Preventive Maintenance of Electric Submersible Pumps and its Relationship to Root Cause of Failure Analysis

2000 ◽  
Author(s):  
W.A. Limanowka ◽  
S. Degen ◽  
G. Benwell
Keyword(s):  
Failure Analysis ◽  
Preventive Maintenance ◽  
Root Cause ◽  
Cause Of Failure

Case Study—Failure Analysis of a Multiplexer

2016 ◽  
Author(s):  
Michael Woo ◽  
Marcos Campos ◽  
Luigi Aranda
Keyword(s):  
Failure Analysis ◽  
High Reliability ◽  
Component Failure ◽  
Root Cause ◽  
Knowing That ◽  
Cause Of Failure ◽  
The Cost

Abstract A component failure has the potential to significantly impact the cost, manufacturing schedule, and/or the perceived reliability of a system, especially if the root cause of the failure is not known. A failure analysis is often key to mitigating the effects of a componentlevel failure to a customer or a system; minimizing schedule slips, minimizing related accrued costs to the customer, and allowing for the completion of the system with confidence that the reliability of the product had not been compromised. This case study will show how a detailed and systemic failure analysis was able to determine the exact cause of failure of a multiplexer in a high-reliability system, which allowed the manufacturer to confidently proceed with production knowing that the failure was not a systemic issue, but rather that it was a random “one time” event.

Reliability Estimation and Failure Analysis of Multilayer Ceramic Chip Capacitors

2003 ◽  
Vol 17 (08n09) ◽  
pp. 1318-1323 ◽  
Author(s):  
Seok Jun Yang ◽  
Jin Woo Kim ◽  
Dong Su Ryu ◽  
Myung Soo Kim ◽  
Joong Soon Jang
Keyword(s):  
Failure Analysis ◽  
Life Stress ◽  
Control Unit ◽  
Accelerated Life Testing ◽  
Reliability Estimation ◽  
Accelerated Life Test ◽  
Root Cause ◽  
Accelerated Life ◽  
Cause Of Failure ◽  
Multilayer Ceramic

This paper presents the failure analysis and the reliability estimation of a multilayer ceramic chip capacitor. For the failed samples used in an automobile engine control unit, failure analysis was made to identify the root cause of failure and it was shown that the migration and the avalanche breakdown were the dominant failure mechanisms. Next, an accelerated life testing was designed to estimate the life of the MLCC. It is assumed that Weibull lifetime distribution and the life-stress relationship proposed Prokopowicz and Vaskas. The life-stress relationship and the acceleration factor are estimated by analyzing the accelerated life test data.

Application of Advanced Back-Side Optical Techniques in ASICs

2013 ◽  
Vol 21 (3) ◽  
pp. 30-35
Author(s):  
Douglas Martin ◽  
Samuel Beilin ◽  
Brett Hamilton ◽  
Darin York ◽  
Philip Baker ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Photon Emission ◽  
Back Side ◽  
Voltage Imaging ◽  
Root Cause ◽  
Silicon Transistors ◽  
Cause Of Failure ◽  
Metal Interconnects ◽  
Application Specific

Failure analysis is important in determining root cause for appropriate corrective action. In order to perform failure analysis of microelectronic application-specific integrated circuits (ASICs) delidding the device is often required. However, determining root cause from the front side is not always possible due to shadowing effects caused by the ASIC metal interconnects. Therefore, back-side polishing is used to reveal an unobstructed view of the ASIC silicon transistors. This paper details how back-side polishing in conjunction with laser-scanned imaging (LSI), laser voltage imaging (LVI), laser voltage probing (LVP), photon emission microscopy (PEM), and laser-assisted device alterations (LADA) were used to uncover the root cause of failure of two ASICs.

Metallurgy Selection of Tubing in Sucker Rod Pump Wells Plagued with Pitting and Abrasion Issues

2021 ◽  
Author(s):  
Rishabh Uniyal ◽  
Rajeev Bansal ◽  
Suman Kumar Jaruhar ◽  
Sudipta Biswas ◽  
Sagun Devshali ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Primary Objective ◽  
General Corrosion ◽  
Uniform Corrosion ◽  
Mechanical Wear ◽  
Root Cause ◽  
Sucker Rod ◽  
Sucker Rod Pump ◽  
Cause Of Failure ◽  
Corrosion Pitting

