scholarly journals Electrochemical Characteristics of Nickel Hydroxide Fabricated from a Spent Electroless Plating Bath

2022 ◽  
pp. ArticleID:22026
Author(s):  
Tzu-Hsuan Tsai ◽  
Keyword(s):  
Electroless Plating ◽  
Nickel Hydroxide ◽  
Electrochemical Characteristics ◽  
Plating Bath

Nickel Oxide Coated on Pretreated MWCNTs as an Electrode for Supercapacitor

2013 ◽  
Vol 829 ◽  
pp. 654-658
Author(s):  
Lida Mahmoudi ◽  
Farzad Mahboubi ◽  
Moreteza Saghafi Yazdi
Keyword(s):  
Nickel Oxide ◽  
Thermal Annealing ◽  
Nickel Hydroxide ◽  
Annealing Temperature ◽  
Electrochemical Characteristics ◽  
Sem Images ◽  
Electroactive Materials ◽  
Nanotubular Structure ◽  
Individual Cnts ◽  
The Individual

Nickel oxide/carbon nanotubes (NiO/CNTs) composite materials for supercapacitor are prepared by chemically depositing of nickel hydroxide onto CNTs pretreated by ultrasonication and followed by thermal annealing at 200-300°C. A series of NiO/CNTs composites with different weight ratios of CNTs and different annealing temperature are synthesized via the same route. The scanning electron microscope (SEM) images show that the nucleation of the nickel hydroxide formed on the outer walls of CNTs due to ultrasonic cavitations, and then nickel oxide coated uniformly on the outer surface of the individual CNTs after thermal annealing. The NiO/CNTs electrode presents a maximum specific capacitance of 254 F/g as well as a good cycle life in 2 M KOH electrolyte. The good electrochemical characteristics of NiO/CNTs composite can be attributed to the three-dimensionally interconnected nanotubular structure with a thin film of electroactive materials.

scholarly journals 2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

2015 ◽  
Vol 2015 ◽  
pp. 1-11
Author(s):  
Ahmet Ozan Gezerman ◽  
Burcu Didem Çorbacıoğlu
Keyword(s):  
Waste Water ◽  
Electroless Plating ◽  
Thioglycolic Acid ◽  
Electroless Nickel ◽  
Optical Microscope ◽  
Electroless Nickel Plating ◽  
Nickel Plating ◽  
Plating Bath ◽  
Bath Solution ◽  
Microscope Images

The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.

Electroless Plating of Copper Interconnections on Ion Beam Catalyzed Polyimide

1989 ◽  
Vol 167 ◽  
Author(s):  
T. Flottmann ◽  
A. Tulke ◽  
E. Esper ◽  
W. Lohmann
Keyword(s):  
Electroless Plating ◽  
Surface Composition ◽  
Ion Irradiation ◽  
Ion Beam ◽  
Plating Bath ◽  
Chemical Surface ◽  
Polyimide Substrate ◽  
Palladium Acetylacetonate ◽  
Catalytic Sites

AbstractDecomposition of a palladium compound by ion irradiation has been used to catalyze electroless plating on polyimide. First, palladium-acetylacetonate or -acetate is spin-coated on a polyimide substrate. The thin resist film is then irradiated through a mask with He or Ar ions of 100 keV energy. After washing off the film parts which were not exposed to the ion beam, copper is deposited on the catalyzed polyimide substrate in an alkaline electroless plating bath. When using alkaline resistant polyimide, copper lines several microns thick can be plated. The chemical surface composition of the Pd-compounds after ion beam exposure has been investigated with ESCA. It has been found that the Pd is partially reduced. Pd-acetate is more effective to form catalytic sites than Pd-acetylacetonate.

Electroless Silver Plating Process on Al-Ag Alloy Powder

2013 ◽  
Vol 800 ◽  
pp. 256-259
Author(s):  
Wang Qun ◽  
Ye Fan Li ◽  
Dong Mei Li ◽  
Zhi Xue Qu
Keyword(s):  
Electroless Plating ◽  
Alloy Powder ◽  
Glucose Solution ◽  
Silver Content ◽  
Silver Coating ◽  
Chemical Compositions ◽  
Composite Powders ◽  
Plating Bath ◽  
Thiourea Solution ◽  
Electroless Silver Plating

The Ag coating was deposited on the surface of Al-Ag alloy powder by electroless plating process. 10 wt% of AgNO3 was put in the powder for precursor replacement reaction, and then added the powder into electroless plating bath which contained glucose solution, solution of silver ammonia, thiourea solution, tartaric acid solution and absolute ethanol. The effects of formula components were analyzed. The surface morphology of the prepared composite particles was studied with SEM and their chemical compositions were confirmed by XRD. With the chemical etching method, silver content of the powder was determined. The studies have shown that an uniform, complete and dense silver coating for the Al-Ag composite powders was generated by this method, with the silver content being 20wt%, and the conductivity was favorable.

