Dynamic Failure of Materials. Volume 1 - Experiments and Analyses

1998 ◽  
Author(s):  
Tarabay H. Antoun ◽  
Lynn Seaman ◽  
Donald R. Curran
Keyword(s):  
Dynamic Failure

Test Circuit Conditioning for Soft Defect Localization

2014 ◽  
Author(s):  
Kristopher D. Staller ◽  
Corey Goodrich
Keyword(s):  
Laser Beam ◽  
Failure Analysis ◽  
Signal Frequency ◽  
Dynamic Failure ◽  
The Third ◽  
Analysis Technique ◽  
Test Circuit ◽  
Defect Localization ◽  
Manual Input ◽  
Fast Dynamic

Abstract Soft Defect Localization (SDL) is a dynamic laser-based failure analysis technique that can detect circuit upsets (or cause a malfunctioning circuit to recover) by generation of localized heat or photons from a rastered laser beam. SDL is the third and seldom used method on the LSM tool. Most failure analysis LSM sessions use the endo-thermic mode (TIVA, XIVA, OBIRCH), followed by the photo-injection mode (LIVA) to isolate most of their failures. SDL is seldom used or attempted, unless there is a unique and obvious failure mode that can benefit from the application. Many failure analysts, with a creative approach to the analysis, can employ SDL. They will benefit by rapidly finding the location of the failure mechanism and forgoing weeks of nodal probing and isolation. This paper will cover circuit signal conditioning to allow for fast dynamic failure isolation using an LSM for laser stimulation. Discussions of several cases will demonstrate how the laser can be employed for triggering across a pass/fail boundary as defined by voltage levels, supply currents, signal frequency, or digital flags. A technique for manual input of the LSM trigger is also discussed.

Robust design under cumulative damage due to dynamic failure mechanisms

2021 ◽  
Author(s):  
Avner Engel ◽  
Amit Teller ◽  
Shalom Shachar ◽  
Yoram Reich
Keyword(s):  
Robust Design ◽  
Failure Mechanisms ◽  
Cumulative Damage ◽  
Dynamic Failure
Sign in / Sign up

Export Citation Format

Share Document