Effect of Si Implantation and Rapid Thermal Annealing on GaAs/AlGaAs Superlattice Disordering.

1986 ◽  
Vol 77 ◽  
Author(s):  
J. D. Flood ◽  
G. Bahir ◽  
J. L. Merz ◽  
J. Kobayashi ◽  
T. Fukunaga ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Electron Gas ◽  
Average Composition ◽  
Furnace Annealing ◽  
Strong Emission ◽  
Disordered Layer ◽  
Low Temperature Photoluminescence

ABSTRACTThe enhanced disordering of GaAs/AlGaAs superlattices by diffusion of Zn or Si has been reported by many authors. In the case of Si diffusion, the Si can be introduced during epitaxial growth, by implantation, or by diffusion from a sputtered Si mask. In this paper ion implantation is investigated, and the effect of rapid thermal annealing (RTA), used to minimize Si diffusion while eliminating the implant damage, is compared with furnace annealing (FA). Using low temperature photoluminescence (PL) and SIMS, it is found that no disordering of a GaAs/Al0.5Ga0.5As superlattice takes place for a 2 sec anneal at 900°C, and very minimal partial disordering is observed (reproducibly) for a 10 sec anneal at 970°C. This is in sharp contrast with the FA case (850°C for 30 min), for which significant disordering occurs. The PL spectra show luminescence from both GaAs and GaAs/Al0.5Ga0.5As layers in the case of high-temperature RTA suggesting that recrystallization has occurred without disorder, whereas strong emission is observed after FA which corresponds to a disordered layer of average-composition GaAs/Al0.15Ga0.25As In both cases, PL indicates that annealing of the implant damage has occurred. Thus, damage can be eliminated either with or without disordering the superlattice by using FA or RTA, respectively. This is important for 2-D electron gas structures, for which no broadening of the hetero-interface is desired.

Enhanced Formation of Thermal Donors in Germanium Doped Czochralski Silicon Pretreated by Rapid Thermal Annealing

2007 ◽  
Vol 131-133 ◽  
pp. 393-398 ◽  
Author(s):  
Xin Zhu ◽  
De Ren Yang ◽  
Ming Li ◽  
Can Cui ◽  
Lei Wang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Furnace Annealing ◽  
Thermal Donor ◽  
Low Temperature Annealing ◽  
Initial Stage ◽  
Donor Formation ◽  
Oxygen Precipitates ◽  
Ge Doping

The thermal donor formation at 425oC - 450oC in Ge doped Czochralski (GCZ) silicon having about 1016 cm-3 Ge content pretreated by rapid thermal annealing (RTA) and conventional furnace annealing (CFA) has been investigated using low-temperature infrared spectroscopy (LT-IR). The measurements prove that lightly Ge doping can enhance the formation of thermal double donors in the initial stage of the low temperature annealing after RTA process. Ge induced additional grown-in oxygen precipitates during silicon ingot growth and the abundant self-interstitials during RTA may be the reason for the enhancement. However, after extending the annealing time at the low temperatures, the thermal donor concentration in the GCZ silicon is lower than that in the conventional CZ silicon. In final, the mechanism is also discussed.

omparisons of Silicide Formation by Rapid Thermal Annealing and Conventional Furnace Annealing

1987 ◽  
Vol 92 ◽  
Author(s):  
E. Ma ◽  
M. Natan ◽  
B.S. Lim ◽  
M-A. Nicolet
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Silicide Formation ◽  
X Ray Diffraction ◽  
Furnace Annealing ◽  
Cross Sectional ◽  
Conventional Furnace ◽  
Diffusion Controlled ◽  
Conventional Furnace Annealing ◽  
Kinetics Of

ABSTRACTSilicide formation induced by rapid thermal annealing (RTA) and conventional furnace annealing (CFA) in bilayers of sequentially deposited films of amorphous silicon and polycrystalline Co or Ni is studied with RBS, X-ray diffraction and TEM. Particular attention is paid to the reliability of the RTA temperature measurements in the study of the growth kinetics of the first interfacial compound, Co2Si and Ni2Si, for both RTA and CFA. It is found that the same diffusion-controlled kinetics applies for the silicide formation by RTA in argon and CFA in vacuum with a common activation energy of 2.1+0.2eV for Co2Si and 1.3+0.2eV for Ni Si. Co and Ni atoms are the dominant diffusing species; during silicide formation by both RTA and CFA. The microstructures of the Ni-silicide formed by the two annealing techniques, however, differs considerably from each other, as revealed by cross-sectional TEM studies.