Formation and Structural Characterization of Electroless Ni-B-P Ternary Alloy Coatings

2014 ◽  
Vol 592-594 ◽  
pp. 385-390 ◽  
Author(s):  
P.G. Venkatakrishnan ◽  
S.S. Mohamed Nazirudeen ◽  
T.S.N. Sankara Narayanan
Keyword(s):  
Electroless Plating ◽  
Morphological Characteristics ◽  
Reducing Agents ◽  
Sodium Hypophosphite ◽  
Electron Microscopic ◽  
Plating Bath ◽  
Peak Broadening ◽  
Chloride Hexahydrate ◽  
Electroless Ni

The aim of the present investigation is to study the formation of electroless Ni-B-P alloy coatings and structural and morphological characterization of various coatings with different boron and phosphorous content. An alkaline plating bath with nickel chloride hexahydrate as the source of nickel ions and sodium borohydride and sodium hypophosphite as reducing agents were used for the formation of electroless Ni-B-P alloy coatings. The influence of changes in the concentrations of the reducing agents in the electroless plating bath on the chemical composition, structural and morphological characteristics of the coatings were studied. Scanning electron microscopic studies revealed that the surface morphology of Ni-B-P alloy coatings changed from corn cob-like structure to cauliflower-like structure with increasing borohydride concentration in electroless plating bath, whereas increase in hypophosphite concentration favoured sideway growth, thereby decreased the surface roughness of the Ni-B-P alloy coatings. The peak broadening in the X-Ray Diffraction profiles indicates the large reduction in the crystallite size of the electroless Ni-B-P alloy coatings with increasing boron content in the coating (i.e. for higher borohydride concentration in the plating bath).

Covalent Coupling of Gold Nanoparticles to Multiwalled Carbon Nanotubes for Electronic Device Applications

2004 ◽  
Vol 818 ◽  
Author(s):  
Xicheng Ma ◽  
Ning Lun ◽  
Xia Li ◽  
Shulin Wen
Keyword(s):  
Carbon Nanotubes ◽  
Gold Nanoparticles ◽  
Multiwalled Carbon Nanotubes ◽  
Electroless Plating ◽  
Electronic Device ◽  
Hybrid Nanostructures ◽  
Gold Deposition ◽  
Multiwalled Carbon ◽  
Plating Bath ◽  
Conjugation Process

AbstractCreating hybrid nanostructures of disparate nanoscale blocks is of interest of exploring new types of electronic devices and networks. Here, we demonstrate the novel coupling of gold nanoparticles of 3-4 nm diameters to sidewall of multiwalled carbon nanotubes (MWNTs) using the electroless plating technique. MWNTs were initially chemically modified with an H2SO4-HNO3 acid treatment, and subsequently activated with Pd-Sn catalytic nuclei via a one-step activation approach. When the activated MWNTs were immersed in a gold-containing electroless plating bath, gold deposition occurred at the catalytic sites. The deposited gold clusters then catalyze further gold deposition on the tube surface (autocatalytic process). Novel hybrid nanostructures with gold nanoparticles homogeneously distributed on MWNTs resulted. High-resolution transmission electron microscopy (HRTEM) and energy dispersive X-ray spectroscopy (EDS) were used to characterize the conjugation process.

Electroless Plated Pd/GaAs Schottky Diode and its Application to Hydrogen Detection

2007 ◽  
Vol 124-126 ◽  
pp. 81-84
Author(s):  
Yen I Chou ◽  
Huey Ing Chen ◽  
Chien Kang Hsiung
Keyword(s):  
Grain Size ◽  
Oxide Layer ◽  
Schottky Diode ◽  
Electroless Plating ◽  
Sodium Ion ◽  
Bath Composition ◽  
Plating Bath ◽  
Hydrogen Detection ◽  
Hydrogen Sensing ◽  
Intermediate Oxide

In this study, the dependence of Pd/GaAs Schottky diode on the electroless plating (EP) variable is systematically studied. Both alkaline and acidic formulas for electroless Pd depositions are employed for investigations. The correlation between Pd gain size and the manipulation of plating bath composition is constructed. Experimental results show that the performances of Pd/GaAs Schottky diode, electric rectification and hydrogen detection, are largely governed by the Pd grain size. Furthermore, without the interference of sodium ion, the acidic-plated Pd/GaAs diode with intermediate oxide layer exhibits the excellent hydrogen sensing performances from 15 ppm to 1.0 % H2/air.

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