Rapid Thermal Processing for Self-Aligned Silicide Technology

1987 ◽  
Vol 92 ◽  
Author(s):  
Y. H. Ku ◽  
S. K. Lee ◽  
E. Louis ◽  
D. K. Shih ◽  
D. L. Kwong
Keyword(s):  
Thermal Processing ◽  
Ion Beam ◽  
Rapid Thermal Processing ◽  
Device Fabrication ◽  
Titanium Silicide ◽  
Short Channel ◽  
Ion Beam Mixing ◽  
Silicide Layer ◽  
Al Metallization ◽  
Cmos Vlsi

ABSTRACTA self-aligned titanium silicide process which combines the use of ion-beam mixing and rapid thermal processing (RTP) has been developed for CMOS VLSI applications. Shallow silicided junctions are formed by implanting dopants into silicide layers previously formed by ion-beam mixing with Si ions and low temperature annealing, and the subsequent drive-in of the implanted ions into the Si substrate during high temperature RTP. In addition, the formation of TiN on TiSi2 is achieved simultaneously during this process as a diffusion barrier for Al metallization. Short-channel MOS transistors with SALICIDE structure have been successfully fabricated and tested. Results of the impurity diffusion in silicide layer, the impurity segregation at both silicide/Si and oxide/silicide interfaces, contact stabilit of Al/TiN/TiSi2 structure, and device characteristics will be reported. Issues related to this process and its application to submicron device fabrication are discussed and foreseeable problem areas identified.

The Outdiffusion of Boron and Arsenic from Pre-Formed Ion-Beam-Mixed Cobalt Disilicide Layers using Rapid Thermal Processing

1989 ◽  
Vol 146 ◽  
Author(s):  
P. B. Moynagh ◽  
A. A. Brown ◽  
P. J. Rosser
Keyword(s):  
Thermal Processing ◽  
Ion Beam ◽  
Rapid Thermal Processing ◽  
Cobalt Disilicide ◽  
Silicide Layer ◽  
Activation Level ◽  
Order Of Magnitude ◽  
Underlying Substrate

ABSTRACTArsenic out-diffusing from Cobalt Disilicide into underlying silicon displays an enhanced activation level of up to 80%, and an enhanced diffusivity of greater than one order of magnitude. Boron, in contrast, displays a diffusivity as small as 0.25 times that expected. These observations are consistent with a considerable Si-vacancy injection by the silicide layer into the underlying substrate.

A Self-Aligned Silicide Technology using Ion-Beam Mixing, Doped Silicide, and Rapid Thermal Processing

1989 ◽  
Vol 146 ◽  
Author(s):  
Y. H. Ku ◽  
S. K. Lee ◽  
D. L. Kwong ◽  
P. Chu
Keyword(s):  
Thermal Processing ◽  
Ion Beam ◽  
Rapid Thermal Processing ◽  
The Self ◽  
Silicide Formation ◽  
Ion Beam Mixing ◽  
Barrier Formation ◽  
Vlsi Technology ◽  
Junction Formation ◽  
Contact Barrier

ABSTRACTA SALICIDE process is described in this paper, in which ion-beam mixing is used for silicide formation, and doped silicide in conjunction with RTA drive-in are used for shallow silicided junction formation. Fundamental issues related to this process have been investigated, including (i) effects of ion-beam mixing and RTA on the properties of Ti SALICIDE and the interaction between Ti and SiO2; (ii) the self-aligned TiNxOy TiSi2 contact barrier formation and phase transformation; (iii) the mechanism of impurity rediWstrbution and segregation, and junction formation during RTA drive-in; and (iv) the performances and reliability of fabricated SALICIDE devices. Results show that this process may have a great impact on future VLSI technology.

Characterization of Doped Si-TiSi2 Bilayers Formed by Ion Beam Mixing and Rapid Thermal Annealing

1985 ◽  
Vol 45 ◽  
Author(s):  
K. Maex ◽  
R.F. de Keersmaecker ◽  
P.F.A. Alkemade
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Thermal Processing ◽  
Ion Beam ◽  
Rapid Thermal Processing ◽  
Ion Beam Mixing ◽  
Simultaneous Formation ◽  
Impurity Redistribution

ABSTRACTThe use of rapid thermal processing is reported for simultaneous formation of TiSi2 from Ti deposited layers and activation of As or Sb implanted profiles in Si. Properties of the silicide and the doped Si are reported with emphasis on impurity redistribution and defect removal.

