Effect of Presputtering on the Adhesion of Cu to Teflon

1987 ◽  
Vol 93 ◽  
Author(s):  
Chin-An Chang ◽  
K. C. Lin ◽  
J. E. E. Baglin ◽  
G. Coleman ◽  
J. Park
Keyword(s):  
Surface Morphology ◽  
Chemical Bonding ◽  
Peel Strength ◽  
Cu Films ◽  
Scotch Tape ◽  
Strong Adhesion

ABSTRACTAdhesion between Cu and Teflon has been greatly enhanced by a presputtering treatment of the Teflon prior to the deposition of Cu. Without such a treatment, the Cu-Teflon adhesion is weak, with a peel strength less than 1 gram/mm, and the Cu films can be easily peeled off using scotch tape. With the presputtering treatment, the adhesion rapidly increases, and reaches 50 grams/mm after 30 sec of sputtering. All the sputtered samples show strong adhesion, and the Cu films can only be scratched off forcefully using sharp tools. The presputtering treatment has changed the surface morphology of the Teflon and the deposited Cu layers, and also changes the chemical bonding between Cu and Teflon. The results are discussed to understand the mechanisms involved for the enhanced adhesion observed.

Studies of PQ-100(TM) Polyquinoline Film for Multichip Module(MCM) Applications

1992 ◽  
Vol 264 ◽  
Author(s):  
Kyung W. Paik ◽  
Herbert S. Cole ◽  
Neil H. Hendricks
Keyword(s):  
Surface Morphology ◽  
Chemical Bonding ◽  
Etch Rate ◽  
Peel Strength ◽  
Multichip Module ◽  
Good Adhesion ◽  
Compound Formation ◽  
Poor Adhesion ◽  
Rough Surface Morphology ◽  
Weak Chemical

AbstractOxygen and O2+CF4 RIE showed faster etch rate of PQ-100 film than nonoxygen containing RIE, and caused rough surface morphology. Ti shows good adhesion to the PQ-100 film because of Ti-O and possible Ti-N compound formation at the interface. No diffusion of Ti and Ti-containing precipitates were observed at the Ti/PQ interface even at temperatures of 250 °C. In contrast to the Ti/PQ interface, Cu showed very poor adhesion to the PQ film because of weak chemical bonding. Cu reaction compounds were not observed at the interface at the 250 °C annealing. Ti adhesion to the PQ-100 film was good for control, RIE modified, and water-boiled cases. Initial studies suggest a reduction in peel strength at 250 °C annealing, although this topic must be further addressed to understand the exact mechanism.

scholarly journals Visualization of chemical bonding in a silica-filled rubber nanocomposite using STEM-EELS

2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Yohei K. Sato ◽  
Yasufumi Kuwauchi ◽  
Wakana Miyoshi ◽  
Hiroshi Jinnai
Keyword(s):  
Spatial Distribution ◽  
Silica Nanoparticles ◽  
Chemical Bonding ◽  
Adhesive Layer ◽  
Styrene Butadiene Rubber ◽  
Butadiene Rubber ◽  
Filled Rubber ◽  
Scanning Transmission ◽  
Strong Adhesion ◽  
Matrix Region

AbstractIn nanocomposites, the adhesion between nanofillers and the polymeric matrix is key to the mechanical properties. The strength and spatial distribution of the adhesive layer around the nanofillers are important, particularly the presence of chemical bonding between the nanofillers and matrix. In this work, we studied a styrene-butadiene rubber composite filled with silica nanoparticles to visualize the spatial distribution of the adhesive layer. A silane coupling agent (SCA) was added to the nanocomposite for strong adhesion. The reaction involving the SCA on the silica surface was investigated by scanning transmission electron microscopy combined with electron energy-loss spectroscopy. Si-L2,3 spectra of the silica-filled rubber nanocomposite without the SCA were the same around the nanofillers, whereas in the nanocomposite containing the SCA the spectra were position-dependent. The spectra were fitted with the intensity profiles of the Si-L2,3 spectra of silica and SCA by multiple linear least-squares fitting. The fitting coefficients of silica and SCA were used to map the spatial distribution of the chemical bonding between silica and rubber chains. Chemical bonding was observed around the silica nanoparticles but not in the SBR matrix region, providing direct evidence of the reinforcing mechanism in the silica-filled rubber nanocomposite.

