Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conductive Anodic Filament Formation

2001 ◽  
Author(s):  
Laura J. Turbini ◽  
Stuart R. Stock
Keyword(s):  
Filament Formation ◽  
Conductive Anodic Filament ◽  
Conformal Coatings

Design limitations related to conductive anodic filament formation in a micro-world

2008 ◽  
Vol 15 (1) ◽  
pp. 39-44 ◽  
Author(s):  
Antonio Caputo ◽  
Laura J. Turbini ◽  
Doug D. Perovic
Keyword(s):  
Filament Formation ◽  
Conductive Anodic Filament

Failure Localization of Intermittent Short Failures Caused by Vertical Conductive Anodic Filament Formation

2014 ◽  
Author(s):  
Daniel Nuez ◽  
Phoumra Tan
Keyword(s):  
Glass Fibers ◽  
Vertical Plane ◽  
Axis Formation ◽  
Metal Trace ◽  
Conductive Anodic Filament ◽  
Plated Through Hole ◽  
Voltage Gradients ◽  
Ic Package ◽  
Through Hole ◽  
Failure Localization

Abstract Conductive anodic filament (CAF) formation is a mechanism caused by an electrochemical migration of metals from a metal trace in ICs or in PCBs. This is commonly caused by the moisture build-up in the affected metal terminals in an IC package or PC board caused by critical temperature, high humidity and high voltage gradients conditions. This phenomenon is known to have caused catastrophic field failures on various OEMs electronic components in the past [1,7]. Most published articles on CAF described the formation of the filament in a lateral formation through the glass fiber interfaces between two adjacent metal planes [1-6, 8-12]. One common example is the CAF formation seen between PTH (Plated through Hole) in the laminated substrate with two different potentials causing shorts [1-6, 8-12]. In this paper, the Cu filament grows in a vertical fashion (z-axis formation) creating a vertical plane shorts between the upper and lower metal terminals in a laminated IC package substrate. The copper growth migration does not follow the fiber strands laterally or vertically through them. Instead, it grows through the stress created gaps between the impregnated carbon epoxy fillers from the upper metal trace to the lower metal trace with two different potentials, between the glass fibers. This vertical CAF mechanism creates a low resistive short that was sometimes found to be intermittent in nature. This paper presents some successful failure analysis approaches used to isolate and detect the failure locations for this type of failing devices. This paper also exposes the unique physical appearance of the vertical CAF formation.

Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Michael Pecht
Keyword(s):  
Flame Retardants ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Lead Free ◽  
Circuit Boards ◽  
Filament Formation ◽  
Conductive Filament ◽  
Printed Circuit ◽  
Free Solder ◽  
Halogen Free

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.

Sign in / Sign up

Export Citation Format

Share Document