scholarly journals A Device to Determine the Out-of-Plane Displacement of a Surface Using a Moire Fringe Technique.

1981 ◽  
Author(s):  
Andrew J. Piekutowski
Keyword(s):  
Out Of Plane ◽  
Moire Fringe ◽  
Moiré Fringe ◽  
Plane Displacement

Simulation and Contrast Analysis of tem Images of Cracks

1990 ◽  
Vol 48 (1) ◽  
pp. 578-579
Author(s):  
D. Goyal ◽  
A. H. King
Keyword(s):  
Displacement Vector ◽  
Crack Tip ◽  
Perfect Crystal ◽  
Operating Conditions ◽  
Displacement Fields ◽  
Fringe Contrast ◽  
Orthogonal Geometry ◽  
Moire Fringe ◽  
Moiré Fringe

TEM images of cracks have been found to give rise to a moiré fringe type of contrast. It is apparent that the moire fringe contrast is observed because of the presence of a fault in a perfect crystal, and is characteristic of the fault geometry and the diffracting conditions in the TEM. Various studies have reported that the moire fringe contrast observed due to the presence of a crack in an otherwise perfect crystal is distinctive of the mode of crack. This paper describes a technique to study the geometry and mode of the cracks by comparing the images they produce in the TEM because of the effect that their displacement fields have on the diffraction of electrons by the crystal (containing a crack) with the corresponding theoretical images. In order to formulate a means of matching experimental images with theoretical ones, displacement fields of dislocations present (if any) in the vicinity of the crack are not considered, only the effect of the displacement field of the crack is considered.The theoretical images are obtained using a computer program based on the two beam approximation of the dynamical theory of diffraction contrast for an imperfect crystal. The procedures for the determination of the various parameters involved in these computations have been well documented. There are three basic modes of crack. Preliminary studies were carried out considering the simplest form of crack geometries, i. e., mode I, II, III and the mixed modes, with orthogonal crack geometries. It was found that the contrast obtained from each mode is very distinct. The effect of variation of operating conditions such as diffracting vector (), the deviation parameter (ω), the electron beam direction () and the displacement vector were studied. It has been found that any small change in the above parameters can result in a drastic change in the contrast. The most important parameter for the matching of the theoretical and the experimental images was found to be the determination of the geometry of the crack under consideration. In order to be able to simulate the crack image shown in Figure 1, the crack geometry was modified from a orthogonal geometry to one with a crack tip inclined to the original crack front. The variation in the crack tip direction resulted in the variation of the displacement vector also. Figure 1 is a cross-sectional micrograph of a silicon wafer with a chromium film on top, showing a crack in the silicon.

scholarly journals Sensor Integrated Load-Bearing Structures: Measuring Axis Extension with DIC-Based Transducers

Sensors ◽  
2021 ◽  
Vol 21 (12) ◽  
pp. 4104
Author(s):  
Nassr Al-Baradoni ◽  
Peter Groche
Keyword(s):  
Cost Effective ◽  
Image Correlation ◽  
Maximum Deviation ◽  
Single Image ◽  
Eccentric Load ◽  
Load Bearing ◽  
Out Of Plane ◽  
Axis Extension ◽  
Plane Displacement ◽  
Imaging Sensor

In this paper we present a novel, cost-effective camera-based multi-axis force/torque sensor concept for integration into metallic load-bearing structures. A two-part pattern consisting of a directly incident and mirrored light beam is projected onto the imaging sensor surface. This allows the capturing of 3D displacements, occurring due to structure deformation under load in a single image. The displacement of defined features in size and position can be accurately analyzed and determined through digital image correlation (DIC). Validation on a prototype shows good accuracy of the measurement and a unique identification of all in- and out-of-plane displacement components under multiaxial load. Measurements show a maximum deviation related to the maximum measured values between 2.5% and 4.8% for uniaxial loads ( and between 2.5% and 10.43% for combined bending, torsion and axial load. In the course of the investigations, the measurement inaccuracy was partly attributed to the joint used between the sensor parts and the structure as well as to eccentric load.

