Author(s):  
Travis A Whetsell ◽  
Michael J Leiblein ◽  
Caroline S Wagner
Keyword(s):  
Strategic Alliance ◽  
Technology Policy ◽  
Semiconductor Industry ◽  
Science And Technology ◽  
Network Governance ◽  
Science And Technology Policy ◽  
Administrative Organization ◽  
Technological Performance ◽  
Longitudinal Regression ◽  
And Performance

Abstract This research analyzes the effects of US science and technology policy on the technological performance of organizations in a global strategic alliance network. During the mid-1980s, the US semiconductor industry appeared to be collapsing. Industry leaders and policymakers moved to support and protect US firms by creating a program called Sematech. While many scholars regard Sematech as a success, how the program succeeded remains unclear. This study re-contextualizes Sematech as a network administrative organization which lowered cooperation costs and enhanced resource combination for innovation at the cutting edge. This study combines network analysis and longitudinal regression techniques to test the effects of public policy on organizational network position and technological performance in an unbalanced panel of semiconductor firms between 1986 and 2001. This research suggests that governments might achieve policy through inter-organizational innovations aimed at the development and administration of robust governance networks.

INTELLECTUAL CAPITAL AND PERFORMANCE IN THE SEMICONDUCTOR INDUSTRY

2019 ◽  
Vol 65 (05) ◽  
pp. 1323-1348
Author(s):  
KUO-CHENG KUO ◽  
WEN-MIN LU ◽  
GRACE TZU-YI CHANG
Keyword(s):  
Intellectual Capital ◽  
Integrated Circuit ◽  
Semiconductor Industry ◽  
Malmquist Productivity Index ◽  
Productivity Index ◽  
Efficient Production ◽  
Ic Design ◽  
Ic Packaging ◽  
And Performance ◽  
The Relationship

This paper researches a method of rating competitiveness involving the estimation of the performance of semiconductor firms through Malmquist productivity index (MPI) and metafrontier Malmquist productivity index (MMPI). Regressions are used to find the relationship between intellectual capital and performance. Overall, technological innovations contribute to the improvement in the integrated circuit (IC) design sub-industry while increases in efficient production allow the IC foundry sub-industry and the IC packaging and testing sub-industry to maintain position. The regression results show human capital was critical to technological innovation while relational capital was important to efficient production.

scholarly journals Interactive Q-Learning Approach for Pick-and-Place Optimization of the Die Attach Process in the Semiconductor Industry

2019 ◽  
Vol 2019 ◽  
pp. 1-8 ◽  
Author(s):  
Gilseung Ahn ◽  
Myunghwan Park ◽  
You-Jin Park ◽  
Sun Hur
Keyword(s):  
High Performance ◽  
Semiconductor Industry ◽  
Search Time ◽  
Generalization Ability ◽  
Q Learning ◽  
Die Attach ◽  
Metaheuristic Methods ◽  
Pick And Place ◽  
Novel Method ◽  
And Performance

In semiconductor back-end production, the die attach process is one of the most critical steps affecting overall productivity. Optimization of this process can be modeled as a pick-and-place problem known to be NP-hard. Typical approaches are rule-based and metaheuristic methods. The two have high or low generalization ability, low or high performance, and short or long search time, respectively. The motivation of this paper is to develop a novel method involving only the strengths of these methods, i.e., high generalization ability and performance and short search time. We develop an interactive Q-learning in which two agents, a pick agent and a place agent, are trained and find a pick-and-place (PAP) path interactively. From experiments, we verified that the proposed approach finds a shorter path than the genetic algorithm given in previous research.

Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging—A Critical Review

2018 ◽  
Vol 15 (2) ◽  
pp. 63-74
Author(s):  
Dinesh P. R. Thanu ◽  
Boxi Liu ◽  
Marco Aurelio Cartas
Keyword(s):  
Integrated Circuit ◽  
Semiconductor Industry ◽  
Thermal Dissipation ◽  
System Level ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Field Programmable ◽  
Increasing Demand ◽  
And Performance ◽  
Interface Materials

The ever increasing demand for fast computing has led to heterogeneous integration of packages as can be seen in the latest Xeon family segments in the market. Microprocessors are now adjacent to memory chips, transceivers, field-programmable gate arrays, and even other microprocessors within a single substrate. These complex designs have instigated an increase in cooling demand for microprocessors, and hence, there has been an increased focus within the semiconductor industry on developing advance thermal solutions. From the packaging level, thermal interface materials (TIMs) play a key role in thermally connecting various components within the package and helps reduce the thermal resistance between the die surfaces and integrated heat spreaders. From the system level, cooling technology is critical to attain the desired overall thermal dissipation and performance. In this review, progress made in the area of TIMs and system cooling solutions are presented. The focus is on the evolution of TIMs and cooling technologies and their challenges in the integrated circuit packaging. Merits and demerits of various TIM materials available in the commercial market are also discussed. The article will be concluded with some directions for the future that would be potentially very beneficial.

scholarly journals Modeling of Motion Characteristics and Performance Analysis of an Ultra-Precision Piezoelectric Inchworm Motor

Materials ◽  
2020 ◽  
Vol 13 (18) ◽  
pp. 3976
Author(s):  
Bo Zhao ◽  
Ri Fang ◽  
Weijia Shi
Keyword(s):  
Performance Evaluation ◽  
Simulation Model ◽  
Driving Force ◽  
Solid Mechanics ◽  
Semiconductor Industry ◽  
Coupling Model ◽  
Field Coupling ◽  
Motor Design ◽  
Ultra Precision ◽  
And Performance

Ultra-precision piezoelectric inchworm motor (PIM) is widely used in the optical equipment, microelectronics semiconductor industry and precision manufacturing for motion and positioning, but the multi-physics field simulation model for estimating PIM performance and assisting motor design is rarely studied. The simulation model in this paper aimed to provide researchers with direct and convenient PIM performance evaluation to assist the motor design and development. According to the existing advanced inchworm motor products, a multi-physics field coupling model involving solid mechanics and electrostatics using the finite element method (FEM) was established. The motion gesture and performance (driving force and travel) of the PIM were analyzed, respectively. The simulation results showed that the motion gesture of the inchworm motor was well consistent with that of the actual motor product. The driving force from the simulation was close to that of the actual product, and the maximum error was 2.8%. As for the PIM travel, there was a maximum travel error of 0.6 μm between the simulation and official data. The performance parameters of the piezoelectric materials under certain specifications can be simulated by the multi-physics field coupling model. Therefore, the multi-physics field coupling simulation model is suitable for PIM performance evaluation and assisting motor development.

Semiconductor Nano and Micro Membrane Based Pressure Sensors for Wide Bandwidth Measurements

2019 ◽  
Author(s):  
Y. Kang ◽  
R. Sibold ◽  
M. Homer ◽  
L. Gladwin ◽  
R. Claus ◽  
...  
Keyword(s):  
Wind Tunnel ◽  
Semiconductor Industry ◽  
Electronic Devices ◽  
Pressure Sensors ◽  
Sensor Arrays ◽  
Reynolds Numbers ◽  
Full Spectrum ◽  
Highly Sensitive ◽  
Small Feature ◽  
And Performance

Abstract Semiconductor nano&micro membranes (NMMs) are gaining acceptance in the semiconductor industry as the benefits they provide become key enablers in scaling and performance enhancements of electronic devices. These tailored-modulus conformal NMM sensor skins with integrated interconnect elements and electronic devices can be applied to new or existing wind tunnel models for full spectrum pressure monitoring. The material is resistant to normal fluids and solvents, can potentially operate over a wide temperature range, and is capable of withstanding erosion. Experimental data presented in this paper demonstrates that: 1) silicon NMMs may be used as single pressure sensor transducers and elements in sensor arrays, and 2) the arrays may be instrumented to map pressure over the surfaces of test articles over a range of Reynolds numbers, temperature and other environmental conditions. Of most importance, we have 1) shown that the small-feature-size sensor elements are highly sensitive to pressure (frequency response from DC up to 5MHz), 2) developed several types of sensor packages for the demonstration of pressure sensing with a miniature probe tip, and 3) confirmed operation in wind tunnel and shock tube tests over 100 times up to Mach 4.2 on several test articles.

Sign in / Sign up

Export Citation Format

Share Document