Microfabrication Techniques for Plastic Microelectromechanical Systems (MEMS)

2003 ◽  
Author(s):  
C. H. Mastrangelo
Keyword(s):  
Microelectromechanical Systems ◽  
Microfabrication Techniques

scholarly journals A MEMS Ultra-Wideband (UWB) Power Sensor with a Fe-Co-B Core Planar Inductor and a Vibrating Diaphragm Capacitor

Sensors ◽  
2021 ◽  
Vol 21 (11) ◽  
pp. 3858
Author(s):  
Sujitha Vejella ◽  
Sazzadur Chowdhury
Keyword(s):  
Microelectromechanical Systems ◽  
Ultra Wideband ◽  
Induced Voltage ◽  
Adhesively Bonded ◽  
Capacitance Change ◽  
Frequency Independent ◽  
Power Sensor ◽  
Footprint Area ◽  
Microfabrication Techniques ◽  
2D Array

The design of a microelectromechanical systems (MEMS) ultra-wideband (UWB) RMS power sensor is presented. The sensor incorporates a microfabricated Fe-Co-B core planar inductor and a microfabricated vibrating diaphragm variable capacitor on adhesively bonded glass wafers in a footprint area of 970 × 970 µm2 to operate in the 3.1–10.6 GHz UWB frequency range. When exposed to a far-field UWB electromagnetic radiation, the planar inductor acts as a loop antenna to generate a frequency-independent voltage across the MEMS capacitor. The voltage generates a coulombic attraction force between the diaphragm and backplate that deforms the diaphragm to change the capacitance. The frequency-independent capacitance change is sensed using a transimpedance amplifier to generate an output voltage. The sensor exhibits a linear capacitance change induced voltage relation and a calculated sensitivity of 4.5 aF/0.8 µA/m. The sensor can be used as a standalone UWB power sensor or as a 2D array for microwave-based biomedical diagnostic imaging applications or for non-contact material characterization. The device can easily be tailored for power sensing in other application areas such as, 5G, WiFi, and Internet-of-Things (IoT). The foreseen fabrication technique can rely on standard readily available microfabrication techniques.

scholarly journals Gold-implanted plasmonic quartz plate as a launch pad for laser-driven photoacoustic microfluidic pumps

2019 ◽  
Vol 116 (14) ◽  
pp. 6580-6585 ◽  
Author(s):  
Shuai Yue ◽  
Feng Lin ◽  
Qiuhui Zhang ◽  
Njumbe Epie ◽  
Suchuan Dong ◽  
...  
Keyword(s):  
High Speed ◽  
Microelectromechanical Systems ◽  
Acoustic Streaming ◽  
Fluid Motion ◽  
Quartz Plate ◽  
Ultrasound Wave ◽  
High Speed Imaging ◽  
Driving Mechanisms ◽  
Easy Integration ◽  
Microfabrication Techniques

Enabled initially by the development of microelectromechanical systems, current microfluidic pumps still require advanced microfabrication techniques to create a variety of fluid-driving mechanisms. Here we report a generation of micropumps that involve no moving parts and microstructures. This micropump is based on a principle of photoacoustic laser streaming and is simply made of an Au-implanted plasmonic quartz plate. Under a pulsed laser excitation, any point on the plate can generate a directional long-lasting ultrasound wave which drives the fluid via acoustic streaming. Manipulating and programming laser beams can easily create a single pump, a moving pump, and multiple pumps. The underlying pumping mechanism of photoacoustic streaming is verified by high-speed imaging of the fluid motion after a single laser pulse. As many light-absorbing materials have been identified for efficient photoacoustic generation, photoacoustic micropumps can have diversity in their implementation. These laser-driven fabrication-free micropumps open up a generation of pumping technology and opportunities for easy integration and versatile microfluidic applications.

