Investigation of Electromagnetic Noise Coupling in a Board with a Digital-RF Mixed IC by Measurement and Analysis

Kenta TSUKAMOTO; Mizuki IWANAMI; Eiji HANKUI

doi:10.1587/transcom.e98.b.1182

Investigation of Electromagnetic Noise Coupling in a Board with a Digital-RF Mixed IC by Measurement and Analysis

IEICE Transactions on Communications ◽

10.1587/transcom.e98.b.1182 ◽

2015 ◽

Vol E98.B (7) ◽

pp. 1182-1187 ◽

Cited By ~ 1

Author(s):

Kenta TSUKAMOTO ◽

Mizuki IWANAMI ◽

Eiji HANKUI

Keyword(s):

Electromagnetic Noise ◽

Noise Coupling ◽

Digital Rf ◽

Measurement And Analysis

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Study of Electromagnetic Noise Coupling in Wireless-LAN Communication System

IEICE Transactions on Communications ◽

10.1587/transcom.e93.b.1776 ◽

2010 ◽

Vol E93-B (7) ◽

pp. 1776-1780 ◽

Cited By ~ 4

Author(s):

Mizuki IWANAMI ◽

Hiroshi FUKUDA ◽

Manabu KUSUMOTO ◽

Takashi HARADA

Keyword(s):

Communication System ◽

Wireless Lan ◽

Electromagnetic Noise ◽

Noise Coupling

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Electromagnetic noise coupling analysis of TSV array by using cylindrical mode expansion method

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy ◽

10.1109/isaf.2014.6917968 ◽

2014 ◽

Author(s):

Jun Li ◽

Hui-Chun Yu ◽

Xing-Yun Luo ◽

Xiao-Bo Huang ◽

Xing-Chang Wei ◽

...

Keyword(s):

Expansion Method ◽

Coupling Analysis ◽

Electromagnetic Noise ◽

Mode Expansion ◽

Noise Coupling

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Electromagnetic noise coupling analysis of TSV array by using cylindrical mode expansion method

2014 15th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2014.6922759 ◽

2014 ◽

Author(s):

Jun Li ◽

Hui-Chun Yu ◽

Xing-Yun Luo ◽

Xiao-Bo Huang ◽

Xing-Chang Wei ◽

...

Keyword(s):

Expansion Method ◽

Coupling Analysis ◽

Electromagnetic Noise ◽

Mode Expansion ◽

Noise Coupling

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Electromagnetic noise coupling and mitigation in dynamic tests of high power switching devices

2015 IEEE Energy Conversion Congress and Exposition (ECCE) ◽

10.1109/ecce.2015.7310585 ◽

2015 ◽

Cited By ~ 3

Author(s):

Chengcheng Yao ◽

Mingzhi Leng ◽

He Li ◽

Lixing Fu ◽

Fang Luo ◽

...

Keyword(s):

High Power ◽

Dynamic Tests ◽

Electromagnetic Noise ◽

Power Switching ◽

Noise Coupling ◽

Switching Devices

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Investigation of electromagnetic noise coupling that affects packet error rates in wireless-LAN mounted printed circuit boards

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4735994 ◽

2008 ◽

Author(s):

Mizuki Iwanami ◽

Hiroshi Fukuda ◽

Manabu Kusumoto ◽

Shigeki Hoshino ◽

Takashi Harada

Keyword(s):

Wireless Lan ◽

Printed Circuit Boards ◽

Error Rates ◽

Circuit Boards ◽

Electromagnetic Noise ◽

Printed Circuit ◽

Noise Coupling

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Reduction of Electromagnetic Noise Coupling to Antennas in Metal-Framed Smartphones Using Ferrite Sheets and Multi-Via EBG Structures

IEEE Transactions on Electromagnetic Compatibility ◽

10.1109/temc.2017.2743345 ◽

2018 ◽

Vol 60 (2) ◽

pp. 394-401 ◽

Cited By ~ 10

Author(s):

Hyun Ho Park

Keyword(s):

Electromagnetic Noise ◽

Noise Coupling

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Evaluation of Electromagnetic Noise Coupling in a Board with an RF- IC

Journal of The Japan Institute of Electronics Packaging ◽

10.5104/jiep.21.374 ◽

2018 ◽

Vol 21 (5) ◽

pp. 374-379

Author(s):

Kenta Tsukamoto

Keyword(s):

Electromagnetic Noise ◽

Noise Coupling ◽

Rf Ic

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Measurement and analysis of vertical noise coupling on low noise amplifier from on-chip switching-mode DC-DC converter in 3D-IC

2011 IEEE International Symposium on Electromagnetic Compatibility ◽

10.1109/isemc.2011.6038278 ◽

2011 ◽

Author(s):

Kyoungchoul Koo ◽

Myunghoi Kim ◽

Sangrok Lee ◽

Joungho Kim

Keyword(s):

Low Noise ◽

Low Noise Amplifier ◽

3D Ic ◽

Noise Coupling ◽

Measurement And Analysis ◽

Noise Amplifier ◽

On Chip ◽

Switching Mode

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Electromagnetic noise coupling and mitigation for fast response on-die temperature sensing in high power modules

2016 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec.2016.7468074 ◽

2016 ◽

Cited By ~ 3

Author(s):

Chengcheng Yao ◽

Pengzhi Yang ◽

Mingzhi Leng ◽

He Li ◽

Lixing Fu ◽

...

Keyword(s):

High Power ◽

Fast Response ◽

Temperature Sensing ◽

Electromagnetic Noise ◽

Noise Coupling ◽

Power Modules ◽

Die Temperature

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Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer

IEEE Transactions on Electromagnetic Compatibility ◽

10.1109/temc.2021.3059846 ◽

2021 ◽

pp. 1-12

Author(s):

Gapyeol Park ◽

Youngwoo Kim ◽

Kyungjun Cho ◽

Junyong Park ◽

Insu Hwang ◽

...

Keyword(s):

Noise Coupling ◽

Measurement And Analysis

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