THE MECHANICAL PROPERTIES OF COPPER AT HIGH STRAIN RATES. VOLUME 1. THE EFFECT OF STRAIN RATE ON THE FLOW STRESS OF COPPER

1966 ◽  
Author(s):  
J. D. Lubahn ◽  
R. C. Culver ◽  
R. L. Straw
Keyword(s):  
Mechanical Properties ◽  
Flow Stress ◽  
Strain Rate ◽  
High Strain ◽  
Strain Rates ◽  
High Strain Rates

Comparative Study of the Dynamic Behavior of AA2519 Aluminum Alloy in T6 and T8 Temper Conditions

2019 ◽  
Author(s):  
Adewale Olasumboye ◽  
Gbadebo Owolabi ◽  
Olufemi Koya ◽  
Horace Whitworth ◽  
Nadir Yilmaz
Keyword(s):  
Plastic Deformation ◽  
Aluminum Alloy ◽  
Stress Response ◽  
Flow Stress ◽  
Yield Strength ◽  
Strain Rate ◽  
High Strain ◽  
Second Phase ◽  
Strain Rates ◽  
High Strain Rates

Abstract This study investigates the dynamic response of AA2519 aluminum alloy in T6 temper condition during plastic deformation at high strain rates. The aim was to determine how the T6 temper condition affects the flow stress response, strength properties and microstructural morphologies of the alloy when impacted under compression at high strain rates. The specimens (with aspect ratio, L/D = 0.8) of the as-cast alloy used were received in the T8 temper condition and further heat-treated to the T6 temper condition based on the standard ASTM temper designation procedures. Split-Hopkinson pressure bar experiment was used to generate true stress-strain data for the alloy in the range of 1000–3500 /s strain rates while high-speed cameras were used to monitor the test compliance with strain-rate constancy measures. The microstructures of the as received and deformed specimens were assessed and compared for possible disparities in their initial microstructures and post-deformation changes, respectively, using optical microscopy. Results showed no clear evidence of strain-rate dependency in the dynamic yield strength behavior of T6-temper designated alloy while exhibiting a negative trend in its flow stress response. On the contrary, AA2519-T8 showed marginal but positive response in both yield strength and flow behavior for the range of strain rates tested. Post-deformation photomicrographs show clear disparities in the alloys’ initial microstructures in terms of the second-phase particle size differences, population density and, distribution; and in the morphological changes which occurred in the microstructures of the different materials during large plastic deformation. AA2519-T6 showed a higher susceptibility to adiabatic shear localization than AA2519-T8, with deformed and bifurcating transformed band occurring at 3000 /s followed by failure at 3500 /s.

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

2015 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Mechanical Properties ◽  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Lead Free ◽  
Electronic Systems ◽  
Strain Rates ◽  
High Strain Rates ◽  
Solder Interconnects

Electronics products may often be exposed to high temperature during storage, operation and handling in addition to high strain rate transient dynamic loads during drop-impact. Electronics subjected to drop-impact, shock and vibration may experience strain rates of 1–100 per sec. There are no material properties available in published literature at high strain rate at elevated temperature. High temperature and vibrations can contribute to the failures of electronic system. The reliability of electronic products can be improved through a thorough understanding of the weakest link in the electronic systems which is the solder interconnects. The solder interconnects accrue damage much faster when subjected to Shock and vibration at elevated temperatures. There is lack of fundamental understanding of reliability of electronic systems subjected to thermal loads. Previous studies have showed the effect of high strain rates and thermal aging on the mechanical properties of leadfree alloys including elastic modulus and the ultimate tensile strength. Extended period of thermal aging has been shown to affect the mechanical properties of lead free alloys including elastic modulus and the ultimate tensile strength at low strain rates representative of thermal fatigue [Lee 2012, Motalab 2012]. Previously, the microstructure, mechanical response and failure behavior of leadfree solder alloys when subjected to elevated isothermal aging and/or thermal cycling [Darveaux 2005, Ding 2007, Pang 2004] have been measured. Pang [1998] has showed that young’s modulus and yield stress of Sn-Pb are highly depending on strain rate and temperature. The ANAND viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components. Previously, Mechanical properties of lead-free alloys, at different high strain rates (10, 35, 50, 75 /sec) and elevated temperature (25 C-125 C) for pristine samples have been studied [Lall 2012 and Lall 2014]. Previous researchers [Suh 2007 and Jenq 2009] have determined the mechanical properties of SAC105 at very high strain rate (Above 1000 per sec) using compression testing. But there is no data available in published literature at high strain rate and at elevated temperature for aged conditions. In this study, mechanical properties of lead free SAC105 has been determined for high strain rate at elevated temperature for aged samples. Effect of aging on mechanical properties of SAC105 alloy a high strain rates has been studied. Stress-Strain curves have been plotted over a wide range of strain rates and temperatures for aged specimen. Experimental data for the aged specimen has been fit to the ANAND’s viscoplastic model. SAC105 leadfree alloys have been tested at strain rates of 10, 35, 50 and 75 per sec at various operating temperatures of 50°C, 75°C, 100°C and 125°C. The test samples were exposed to isothermal aging conditions at 50°C for different aging time (30, 60, and 120 Days) before testing. Full-field strain in the specimen have been measured using high speed imaging at frame rates up to 75,000 fps in combination with digital image correlation. The cross-head velocity has been measured prior-to, during, and after deformation to ensure the constancy of cross-head velocity.

High Strain Rate Behavior of Metals

1990 ◽  
Vol 43 (5S) ◽  
pp. S9-S22 ◽  
Author(s):  
R. J. Clifton
Keyword(s):  
Flow Stress ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Rate Sensitivity ◽  
Strong Increase ◽  
Strain Rates ◽  
Shear Strain Rate ◽  
High Strain Rates ◽  
Strain Rate Change

Experimental results on the high strain rate response of polycrystalline metals are reviewed, with emphasis on the behavior of pure metals. A strong increase in flow stress with increasing strain rate is reported for strain rates of approximately 105s−1 and higher. This increase is observed in pressure-shear plate impact experiments at nominally constant strain rates from 105s−1 to 106s−1. To improve understanding of the increased rate sensitivity at high strain rates, pressure-shear, strain-rate-change experiments have been conducted on OFHC copper specimens. These experiments have been analyzed using a conventional viscoplasticity formulation and an internal variable formulation in which the hardening rate depends on the rate of deformation. Only the latter formulation is successful in describing the observed response to the change in strain rate. This observation is discussed in terms of its implications for interpreting other dynamic plasticity experiments and for improved understanding of the underlying dislocation mechanisms. The enhanced rate sensitivity at high strain rates is concluded to be related primarily to the rate sensitivity of strain hardening, not the rate sensitivity of the flow stress at constant structure.

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