Abstract Analysis of tubing failure of SRP wells with respect to uniform corrosion, pitting and mechanical abrasion has been carried out. The primary objective includes the identification of root cause of failure and suggesting alternate metallurgy. Many wells in an onshore field in ONGC were facing the acute problem of general corrosion, pitting and rod-tubing wear. The methodology for carrying out the study consists of a Failure Analysis of a retrieved sample of the failed tubing from one of the affected wells. This included a thorough visual inspection, Scanning Electron Microscope analysis and X-Ray Diffraction analysis. The results of these tests were backed up by software simulation in Honeywell Predict. Metallurgy selection involved multiple exhaustive simulation runs in Honeywell Software Socrates which was corroborated by relevant oilfield standards as well as literature available on the subject matter. Based on the failure analysis and simulation runs, it was concluded that besides the issue of uniform corrosion and pitting, many of the affected wells are also facing the problem of tubing failures due to abrasion and mechanical wear. It is pertinent to note that the major contributor of the frequent tubing failures in the candidate wells selected for the study were pitting and corrosion. Nevertheless, Abrasion always remains a key threat to the tubing string integrity in rod-pump wells. Therefore, the existing tubing metallurgy of N-80 grade Carbon Steel was deemed inadequate in the absence of reliable corrosion inhibitor continuous dosing facilities. A tubing metallurgy that takes care of both pitting corrosion as well as abrasion and mechanical wear was sought. UNS 41426/41427 or the modified version of 13 Chrome, commercia lly known as Super Martensitic 13 Chrome, are available in 95 ksi and 110 ksi grades. These grades have a maximum hardness of 28-32 HRC which is substantially high compared to L-80 13 Cr (maximum 23 HRC). Also, as this alloy has 4-6% Nickel, it provides added protection against uniform corrosion as well as pitting and hence was recommended. The paper specifically analyses tubing failure in Sucker rod-pump wells due to corrosion, pitting and abrasion. After exploring various viable options, adequate tubing metallurgy has been recommended that should take care of corrosion, pitting as well as mechanical wear problems.

Engineering Design Process Investigation in a Failure Analysis

2021 ◽  
pp. 20-29
Author(s):  
Steven Kushnick
Keyword(s):  
Failure Analysis ◽  
Engineering Design ◽  
Design Process ◽  
Failure Modes ◽  
Process Information ◽  
Root Cause ◽  
Management Actions ◽  
Engineering Design Process ◽  
Mode Of Failure ◽  
Cause Of Failure

Abstract The intent of this article is to assist the failure analyst in understanding the underlying engineering design process embodied in a failed component or system. It begins with a description of the mode of failure. This is followed by a section providing information on the root cause of failure. Next, the article discusses the steps involved in the engineering design process and explains the importance of considering the engineering design process. Information on failure modes and effects analysis is also provided. The article ends with a discussion on the consequence of management actions on failures.

Case Study of a DDR Loopback Test Failure Encountered on a Map Ball Grid Array Packaged Device

2017 ◽  
Author(s):  
Jose Z. Garcia ◽  
Kris Dickson
Keyword(s):  
Failure Analysis ◽  
Ball Grid Array ◽  
Analysis Techniques ◽  
Root Cause ◽  
Test Methodology ◽  
Cause Of Failure ◽  
Test Failure

Abstract This paper describes how a DDR loopback test failure was analyzed successfully after being repackaged from an MBGA into a TBGA package substrate. DDR loopback test methodology is discussed as well as the advanced failure analysis techniques that were used to identify the root cause of failure.

Failure Analysis From Back Side of Die

1996 ◽  
Author(s):  
N.M. Wu ◽  
K. Weaver ◽  
J.H. Lin
Keyword(s):  
Failure Analysis ◽  
Fault Isolation ◽  
Back Side ◽  
Induced Current ◽  
Front Side ◽  
Root Cause ◽  
Isolation Techniques ◽  
Cause Of Failure ◽  
Emission Microscopy ◽  
Side Emission

Abstract With increasing complexity of circuit layout on the die and special packages in which the die are flipped over, failure analysis on the die front side, sometimes, can not solve the problems or is not possible by opening the front side of the package to expose the die front side. This paper discusses fault isolation techniques and procedures used on the back side of the die. The two major back side techniques, back side emission microscopy and back side OBIC (Optical Beam Induced Current), are introduced and applied to solve real problems in failure analysis. A back side decapsulation technique and procedure are also introduced. Last, several examples are given. The results indicated that the success in finding root cause of failure is greatly increased when these techniques are used in addition to the traditional front side analysis approaches.

A New Failure Analysis Flow of Gate Oxide Integrity Failure in Wafer Fabrication

2009 ◽  
Author(s):  
Hua Younan ◽  
Chu Susan ◽  
Gui Dong ◽  
Mo Zhiqiang ◽  
Xing Zhenxiang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Gate Dielectric ◽  
Dielectric Breakdown ◽  
Defect Density ◽  
Gate Oxide ◽  
Oxide Thickness ◽  
Fault Isolation ◽  
Wafer Fabrication ◽  
Root Cause ◽  
Gate Oxide Integrity

Abstract As device feature size continues to shrink, the reducing gate oxide thickness puts more stringent requirements on gate dielectric quality in terms of defect density and contamination concentration. As a result, analyzing gate oxide integrity and dielectric breakdown failures during wafer fabrication becomes more difficult. Using a traditional FA flow and methods some defects were observed after electrical fault isolation using emission microscopic tools such as EMMI and TIVA. Even with some success with conventional FA the root cause was unclear. In this paper, we will propose an analysis flow for GOI failures to improve FA’s success rate. In this new proposed flow both a chemical method, Wright Etch, and SIMS analysis techniques are employed to identify root cause of the GOI failures after EFA fault isolation. In general, the shape of the defect might provide information as to the root cause of the GOI failure, whether related to PID or contamination. However, Wright Etch results are inadequate to answer the questions of whether the failure is caused by contamination or not. If there is a contaminate another technique is required to determine what the contaminant is and where it comes from. If the failure is confirmed to be due to contamination, SIMS is used to further determine the contamination source at the ppm-ppb level. In this paper, a real case of GOI failure will be discussed and presented. Using the new failure analysis flow, the root cause was identified to be iron contamination introduced from a worn out part made of stainless steel.

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