Correlation Between Defect Characteristics and Layer Intermixing in Si Implanted GaAs/AIGaAs Superlattices

1989 ◽  
Vol 147 ◽  
Author(s):  
Samuel Chen ◽  
S.-Tong Lee ◽  
G. Braunstein ◽  
G. Rajeswaran ◽  
P. Fellinger
Keyword(s):  
Ion Implantation ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Peak Position ◽  
Compound Semiconductor ◽  
Subsequent Annealing ◽  
Semiconductor Superlattices ◽  
Furnace Annealing ◽  
Annealing Conditions ◽  
Induced Defects

AbstractDefects induced by ion implantation and subsequent annealing are found to either promote or suppress layer intermixing in Ill-V compound semiconductor superlattices (SLs). We have studied this intriguing relationship by examining how implantation and annealing conditions affect defect creation and their relevance to intermixing. Layer intermixing has been induced in SLs implanted with 220 keV Si+ at doses < 1 × 1014 ions/cm2 and annealed at 850°C for 3 hrs or 1050°C for 10 s. Upon furnace annealing, significant Si in-diffusion is observed over the entire intermixed region, but with rapid thermal annealing layer intermixing is accompanied by negligible Si movement. TEM showed that the totally intermixed layers are centered around a buried band of secondary defects and below the Si peak position. In the nearsurface region layer intermixing is suppressed and is only partially completed at ≤1 × 1015 Si/cm2. This inhibition is correlated to a loss of the mobile implantation-induced defects, which are responsible for intermixing.

Substrates Dependent Low Temperature Fabrication of Silver Nanoparticles Using Rapid Thermal Annealing for Light Trapping Application

2018 ◽  
Vol 18 (11) ◽  
pp. 7739-7748 ◽  
Author(s):  
Bidyut Barman ◽  
Hrishikesh Dhasmana ◽  
Abhishek Verma ◽  
Amit Kumar ◽  
D. N Singh ◽  
...  
Keyword(s):  
Silver Nanoparticles ◽  
Low Temperature ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Light Trapping

scholarly journals Interfacial reactions of Ni on Si1−xGex (x=0.2, 0.3) at low temperature by rapid thermal annealing

2002 ◽  
Vol 92 (1) ◽  
pp. 214-217 ◽  
Author(s):  
H. B. Zhao ◽  
K. L. Pey ◽  
W. K. Choi ◽  
S. Chattopadhyay ◽  
E. A. Fitzgerald ◽  
...  
Keyword(s):  
Low Temperature ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Interfacial Reactions

Characterizations of Ultra-thin Dielectrics Grown by Microwave Afterglow O2/N2O Plasma Oxidation at Low Temperature with Rapid Thermal Annealing

1995 ◽  
Vol 387 ◽  
Author(s):  
Po-ching Chen ◽  
Klaus Yung-jane Hsu ◽  
Joseph J. Loferski ◽  
Huey-liang Hwang
Keyword(s):  
Low Temperature ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Photoelectron Spectroscopy ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Plasma Oxidation ◽  
X Ray ◽  
Thin Dielectrics

AbstractMicrowave afterglow plasma oxidation at a low temperature (600 °C ) and rapid thermal annealing (RTA) were combined to grow high quality ultra-thin dielectrics. This new approach has a low thermal budget. The mid-gap interface state density of oxides pretreated in N2O plasma was decreased to about 5×1010 cm−2eV−1 after rapid thermal annealing at 950 °C.It was found that RTA is very effective for relieving the oxide stress and reducing the interface state density. Nitrogen incorporated in oxides by the N2O plasma pretreatment of the Si surface helped to reduce the interface state density. Microstructures of ultra-thin oxide grown by microwave afterglow oxidation with or without RTA were revealed by extended-X-ray-absorption-finestructure (EXAFS) and X-ray photoelectron spectroscopy (XPS) analysis.

Rapid Thermal Annealing of Neutron Transmutation Toped Czochralski Silicon

1992 ◽  
Vol 262 ◽  
Author(s):  
G. M. Berezina ◽  
F. P. Kdrshunov ◽  
N. A. Sobolev ◽  
A. V. Voevodova ◽  
A. A. Stuk
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Neutron Irradiation ◽  
Irradiation Temperature ◽  
Electrical Parameters ◽  
Furnace Annealing ◽  
Annealing Behaviour ◽  
Czochralski Silicon ◽  
Neutron Transmutation

ABSTRACTThe influence of the rapid thermal annealing (RTA) in comparison with that of the standard furnace annealing (FA) on the electrical parameters and photoluminescence (PL) of Czochralski silicon (Cz Si) subjected to neutron irradiation at various temperatures has been studied. The role of the irradiation temperature on the annealing behaviour of electrical parameters in Cz Si has been established. The possibility of getting neutron transmutation doped (NTD) Cz Si having the calculated resistivity by means of the RTA is shown.

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