Stress and its Effect on Surface Morphology in Multi-Layer Ti-Cu Films

1996 ◽  
Vol 441 ◽  
Author(s):  
Ping Zhou ◽  
Saps Buchman ◽  
Chris Gray ◽  
John Turneaure ◽  
James E. Turlo
Keyword(s):  
Surface Morphology ◽  
Smooth Surface ◽  
Total Thickness ◽  
Full Understanding ◽  
Gravity Probe B ◽  
Cu Films ◽  
Number Of Layers ◽  
Gravity Probe ◽  
Relativity Mission ◽  
Scanning Electron

AbstractWe have characterized the stress and its effects on surface morphology for multi-layer thin films of about 3μm total thickness, consisting of three or seven layers of Ti and Cu. These films constitute the electrostatic suspension electrodes for the gyroscope housings of the Relativity Mission Gravity Probe B. Full understanding of surface morphology is critical for meeting the complex requirements of this application.The residual stresses have been measured using a laser curvature technique, while the surface morphology was studied by scanning electron microscopy (SEM). We find that the surface morphology depends strongly on the stress, which evolves with the Ti-Cu multi-layer period. Average stress and the resulting surface roughness decrease for thinner Cu layers (increased total number of layers). Seven layer Ti-Cu films with low stress and very smooth surface have been successfully used for the electrodes of the gyroscope housings.

scholarly journals Исследование вольт-амперных характеристик новых гетероструктур MnO-=SUB=-2-=/SUB=-/GaAs(100) и V-=SUB=-2-=/SUB=-O-=SUB=-5-=/SUB=-/GaAs(100), прошедших термическую обработку

2019 ◽  
Vol 53 (8) ◽  
pp. 1074
Author(s):  
Б.В. Сладкопевцев ◽  
Г.И. Котов ◽  
И.Н. Арсентьев ◽  
И.С. Шашкин ◽  
И.Я. Миттова ◽  
...  
Keyword(s):  
Surface Morphology ◽  
Thermal Oxidation ◽  
Current Density ◽  
Chemical Bonding ◽  
Room Temperature ◽  
Reverse Bias ◽  
Electrical Parameters ◽  
Internal Interface ◽  
Current Voltage ◽  
Bias Range

AbstractComplex oxide films with a thickness of about 200 nm are formed during the thermal oxidation of GaAs with magnetron-deposited V_2O_5 and MnO_2 nanolayers. The electrical parameters of the films (reverse-bias breakdown voltage and current density) are determined by the method of current–voltage ( I – V ) characteristics at room temperature in the bias range from –5 to +5 V, and their composition and surface morphology are investigated. It is shown that V_2O_5 facilitates the more intense (in comparison with MnO_2) chemical bonding of arsenic at the internal interface with the formation of As_2O_5. As a result, thermally oxidized V_2O_5/GaAs heterostructures exhibit higher breakdown voltages.

Characterization of Copper Diffusion into Al and Al-1% Si Polycrystalline Thin Films

1995 ◽  
Vol 403 ◽  
Author(s):  
L. H. Walsh ◽  
G. O. Ramseyer ◽  
J. V. Beasock ◽  
H. F. Helbig ◽  
K. P. MacWilliams
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Surface Morphology ◽  
Copper Diffusion ◽  
Cu Films ◽  
Polycrystalline Thin Films ◽  
Sample Depth ◽  
Versus Sample ◽  
Sputter Deposited

AbstractAl and AI-1%Si 900 nanometer thin films were deposited on 100 nanometer Cu films on thermally oxidized (100 nanometer) Si wafers. The Al and Cu films were deposited using evaporation techniques, and the Al-1%Si film was sputter deposited. Different thin film samples were heated in vacuum to 175, 250, 330 and 400°C for 1 hour. The various annealed and original samples were compared using surface morphology, as well as composition versus sample depth. Differences between the Al and Al-1%Si samples are discussed.

Bonding of Butyl and Nitrile Rubber by in situ Copolymer Formation

1989 ◽  
Vol 62 (2) ◽  
pp. 367-385 ◽  
Author(s):  
M. H. Chung ◽  
G. R. Hamed
Keyword(s):  
Molecular Weight ◽  
Peel Strength ◽  
Low Molecular Weight ◽  
Temperature Dependent ◽  
Wlf Equation ◽  
Test Speed ◽  
Strong Adhesion ◽  
Peel Adhesion ◽  
Dependent Failure

Abstract We summarize and conclude the following: 1. The T-peel adhesion between uncrosslinked layers of IIR and NBR is rate and temperature dependent. Failure is interfacial at low rates; bulk cohesive tearing of the rubber occurs at intermediate rates, while interfacial failure returns at high rates. 2. Adhesion data could be reduced to mastercurves with experimentally determined shift factors which were in reasonable agreement with those calculated from the universal WLF equation with a Tg=−69°C. 3. At the lowest test rates, peel specimens containing in situ-formed copolymer had lower strength than those without the copolymer. This is probably due to the easy slippage of the segments of the low-molecular-weight copolymer in this regime. 4. At intermediate rates, in situ copolymer had no effect on peel strength; specimens failed by bulk cohesive tearing of rubber, whether or not the copolymer was present. 5. At high rates, peel specimens containing the copolymer exhibited improved strengths. The behavior is consistent with previous results on the autohesion of elastomers. Interdiffused chains of relatively low molecular weight are only capable of providing strong adhesion when the test speed is sufficiently rapid.