Microfabrication of Crevice Corrosion Samples

2000 ◽  
Vol 657 ◽  
Author(s):  
Xiaoyan Wang ◽  
Robert G. Kelly ◽  
Jason S. Lee ◽  
Michael L. Reed
Keyword(s):  
Crevice Corrosion ◽  
Computational Models ◽  
Microelectromechanical Systems ◽  
Spatial Information ◽  
Semiconductor Device ◽  
Device Fabrication ◽  
Metal Electrodes ◽  
Electrical Connections ◽  
Microfabrication Techniques

ABSTRACTA major challenge in developing computer models for crevice corrosion lies in fabricating appropriate experimental crevice samples. The geometry and dimensions of these samples must be controlled to a high order of precision in order to be amenable for comparison to computational models. In this work we report an effort to construct crevice samples with rigorously defined dimensions by using microfabrication techniques developed for microelectromechanical systems (MEMS). These techniques include microfabrication with SU- 8, electroplating, and other standard semiconductor device fabrication techniques as well. The crevice substrates contain one-dimensional arrays of metal electrodes to be studied, which are isolated by walls of SU-8. The electrodes have individual electrical connections so that spatial information of the in-situ corrosion process can be obtained. The crevice formers with SU-8 posts were coupled to crevice substrates to maintain a uniform crevice gap. Further, crevice formers with regular rectangular subcrevices were fabricated to study the roles of subcrevices in crevice corrosion.

Charge Trapping and Degradation Properties of PZT Thin Films for MEMS

1996 ◽  
Vol 444 ◽  
Author(s):  
Hyeon-Seag Kim ◽  
D. L. Polla ◽  
S. A. Campbell
Keyword(s):  
Thin Films ◽  
Loss Factor ◽  
High Field ◽  
Microelectromechanical Systems ◽  
Charge Trapping ◽  
Metal Organic ◽  
Electrical Reliability ◽  
Silicon Based ◽  
Degradation Properties ◽  
Organic Decomposition

AbstractThe electrical reliability properties of PZT (54/46) thin films have been measured for the purpose of integrating this material with silicon-based microelectromechanical systems. Ferroelectric thin films of PZT were prepared by metal organic decomposition. The charge trapping and degradation properties of these thin films were studied through device characteristics such as hysteresis loop, leakage current, fatigue, dielectric constant, capacitancevoltage, and loss factor measurements. Several unique experimental results have been found. Different degradation processes were verified through fatigue (bipolar stress), low and high charge injection (unipolar stress), and high field stressing (unipolar stress).

Development perspective microelectromechanical systems (MEMS)by methods of semi-real simulation

2006 ◽  
Vol 4 ◽  
pp. 288-305
Author(s):  
A.B. Migranov
Keyword(s):  
Virtual Environment ◽  
Microelectromechanical Systems ◽  
Testing And Debugging ◽  
Development Perspective

The article deals with the issues related to the construction of microelectromechanical systems (MEMS), and the problems arising from their manufacture. Particular attention is paid to micromechanical parts of robot, which were developed by methods of semi-simulation using the virtual environment for designing, testing and debugging MEMS.

Embedded Microelectromechanical Systems (MEMS) for Measuring Strain in Composites

2000 ◽  
Vol 19 (4) ◽  
pp. 268-277 ◽  
Author(s):  
CHARLES HAUTAMAKI ◽  
SHAYNE ZURN ◽  
SUSAN C. MANTELL ◽  
DENNIS L. POLLA
Keyword(s):  
Microelectromechanical Systems

scholarly journals Coulomb-actuated microbeams revisited: experimental and numerical modal decomposition of the saddle-node bifurcation

2021 ◽  
Vol 7 (1) ◽  
Author(s):  
Anton Melnikov ◽  
Hermann A. G. Schenk ◽  
Jorge M. Monsalve ◽  
Franziska Wall ◽  
Michael Stolz ◽  
...  
Keyword(s):  
Finite Element ◽  
Microelectromechanical Systems ◽  
Dynamic Range ◽  
Dynamic Performance ◽  
Major Step ◽  
Element Analysis ◽  
Electrostatic Actuators ◽  
Voltage Range ◽  
Drive Voltage ◽  
Depth Analysis

