scholarly journals Design Of A Microelectronic Manufacturing Laboratory

2020 ◽  
Author(s):  
Todd Kaiser ◽  
Stilson Applin
Keyword(s):  
Microelectronic Manufacturing

Heat Transfer in Wire Bonding Process

1994 ◽  
Vol 116 (1) ◽  
pp. 44-48 ◽  
Author(s):  
M. A. Jog ◽  
I. M. Cohen ◽  
P. S. Ayyaswamy
Keyword(s):  
Electric Fields ◽  
Potential Temperature ◽  
Wire Bonding ◽  
Bonding Process ◽  
Heat Fluxes ◽  
Main Body ◽  
Discharge Parameters ◽  
Current Densities ◽  
The Wire ◽  
Microelectronic Manufacturing

We have analyzed an electric discharge between wire and planar electrodes with wire diameter and current densities that are typically used in upscaled experimental simulations of the wire bonding process employed in microelectronic manufacturing. A set of continuum conservation equations has been solved to obtain the variation of electric potential, temperature distributions, and the electrode heat fluxes. Results indicate that the main body of the discharge is quasineutral bounded by space charge sheaths at both electrodes. Strong electric fields are concentrated in the electrode sheaths. The heat flux to the wire is sharply peaked near the wire tip but on the plane it decays slowly away from the discharge axis. The model studied here may be used to establish optimum discharge parameters for wire bonding.

COSAR: commitment-oriented “sense and respond” system for microelectronic manufacturing

2005 ◽  
Vol 27 (9-10) ◽  
pp. 999-1010
Author(s):  
Jun-Jang Jeng ◽  
Henry Chang ◽  
Jen-Yao Chung ◽  
Markus Ettl ◽  
Steve Buckley ◽  
...  
Keyword(s):  
Sense And Respond ◽  
Microelectronic Manufacturing

Fabrication and Characterization of a Poly (3-Hexylthiophene) Thin Film Micro-sensor for Hypergolic Vapor Detection

2006 ◽  
Vol 951 ◽  
Author(s):  
Huihua Shu ◽  
Jiehui Wan ◽  
John Shu ◽  
Hong Yang ◽  
Bryan A. Chin
Keyword(s):  
Thin Film ◽  
Thermal Stability ◽  
Low Cost ◽  
Vapor Detection ◽  
Different Temperatures ◽  
Micro Sensor ◽  
Low Levels ◽  
Manufacturing Techniques ◽  
Microelectronic Manufacturing

ABSTRACTA passive chemiresistor micro-sensor was investigated for the detection of hydrazine compounds. Hydrazine compounds are a highly toxic and carcinogenic species exhibiting toxic effects in humans at very low levels of exposure. Therefore, a sensor capable of detecting ppb levels of hydrazine compounds is required to insure the safety of personnel. The present study describes the fabrication, testing, and characterization of a low-cost, ultrasensitive Poly (3-Hexylthiophene) (P3HT) thin film-based micro-sensor for the detection of hydrazine compounds. Standard microelectronic manufacturing techniques were used to form a micro-sensor composed of a silicon substrate, interdigitated gold electrodes, and P3HT sensing film. Responses of the micro-sensor to hydrazine compounds at different temperatures and concentration levels are reported. When exposed to 25 ppm hydrazine in nitrogen, the sensor's resistance was measured to change from a few ohms to over 10 Megaohms. The thermal stability of the P3HT micro-sensor and the method to improve thermal stability are also explored. Thermally annealing the P3HT micro-sensor was found to improve thermal stability at high temperatures. Moreover, the sensor exhibits good specificity to hydrazine and does not respond to the presence of NO2 and/or N2O.

Evolution of anisotropic crack patterns in shrinking material layers

Soft Matter ◽  
2021 ◽  
Author(s):  
Roland Szatmári ◽  
Zoltán Halász ◽  
Akio Nakahara ◽  
So Kitsunezaki ◽  
Ferenc Kun
Keyword(s):  
Crack Patterns ◽  
Potential Applications ◽  
Microelectronic Manufacturing

Anisotropic crack patterns emerging in desiccating layers of pastes on a substrate can be exploited for controlled cracking with potential applications in microelectronic manufacturing. We investigate such possibilities of crack...

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