scholarly journals The Influence of Motion Path and Assembly Sequence on Stability of Assemblies

2013 ◽  
Author(s):  
Sourav Rakshit ◽  
Srinivas Akella
Keyword(s):  
Motion Path ◽  
Assembly Sequence

Possible examinations of stone machining focused on the relationship between technological parameters and surface quality

2013 ◽  
Vol 4 (1) ◽  
pp. 63-68 ◽  
Author(s):  
Zs. Kun ◽  
I. G. Gyurika
Keyword(s):  
Surface Roughness ◽  
Metal Cutting ◽  
Cutting Speed ◽  
Theoretical Background ◽  
Motion Path ◽  
Depth Of Cut ◽  
Manufacturing Cost ◽  
Technological Parameters ◽  
The Relationship ◽  
Manufacturing Time

Abstract The stone products with different sizes, geometries and materials — like machine tool's bench, measuring machine's board or sculptures, floor tiles — can be produced automatically while the manufacturing engineer uses objective function similar to metal cutting. This function can minimise the manufacturing time or the manufacturing cost, in other cases it can maximise of the tool's life. To use several functions, manufacturing engineers need an overall theoretical background knowledge, which can give useful information about the choosing of technological parameters (e.g. feed rate, depth of cut, or cutting speed), the choosing of applicable tools or especially the choosing of the optimum motion path. A similarly important customer's requirement is the appropriate surface roughness of the machined (cut, sawn or milled) stone product. This paper's first part is about a five-month-long literature review, which summarizes in short the studies (researches and results) considered the most important by the authors. These works are about the investigation of the surface roughness of stone products in stone machining. In the second part of this paper the authors try to determine research possibilities and trends, which can help to specify the relation between the surface roughness and technological parameters. Most of the suggestions of this paper are about stone milling, which is the least investigated machining method in the world.

Tribological characterization of all-polymer prosthesis based on multi-directional motion

2021 ◽  
pp. 089270572110286
Author(s):  
Xinyue Zhang ◽  
Dekun Zhang ◽  
Kai Chen ◽  
Handong Xu ◽  
Cunao Feng
Keyword(s):  
Friction Coefficient ◽  
Abrasive Wear ◽  
Wear Mechanism ◽  
Friction And Wear ◽  
Quantitative Relationship ◽  
Motion Path ◽  
Aspect Ratios ◽  
Directional Motion ◽  
Motion Paths ◽  
Prosthesis Material

The complex movement of artificial joints is closely related to the wear mechanism of the prosthesis material, especially for the polymer prosthesis, which is sensitive to motion paths. In this paper, the “soft-soft” all-polymer of XLPE/PEEK are selected to study the influence of motion paths on the friction and wear performance. Based on the periodic characteristics of friction coefficient and wear morphology, this paper reveals the friction and wear mechanism of XLPE/peek under multi-directional motion path, and obtains the quantitative relationship between friction coefficient and the aspect ratios of “∞”-shape motion path, which is of great significance to reveal and analyze the wear mechanism of “soft” all-polymer under multi-directional motion path. The results show that the friction coefficient is affected by the motion paths and have periodicity. Morever, under the multi-directional motion paths, the wear of PEEK are mainly abrasive wear and adhesive wear due to the cross shear effect, while the wear of XLPE is mainly abrasive wear with plastic accumulation. In addition, the friction coefficient is greatly affected the aspect ratios Rs-l of “∞”-shape and loads. Meanwhile, the wear morphologies are greatly affected by the aspect ratios Rs-l of “∞”-shape, but less affected by loads.

Optimized Robotic Assembly Sequence Using ACO

2009 ◽  
Author(s):  
Surjit Sharma ◽  
Bibhuti Bhusan Biswal ◽  
Parameswar Dash ◽  
Bibhuti Bhusan Choudhury
Keyword(s):  
Robotic Assembly ◽  
Assembly Sequence

Three-Degree-of-Freedom Parallel Robot Arm

2006 ◽  
Author(s):  
Martin Hosek ◽  
Michael Valasek ◽  
Jairo Moura
Keyword(s):  
Parallel Robot ◽  
Degree Of Freedom ◽  
Motion Path ◽  
Angular Orientation ◽  
Robot Arm ◽  
Flat Panel Display ◽  
End Effector ◽  
Cluster Tools ◽  
Manufacturing Applications ◽  
Three Degree Of Freedom

This paper presents single- and dual-end-effector configurations of a planar three-degree of freedom parallel robot arm designed for automated pick-place operations in vacuum cluster tools for semiconductor and flat-panel-display manufacturing applications. The basic single end-effector configuration of the arm consists of a pivoting base platform, two elbow platforms and a wrist platform, which are connected through two symmetric pairs of parallelogram mechanisms. The wrist platform carries an end-effector, the position and angular orientation of which can be controlled independently by three motors located at the base of the robot. The joints and links of the mechanism are arranged in a unique geometric configuration which provides a sufficient range of motion for typical vacuum cluster tools. The geometric properties of the mechanism are further optimized for a given motion path of the robot. In addition to the basic symmetric single end-effector configuration, an asymmetric costeffective version of the mechanism is derived, and two dual-end-effector alternatives for improved throughput performance are described. In contrast to prior attempts to control angular orientation of the end-effector(s) of the conventional arms employed currently in vacuum cluster tools, all of the motors that drive the arm can be located at the stationary base of the robot with no need for joint actuators carried by the arm or complicated belt arrangements running through the arm. As a result, the motors do not contribute to the mass and inertia properties of the moving parts of the arm, no power and signal wires through the arm are necessary, the reliability and maintenance aspects of operation are improved, and the level of undesirable particle generation is reduced. This is particularly beneficial for high-throughput applications in vacuum and particlesensitive environments.

Sign in / Sign up

Export Citation Format

Share Document