Kinetics of Ion Beam Synthesis of Sn and Sb Clusters in SiO2 Layers

2000 ◽  
Vol 647 ◽  
Author(s):  
Sabina Spiga ◽  
Sandro Ferrari ◽  
Marco Fanciulli ◽  
Bernd Schmidt ◽  
Karl-Heinz Heinig ◽  
...  
Keyword(s):  
Size Distribution ◽  
Thermal Processing ◽  
Cluster Size ◽  
Ion Beam ◽  
Rapid Thermal Processing ◽  
Cluster Size Distribution ◽  
Process Conditions ◽  
Ion Beam Synthesis ◽  
Kinetics Of ◽  
Implantation Fluence

AbstractIn this work we investigate the ion beam synthesis of Sn and Sb clusters in thin oxides. 80 keV (fluences of 0.1-1 × 1016 cm−2) Sn implantation in 85 nm thick SiO2, followed by annealing (800-1000°C for 30-300 sec under Ar or N 2 dry ambient) in a rapid thermal processing (RTP) system, leads to the formation of two cluster bands, near the middle of the SiO2 layer and the Si/SiO2 interface. In addition, big isolated clusters are randomly distributed between the two bands. Cluster-size distribution and cluster-crystallinity are related to implantation fluence and annealing time. Low energy (10-12 keV) Sb and Sn implantation (fluences 2-5 × 1015 cm−2) leads to the formation of very uniform cluster-size distribution. Under specific process conditions, only an interface cluster band is observed.

Formation of titanium silicide films by rapid thermal processing

1983 ◽  
Vol 4 (10) ◽  
pp. 380-382 ◽  
Author(s):  
R.A. Powell ◽  
R. Chow ◽  
C. Thridandam ◽  
R.T. Fulks ◽  
I.A. Blech ◽  
...  
Keyword(s):  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Titanium Silicide

Diffusion Modeling of the Redistribution of Ion Implanted Impurities

1985 ◽  
Vol 52 ◽  
Author(s):  
Alwin E. Michel
Keyword(s):  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Device Fabrication ◽  
Diffusion Modeling ◽  
Enhanced Diffusion ◽  
The Common ◽  
Diffusion Mechanisms ◽  
Silicon Device ◽  
Temperature Furnace ◽  
Ion Implanted

ABSTRACTTransient enhanced diffusion during rapid thermal processing has been reported for most of the common dopants employed for silicon device fabrication. For arsenic a large amount of the available data is fit by a computational model based on accepted diffusion mechanisms. Ion implanted boron on the other hand exhibits anomalous tails and transient motiou. A time dependence of this displacement is demonstrated at lower temperatures. High temperature rapid anneals are shown to reduce some of the anomalous motion observed for low temperature furnace anneals. A model is described that links the electrical activation with the diffusion and describes both the transient diffusion of rapid thermal processing and the large anomalous diffusion reported many years ago for furnace anneals.

Formation of Titanium Silicide by Multiple Arsenic Implantations and Ion Beam Mixing

1991 ◽  
Vol 224 ◽  
Author(s):  
Po-Ching Chen ◽  
Jian-Yang Lin ◽  
Huey-Liang Hwang
Keyword(s):  
Electron Diffraction ◽  
Sheet Resistance ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Ion Beam ◽  
Titanium Silicide ◽  
Mixing Conditions ◽  
Cross Sectional ◽  
Ion Beam Mixing ◽  
Post Annealing

AbstractTitanium silicide was formed on the top of Si wafers by arsenic ion beam mixing and rapid thermal annealing. Three different arsenic-ion mixing conditions were examined in this work. The sheet resistance, residue As concentration post annealing and TiSi2 phase were characterized by using the* four-point probe, RBS and electron diffraction, respectively. TiSi2 of C54 phase was identified in the doubly implanted samples. The thickness of the Ti silicide and the TiSi2/Si interface were observed by the cross-sectional TEM.

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