Highly Transient Elastodynamic Crack Growth in a Bimaterial Interface: Higher Order Asymptotic Analysis and Optical Experiments

1992 ◽  
Author(s):  
Cheng Liu ◽  
John Lambros ◽  
Ares J. Rosakis
Keyword(s):  
Asymptotic Analysis ◽  
Crack Growth ◽  
Higher Order ◽  
Bimaterial Interface

The Higher Order Asymptotic Fields for Plane Interfacial Crack with Physical Weak-Discontinuity

2011 ◽  
Vol 217-218 ◽  
pp. 1314-1318
Author(s):  
Yao Dai ◽  
Lei Zhang ◽  
Peng Zhang ◽  
Jun Feng Liu
Keyword(s):  
Experimental Investigation ◽  
Numerical Analysis ◽  
Asymptotic Analysis ◽  
Theoretical Basis ◽  
Engineering Application ◽  
Interfacial Crack ◽  
Higher Order ◽  
Weak Discontinuity ◽  
Displacement Method ◽  
Asymptotic Fields

The higher order discontinuous asymptotic fields which are similar to the Williams’ solutions of homogenous material are obtained by the displacement method and asymptotic analysis for a plane crack at the physical weak-discontinuous interface in non-homogeneous materials. The results provide a theoretical basis for the numerical analysis, experimental investigation and the engineering application of physical weak-discontinuous fracture.

scholarly journals An approach to analysis of dynamic crack growth at bimaterial interface

2009 ◽  
Vol 36 (4) ◽  
pp. 299-327 ◽  
Author(s):  
R. Nikolic ◽  
Jelena Djokovic
Keyword(s):  
Asymptotic Analysis ◽  
Strain Field ◽  
Crack Tip ◽  
Optical Data ◽  
Bimaterial Interface ◽  
Dynamic Crack ◽  
New Approach ◽  
Shear Wave Speed ◽  
Propagating Crack

In this paper is presented the new approach to asymptotic analysis of the stress and strain fields around a crack tip that is propagating dynamically along a bimaterial interface. Through asymptotic analysis the problem is being reduced to solving the Riemann-Hilbert's problem, what yields the strain potential that is used for determination of the strain field around a crack tip. The considered field is that of a dynamically propagating crack with a speed that is between zero and shear wave speed of the less stiffer of the two materials, bound along the interface. Using the new approach in asymptotic analysis of the strain field around a tip of a dynamically propagating crack and possibilities offered by the Mathematica programming package, the results are obtained that are compared to both experimental and numerical results on the dynamic interfacial fracture known from the literature. This comparison showed that it is necessary to apply the complete expression obtained by asymptotic analysis of optical data and not only its first term as it was done in previous analyses.

Automatic crack growth tracking of bimaterial interface cracks

1988 ◽  
Vol 37 (2) ◽  
pp. 123-135
Author(s):  
Nabil A. B. Yehia ◽  
Mark S. Shephard
Keyword(s):  
Crack Growth ◽  
Bimaterial Interface ◽  
Interface Cracks

Diffusive Crack Growth at a Bimaterial Interface

1996 ◽  
Vol 63 (3) ◽  
pp. 796-803 ◽  
Author(s):  
Tze-jer Chuang ◽  
June-Liang Chu ◽  
Sanboh Lee
Keyword(s):  
Tensile Stress ◽  
Crack Growth ◽  
Crack Tip ◽  
Ceramic Composites ◽  
Bimaterial Interface ◽  
Self Diffusion ◽  
Interfacial Sliding ◽  
Stress Solution ◽  
Microcrack Growth ◽  
Loading Parameter

The high temperature microcrack growth behavior along a planar interface between two elastic dissimilar media is investigated with an aim at estimating service life of advanced ceramic composites under creep-rupture conditions. The crack is assumed to grow along the interface normal to a remote applied tensile stress via a coupled surface and grain-boundary diffusion under steady-state creep conditions. The crack-tip conditions were first derived from the asymmetric tip morphology developed by surface self-diffusion. The governing integro-differential equation containing the unknown tensile stress distribution along the interface ahead of the moving crack tip was derived and it was found that a new length parameter exists as a scaling factor for the interface for which the solution becomes identical to that of the single-phase media when plotted on the nondimensional physical plane. In contrast to the elastic stress solution which shows singularity at the tip and oscillatory character away from the tip, the creep stresses have a peak value away from the tip due to a wedging effect and interfacial sliding eliminates stress oscillation resulting in a decoupling between mode I and mode II stress fields. This stress solution ties the far-field loading parameter to the crack-tip conditions in terms of the unknown crack velocity to give a specific V-K functional relationship. It was shown that a stress exponent of 12 in the conventional power-law crack growth emerges at higher applied stress levels. An analysis on energy balance shows that the energy release during crack growth amounts to the J-integral which derives mostly from work done by “wedging,” not from strain energy loss. A constraint on interfacial diffusivities of the two species was found and its implications on possible microstructural developments were discussed.

A Finite Element Analysis of Mode III Quasi-Static Crack Growth at a Ductile-Brittle Interface

1996 ◽  
Vol 63 (1) ◽  
pp. 204-209 ◽  
Author(s):  
S. Omprakash ◽  
R. Narasimhan
Keyword(s):  
Finite Element ◽  
Crack Growth ◽  
Power Law ◽  
Plastic Material ◽  
Bimaterial Interface ◽  
Mode Iii ◽  
Elastic Substrate ◽  
Elastic Plastic ◽  
Static Crack ◽  
Elastic Plastic Material

Steady-state quasi-static crack growth along a bimaterial interface is analyzed under Mode III, small-scale yielding conditions using a finite element procedure. The interface is formed by an elastic-plastic material and an elastic substrate. The top elastic-plastic material is assumed to obey the J2 incremental theory of plasticity. It undergoes isotropic hardening with either a bilinear uniaxial response or a power-law response. The results obtained from the full-field numerical analysis compare very well with the analytical asymptotic results obtained by Castan˜eda and Mataga (1991), which forms one of the first studies on this subject. The validity of the separable form for the asymptotic solution assumed in their analysis is investigated. The range of dominance of the asymptotic fields is examined. Field variations are obtained for a power-law hardening elastic-plastic material. It is seen that the stresses are lower for a stiffer substrate. The potential of the bimaterial system to sustain slow stable crack growth along the interface is studied. It is found that the above potential is larger if the elastic substrate is more rigid with respect to the elastic-plastic material.

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