Stretchable conductors: thin gold films on silicone elastomer

2003 ◽  
Vol 795 ◽  
Author(s):  
Stéphanie P. Lacour ◽  
Sigurd Wagner ◽  
Z. Suo

ABSTRACTThin stripes of gold deposited onto elastomeric substrates can be stretched reversibly by more than 20 % while remaining electrically conducting. We are developing such stripes to serve as electrical interconnects on stretchable electronic skins. The gold layers are 25-nm to 500-nm thick. We observe two different film morphologies: the stripe is either buckled and continuous, or flat and contains micrometer-long cracks. Stretchability is correlated with the thickness and initial topography of the gold layer. Stripes thicker than 100-nm fail electrically at tensile strain of ∼ 1 %, while thinner stripes remain conducting up to much larger strain. Upon stretching the buckled stripes flatten and break into islands of 1 to 100 micrometers on a side, while the initially microcracked stripes retain their micrometer scale structure. The electrical resistance of the buckled stripes is the lowest but the micro-textured stripes can be stretched more.

2019 ◽  
Vol 6 (6) ◽  
pp. 066407 ◽  
Author(s):  
A I Oliva ◽  
L Ruiz-Tabasco ◽  
J Ojeda-García ◽  
J E Corona ◽  
V Sosa ◽  
...  

MRS Advances ◽  
2016 ◽  
Vol 1 (1) ◽  
pp. 15-20 ◽  
Author(s):  
Jake Rabinowitz ◽  
Gregory Fritz ◽  
Parshant Kumar ◽  
Peter Lewis ◽  
Mikel Miller ◽  
...  

ABSTRACTIn this work, we propose a model to quantify strain induced conductor discontinuities based on measuring electrical resistance while applying tensile strain to metal-polymer systems. Under strain, changing conductor geometry and induced conductor discontinuity increase electrical resistance. On Kapton substrates strained to ε = .07, evaporated gold films did not deform and resistance increase was only caused by geometry change. Conversely, discontinuity caused 31% and 72% of the resistance increase in evaporated and printed silver films at the same strain. On PDMS substrates, the same magnitude of discontinuity, causing 31% of the resistance increase, occurred at only ε = .024 in evaporated silver films. At the same strain, discontinuity caused 86% of the resistance increase in evaporated gold films. Printed silver films were inelastic. The results suggest that traditional fabrication techniques may be more suitable to flexible hybrid electronics applications than additively manufactured conductors.


2006 ◽  
Vol 16 (01) ◽  
pp. 397-407 ◽  
Author(s):  
Stéphanie P. Lacour ◽  
Joyelle Jones ◽  
Sigurd Wagner ◽  
Teng Li ◽  
Z. Suo

Elastomeric interconnects made of patterned thin gold films on silicone membranes, can be reversibly bent, uniaxially or radially stretched while remaining electrically conducting. Such interconnects can be stretched to double their length, cycled 1,000 times without electrical failure. While the electrical resistance may increase threefold upon stretching, the resistance values still remain ~1,000 times below the typical input impedance of amorphous silicon thin film transistors. Therefore the stretchable gold films can function as interconnects for power and signal to a fully elastic thin film transistor inverter.


1968 ◽  
Vol 39 (6) ◽  
pp. 2948-2953 ◽  
Author(s):  
P. A. B. Toombs ◽  
P. Bennett

1965 ◽  
Vol 4 (3) ◽  
pp. 161-164 ◽  
Author(s):  
Akira Kinbara ◽  
Yuji Sawatari

2005 ◽  
Vol 863 ◽  
Author(s):  
Joyelle Jones ◽  
S.P. Lacour ◽  
Sigurd Wagner

AbstractDeformable, large-area electronic surfaces are desirable for many human-machine interfaces. The goal of our research is to fabricate elastically deformable electronics by integrating electronic devices and stretchable interconnects onto a flexible substrate. The focus of this paper is the fabrication and electrical performance of the stretchable interconnects. Au was deposited onto a silicone elastomer (PDMS) and patterned to achieve a resolution of 2 μm. Two patterning techniques are presented: patterning by shadow mask and patterning by photolithography. Photolithographic patterning on PDMS is not straightforward. First, we discuss the challenges in patterning and then the morphology of lines patterned by both techniques. The electrical resistance of the Au lines under tensile strain is presented. Interconnects patterned by shadow mask remain electrically conductive up to 100 % strain. Those patterned by photolithography maintain electrical conductivity when strained up to 60 %.


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