Influences of temperature and impacting velocity on dynamic failure of laminated glass: Insights from peridynamic simulations

The work of multilayer glass structures for central and eccentric compression and bending are considered. The substantiation of the chosen research topic is made. The description and features of laminated glass for the structures investigated, their characteristics are presented. The analysis of the results obtained when testing for compression, compression with bending, simple bending of models of columns, beams, samples of laminated glass was made. Overview of the types and nature of destruction of the models are presented, diagrams of material operation are constructed, average values of the resistance of the cross-sections of samples are obtained, the table of destructive loads is generated. The need for development of a set of rules and guidelines for the design of glass structures, including laminated glass, for bearing elements, as well as standards for testing, rules for assessing the strength, stiffness, crack resistance and methods for determining the strength of control samples is emphasized. It is established that the strength properties of glass depend on the type of applied load and vary widely, and significantly lower than the corresponding normative values of the strength of heat-strengthened glass. The effect of the connecting polymeric material and manufacturing technology of laminated glass on the strength of the structure is also shown. The experimental values of the elastic modulus are different in different directions of the cross section and in the direction perpendicular to the glass layers are two times less than along the glass layers.

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PERTURBATION-BASED SURROGATE MODELS FOR DYNAMIC FAILURE OF BRITTLE MATERIALS IN A MULTISCALE AND PROBABILISTIC CONTEXT

International Journal for Multiscale Computational Engineering ◽

10.1615/intjmultcompeng.2016015857 ◽

2016 ◽

Vol 14 (3) ◽

pp. 273-290 ◽

Cited By ~ 1

Author(s):

Junwei Liu ◽

Lori Graham-Brady

Keyword(s):

Brittle Materials ◽

Surrogate Models ◽

Dynamic Failure ◽

Probabilistic Context

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Test Circuit Conditioning for Soft Defect Localization

ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2014p0396 ◽

2014 ◽

Author(s):

Kristopher D. Staller ◽

Corey Goodrich

Keyword(s):

Laser Beam ◽

Failure Analysis ◽

Signal Frequency ◽

Dynamic Failure ◽

The Third ◽

Analysis Technique ◽

Test Circuit ◽

Defect Localization ◽

Manual Input ◽

Fast Dynamic

Abstract Soft Defect Localization (SDL) is a dynamic laser-based failure analysis technique that can detect circuit upsets (or cause a malfunctioning circuit to recover) by generation of localized heat or photons from a rastered laser beam. SDL is the third and seldom used method on the LSM tool. Most failure analysis LSM sessions use the endo-thermic mode (TIVA, XIVA, OBIRCH), followed by the photo-injection mode (LIVA) to isolate most of their failures. SDL is seldom used or attempted, unless there is a unique and obvious failure mode that can benefit from the application. Many failure analysts, with a creative approach to the analysis, can employ SDL. They will benefit by rapidly finding the location of the failure mechanism and forgoing weeks of nodal probing and isolation. This paper will cover circuit signal conditioning to allow for fast dynamic failure isolation using an LSM for laser stimulation. Discussions of several cases will demonstrate how the laser can be employed for triggering across a pass/fail boundary as defined by voltage levels, supply currents, signal frequency, or digital flags. A technique for manual input of the LSM trigger is also discussed.

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