Elasto-Plastic Analysis of the Peel Test for Thin Film Adhesion

1988 ◽  
Vol 110 (3) ◽  
pp. 266-273 ◽  
Author(s):  
Kyung-Suk Kim ◽  
Junglhl Kim
Keyword(s):  
Fracture Toughness ◽  
Interfacial Crack ◽  
Peel Test ◽  
Interfacial Fracture ◽  
Peel Strength ◽  
Interfacial Fracture Toughness ◽  
Cu Films ◽  
Film Adhesion ◽  
Thin Film Adhesion ◽  
Elastoplastic Bending

Analyses have been made to extract the objective interfacial fracture toughness from the peel strength of very thin metallic films. An elastoplastic bending model of the adherend film has been employed in the analyses applying the fracture mechanics concept of steady-state interfacial crack growth. The analytic result finally shown is a universal peel diagram where the objective interfacial fracture toughness is readily readable when the peel strength is known. Experimental results for Cu films on Si and polyimide substrate systems with a Cr interface are also presented.

scholarly journals Design of gecko-inspired fibrillar surfaces with strong attachment and easy-removal properties: a numerical analysis of peel-zone

2012 ◽  
Vol 9 (75) ◽  
pp. 2424-2436 ◽  
Author(s):  
Ming Zhou ◽  
Noshir Pesika ◽  
Hongbo Zeng ◽  
Jin Wan ◽  
Xiangjun Zhang ◽  
...  
Keyword(s):  
Peel Strength ◽  
Geometrical Parameters ◽  
Adhesion Forces ◽  
Rigid Substrate ◽  
Reversible Adhesion ◽  
Fundamental Understanding ◽  
Strong Adhesion ◽  
Strong Attachment ◽  
Peeling Off ◽  
Zone Deformation

Despite successful fabrication of gecko-inspired fibrillar surfaces with strong adhesion forces, how to achieve an easy-removal property becomes a major concern that may restrict the wide applications of these bio-inspired surfaces. Research on how geckos detach rapidly has inspired the design of novel adhesive surfaces with strong and reversible adhesion capabilities, which relies on further fundamental understanding of the peeling mechanisms. Recent studies showed that the peel-zone plays an important role in the peeling off of adhesive tapes or fibrillar surfaces. In this study, a numerical method was developed to evaluate peel-zone deformation and the resulting mechanical behaviour due to the deformations of fibrillar surfaces detaching from a smooth rigid substrate. The effect of the geometrical parameters of pillars and the stiffness of backing layer on the peel-zone and peel strength, and the strong attachment and easy-removal properties have been analysed to establish a design map for bio-inspired fibrillar surfaces, which shows that the optimized strong attachment and easy-removal properties can vary by over three orders of magnitude. The adhesion and peeling design map established provides new insights into the design and development of novel gecko-inspired fibrillar surfaces.

Microstructure and Surface Structure Evolution in AlCu Polycrystalline Thin Films

1999 ◽  
Vol 562 ◽  
Author(s):  
Adriana E. Lita ◽  
John E. Sanchez
Keyword(s):  
Thin Films ◽  
Surface Morphology ◽  
Fiber Orientation ◽  
Film Formation ◽  
Deposition Process ◽  
Structure Evolution ◽  
Average Roughness ◽  
Deposition Rates ◽  
Cu Films ◽  
Polycrystalline Thin Films

ABSTRACTThe evolution of crystallographic texture, grain size and surface morphology in magnetron sputter deposited Al-0.5wt.% Cu polycrystalline thin films is reported as a function of film thickness for SiO2 and SiO2/Ti underlayers for several deposition rates. Regardless of the underlayer type, the initial ≈ 10 nm of the Al-Cu films is nearly randomly oriented, with the films developing a (111) out-of-plane texture which increases in strength with thickness during deposition. The AlCu films on sputtered Ti underlayers developed an exact (111) fiber orientation while Al-Cu films on oxide substrates were offset ≈ 5° from exact fiber orientation. Higher deposition rates were found to result in slightly better (111) textured 20 nm AlCu films. The surface morphology of films, determined by Atomic Force Microscopy (AFM), revealed two regimes of average roughness (Rrms) evolution during deposition. Rrms decreased early in the deposition process, followed by a roughening regime where Rrms increased with thickness. These results are discussed in terms of mechanisms such as grain growth, which help to determine microstructure development during film formation from the vapor.

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