AbstractElectrostatic micromechanical actuators have numerous applications in science and technology. In many applications, they are operated in a narrow frequency range close to resonance and at a drive voltage of low variation. Recently, new applications, such as microelectromechanical systems (MEMS) microspeakers (µSpeakers), have emerged that require operation over a wide frequency and dynamic range. Simulating the dynamic performance under such circumstances is still highly cumbersome. State-of-the-art finite element analysis struggles with pull-in instability and does not deliver the necessary information about unstable equilibrium states accordingly. Convincing lumped-parameter models amenable to direct physical interpretation are missing. This inhibits the indispensable in-depth analysis of the dynamic stability of such systems. In this paper, we take a major step towards mending the situation. By combining the finite element method (FEM) with an arc-length solver, we obtain the full bifurcation diagram for electrostatic actuators based on prismatic Euler-Bernoulli beams. A subsequent modal analysis then shows that within very narrow error margins, it is exclusively the lowest Euler-Bernoulli eigenmode that dominates the beam physics over the entire relevant drive voltage range. An experiment directly recording the deflection profile of a MEMS microbeam is performed and confirms the numerical findings with astonishing precision. This enables modeling the system using a single spatial degree of freedom.

scholarly journals A Low-g MEMS Accelerometer with High Sensitivity, Low Nonlinearity and Large Dynamic Range Based on Mode-Localization of 3-DoF Weakly Coupled Resonators

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 310
Author(s):  
Muhammad Mubasher Saleem ◽  
Shayaan Saghir ◽  
Syed Ali Raza Bukhari ◽  
Amir Hamza ◽  
Rana Iqtidar Shakoor ◽  
...  
Keyword(s):  
Microelectromechanical Systems ◽  
Dynamic Range ◽  
Proof Mass ◽  
Amplitude Ratio ◽  
Silicon On Insulator ◽  
Coupled Resonators ◽  
Mode Localization ◽  
Mems Accelerometer ◽  
Weakly Coupled ◽  
Input Acceleration

This paper presents a new design of microelectromechanical systems (MEMS) based low-g accelerometer utilizing mode-localization effect in the three degree-of-freedom (3-DoF) weakly coupled MEMS resonators. Two sets of the 3-DoF mechanically coupled resonators are used on either side of the single proof mass and difference in the amplitude ratio of two resonator sets is considered as an output metric for the input acceleration measurement. The proof mass is electrostatically coupled to the perturbation resonators and for the sensitivity and input dynamic range tuning of MEMS accelerometer, electrostatic electrodes are used with each resonator in two sets of 3-DoF coupled resonators. The MEMS accelerometer is designed considering the foundry process constraints of silicon-on-insulator multi-user MEMS processes (SOIMUMPs). The performance of the MEMS accelerometer is analyzed through finite-element-method (FEM) based simulations. The sensitivity of the MEMS accelerometer in terms of amplitude ratio difference is obtained as 10.61/g for an input acceleration range of ±2 g with thermomechanical noise based resolution of 0.22 and nonlinearity less than 0.5%.

Stability of Ring-Type MEMS Gyroscopes Subjected to Stochastic Angular Speed Fluctuation

2017 ◽  
Vol 139 (4) ◽  
Author(s):  
Samuel F. Asokanthan ◽  
Soroush Arghavan ◽  
Mohamed Bognash
Keyword(s):  
Angular Velocity ◽  
Degrees Of Freedom ◽  
Microelectromechanical Systems ◽  
Damping Ratio ◽  
Operating Conditions ◽  
System Stability ◽  
System Response ◽  
Ring Type ◽  
Mems Gyroscopes ◽  
The Stability

Effect of stochastic fluctuations in angular velocity on the stability of two degrees-of-freedom ring-type microelectromechanical systems (MEMS) gyroscopes is investigated. The governing stochastic differential equations (SDEs) are discretized using the higher-order Milstein scheme in order to numerically predict the system response assuming the fluctuations to be white noise. Simulations via Euler scheme as well as a measure of largest Lyapunov exponents (LLEs) are employed for validation purposes due to lack of similar analytical or experimental data. The response of the gyroscope under different noise fluctuation magnitudes has been computed to ascertain the stability behavior of the system. External noise that affect the gyroscope dynamic behavior typically results from environment factors and the nature of the system operation can be exerted on the system at any frequency range depending on the source. Hence, a parametric study is performed to assess the noise intensity stability threshold for a number of damping ratio values. The stability investigation predicts the form of threshold fluctuation intensity dependence on damping ratio. Under typical gyroscope operating conditions, nominal input angular velocity magnitude and mass mismatch appear to have minimal influence on system stability.

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