Low Temperature B Activation in SOI Using Optimised Vacancy Engineering Implants
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AbstractIn this study 300keV and 1MeV Si vacancy engineering implants have been used to optimise the activation of a 2keV 1×1015cm-2 B implant into SOI. Although the two implants generate a similar areal density of excess vacancies in the SOI top layer, Hall Effect measurements show that low temperature activation is possible to a greater level with the 300keV Si co-implant than with the 1MeV implant. Hall and SIMS data are consistent with a high level of activation of the B at 700°C, with no significant diffusion at the metallurgical junction depth.
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1967 ◽
Vol 24
(2)
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pp. 481-486
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1988 ◽
Vol 57
(6)
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pp. 311-314
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1983 ◽
Vol 51
(3)
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pp. 205-208
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2018 ◽
Vol 31
(3)
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pp. 20
1971 ◽
Vol 3
(3)
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pp. 401-405
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