Thermal Equilibration and Growth of Doped Amorphous Silicon

1987 ◽  
Vol 95 ◽  
Author(s):  
J. Kakalios ◽  
R. A. Street ◽  
C. C. Tsai ◽  
R. Weisfield

AbstractThe relation between the thermal equilibration of the defect structure in n-type doped hydrogenated amorphous silicon (a-Si:H) and the deposition conditions has been investigated. When the deposition rate is increased by raising the rf power the equilibration time constants become longer, though the thermal equilibrium processes are qualitatively similar to those in samples grown under optimal conditions. Models relating the slower equilibration rate to the deposition-induced microstructure are explored.

1997 ◽  
Vol 467 ◽  
Author(s):  
P. W. West ◽  
D. Quicker ◽  
H. M. Dyalsingh ◽  
J. Kakalios

ABSTRACTThe electronic properties of a series of n-type doped hydrogenated amorphous silicon (a-Si:H) films grown with deposition rates ranging from 2 Å/s to 33 Å/s have been studied. Infrared absorption spectroscopy shows an increase in S1-H2 content with deposition rate, concurrent with a decreasing conductivity, increasing thermal equilibration relaxation time, and increasing disorder at the mobility edge as measured by the difference in thermopower and dark conductivity activation energies. The current 1/f noise properties become highly nonstationary, with increased variability and inapplicability of statistical analysis as the deposition rate increases.


1989 ◽  
Vol 114 ◽  
pp. 648-650 ◽  
Author(s):  
Tatsuo Shimizu ◽  
Xixiang Xu ◽  
Hiroyuki Sasaki ◽  
Akiharu Morimoto ◽  
Minoru Kumeda

1992 ◽  
Vol 258 ◽  
Author(s):  
Jin Jang ◽  
Moon Youn Jung ◽  
Sun Sung Yoo ◽  
Hyon Kyun Song ◽  
Jung Mok Jun

ABSTRACTWe have studied the effects of interface and surface on the performance of hydrogenated amorphous silicon(a-Si:H) thin film transistors. The effects of rf power, the buffer layer between the gate insulator and a-Si:H, and the surface oxidation on the performance on the a-Si:H TFTs have been investigated. By introducing suitable buffer layer, we can increase the mobility up to 2.1 cm2/Vs. The surface oxidation gives rise to the electron accumulation near the surface.


1990 ◽  
Vol 192 ◽  
Author(s):  
N. Sakuma ◽  
H. Nozaki ◽  
T. Niiyama ◽  
H. Ito

ABSTRACTThe ratio of Si-H2 bonds to hydrogen content in hydrogenated amorphous silicon films, prepared by mercury-sensitized photochemical vapor deposition, depends on the deposition conditions, in particular on the distance between the substrate and the light-transparent window.The ratio is reduced from 20 % to 8 % by decreasing the distance from 30 mm to 8 mm. On the other hand, the hydrogen content remains constant at 15 at.%. Decreasing the distance has been found to be almost equivalent to increasing the light intensity, especially 254 nm-light intensity.


1991 ◽  
Vol 237 ◽  
Author(s):  
Hisanori Ihara ◽  
Takeo Sakakubo ◽  
Hidetoshi Nozaki

ABSTRACTA hydrogenated amorphous silicon (a-Si:H) interface fabrication technology for the plasma CVD method, which can produce low interface defect density, is presented. The relation between the interface defect density and radio frequency (RF) power was investigated. As a result, the difference between the interface defect density and the bulk defect density decreased with increasing the RF power. A high RF power (25 W) a-Si:H buffer layer 5 nm thick was deposited on the interface before depositing low RF power (5 W) a-Si:H layer with a low bulk defect density. It has been found that the ideal defect density distribution, which shows the uniform distribution with the very low defect density (4.2×1014 cm) from the i/i interface to the bulk, can be accomplished by 5 nm buffer layer.


1989 ◽  
Vol 65 (2) ◽  
pp. 575-580 ◽  
Author(s):  
V. I. Kuznetsov ◽  
R. C. van Oort ◽  
J. W. Metselaar

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