An automatic high-speed scanner for moiré fringe techniques

1972 ◽  
Vol 7 (2) ◽  
pp. 151-156 ◽  
Author(s):  
D J Hitchings ◽  
A R Luxmoore
Keyword(s):  
High Speed ◽  
Peak Detection ◽  
Optical Signal ◽  
Single Line ◽  
Scanning System ◽  
Moiré Fringes ◽  
Moire Fringe ◽  
Scanning Line ◽  
Moiré Fringe

A high-speed scanning system has been developed to locate the centres of moiré fringes along any single line. The system comprises a rotating-mirror scanner for conversion of an optical signal to electrical; this conversion is followed by peak detection, storage, and print-out electronics. Up to 20 fringes can be scanned in 1 ms. The results are printed in terms of fringe separations along the scanning line.

scholarly journals Locally Corroded Stiffener Effect on Shear Buckling Behaviors of Web Panel in the Plate Girder

2015 ◽  
Vol 2015 ◽  
pp. 1-19 ◽  
Author(s):  
Jungwon Huh ◽  
In-Tae Kim ◽  
Jin-Hee Ahn
Keyword(s):  
Corrosion Damage ◽  
Element Analysis ◽  
Buckling Strength ◽  
Lower Shear ◽  
Out Of Plane ◽  
Shear Buckling ◽  
Buckling Failure ◽  
Plane Displacement ◽  
The Web ◽  
Plate Girder

The shear buckling failure and strength of a web panel stiffened by stiffeners with corrosion damage were examined according to the degree of corrosion of the stiffeners, using the finite element analysis method. For this purpose, a plate girder with a four-panel web girder stiffened by vertical and longitudinal stiffeners was selected, and its deformable behaviors and the principal stress distribution of the web panel at the shear buckling strength of the web were compared after their post-shear buckling behaviors, as well as their out-of-plane displacement, to evaluate the effect of the stiffener in the web panel on the shear buckling failure. Their critical shear buckling load and shear buckling strength were also examined. The FE analyses showed that their typical shear buckling failures were affected by the structural relationship between the web panel and each stiffener in the plate girder, to resist shear buckling of the web panel. Their critical shear buckling loads decreased from 82% to 59%, and their shear buckling strength decreased from 88% to 76%, due to the effect of corrosion of the stiffeners on their shear buckling behavior. Thus, especially in cases with over 40% corrosion damage of the vertical stiffener, they can have lower shear buckling strength than their design level.

Mechanism of the Transition From In-Plane Buckling to Helical Buckling for a Stiff Nanowire on an Elastomeric Substrate

2016 ◽  
Vol 83 (4) ◽  
Author(s):  
Youlong Chen ◽  
Yong Zhu ◽  
Xi Chen ◽  
Yilun Liu
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Stretchable Electronics ◽  
Buckling Mode ◽  
Design And Optimization ◽  
Out Of Plane ◽  
Plane Direction ◽  
Plane Displacement ◽  
Helical Buckling ◽  
Selection Of

In this work, the compressive buckling of a nanowire partially bonded to an elastomeric substrate is studied via finite-element method (FEM) simulations and experiments. The buckling profile of the nanowire can be divided into three regimes, i.e., the in-plane buckling, the disordered buckling in the out-of-plane direction, and the helical buckling, depending on the constraint density between the nanowire and the substrate. The selection of the buckling mode depends on the ratio d/h, where d is the distance between adjacent constraint points and h is the helical buckling spacing of a perfectly bonded nanowire. For d/h > 0.5, buckling is in-plane with wavelength λ = 2d. For 0.27 < d/h < 0.5, buckling is disordered with irregular out-of-plane displacement. While, for d/h < 0.27, buckling is helical and the buckling spacing gradually approaches to the theoretical value of a perfectly bonded nanowire. Generally, the in-plane buckling induces smaller strain in the nanowire, but consumes the largest space. Whereas the helical mode induces moderate strain in the nanowire, but takes the smallest space. The study may shed useful insights on the design and optimization of high-performance stretchable electronics and three-dimensional complex nanostructures.

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