scholarly journals Direct brazing of Al2O3 without reaction layer by self-removing oxide film Aluminum foil solder

2020 ◽  
Vol 128 (6) ◽  
pp. 305-309
Author(s):  
Bingyang MA ◽  
Zixian TAN ◽  
Xiaoben QI ◽  
Rongbin LI ◽  
Geyang LI ◽  
...  
1960 ◽  
Vol 38 (9) ◽  
pp. 1526-1534 ◽  
Author(s):  
J. A. Davies ◽  
J. Friesen ◽  
J. D. McIntyre

A rapid technique has been developed for dissolving successive thin layers of metal from the surface of an aluminum foil: viz. electrochemical oxidation at constant voltage in aqueous ammonium citrate, followed by removal of the oxide film in a phosphoric acid – chromic oxide solution. Due to the highly protective nature of the aluminum oxide film, this two-step process enables very uniform surface layers of metal as thin as 1 μ/cm2 to be removed. The total weight of aluminum dissolved increases with the applied anodic voltage at a rate of 0.30 μg cm−1 volt−1 (approximately 11 Å per volt) over the range 0–150 volts. The technique should be sufficiently sensitive to study the depth of penetration in aluminum of radioactive ions with kinetic energies as low as a few kiloelectron volts.An approximate value for the range of Na24 recoil atoms from the Al27 (n,α) reaction was obtained. A more extensive application to range studies is given in the next paper.


Author(s):  
Michio Ashida ◽  
Yasukiyo Ueda

An anodic oxide film is formed on aluminum in an acidic elecrolyte during anodizing. The structure of the oxide film was observed directly by carbon replica method(l) and ultra-thin sectioning method(2). The oxide film consists of barrier layer and porous layer constructed with fine hexagonal cellular structure. The diameter of micro pores and the thickness of barrier layer depend on the applying voltage and electrolyte. Because the dimension of the pore corresponds to that of colloidal particles, many metals deposit in the pores. When the oxide film is treated as anode in emulsion of polyelectrolyte, the emulsion particles migrate onto the film and deposit on it. We investigated the behavior of the emulsion particles during electrodeposition.Aluminum foils (99.3%) were anodized in either 0.25M oxalic acid solution at 30°C or 3M sulfuric acid solution at 20°C. After washing with distilled water, the oxide films used as anode were coated with emulsion particles by applying voltage of 200V and then they were cured at 190°C for 30 minutes.


Author(s):  
Paul G. Kotula ◽  
C. Barry Carter

Thin-film reactions in ceramic systems are of increasing importance as materials such as oxide superconductors and ferroelectrics are applied in thin-film form. In fact, reactions have been found to occur during the growth of YBa2Cu3O6+x on ZrO2. Additionally, thin-film reactions have also been intentionally initiated for the production of buffer layers for the subsequent growth of high-Tc superconductor thin films. The problem is that the kinetics of ceramic thin-film reactions are not well understood when the reaction layer is very thin; that is, when the rate-limiting step is a phase-boundary reaction as opposed to diffusion of the reactants through the product layer. In this case, the reaction layer is likely to be laterally non-uniform. In the present study, the measurement of thin reaction-product layers is accomplished by first digitally acquiring backscattered-electron images in a high-resolution field-emission scanning electron microscope (FESEM) followed by image analysis. Furthermore, the problem of measuring such small thicknesses (e.g., 20-500nm) over lengths of interfaces longer than 3mm is addressed.


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