Transient Enhanced Diffusion in B+ and P+ Implanted Silicon

1986 ◽  
Vol 74 ◽  
Author(s):  
S. J. Pennycook ◽  
R. J. Culbertson
Keyword(s):  
Heat Treatment ◽  
Point Defects ◽  
Diffusion Coefficients ◽  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Temperature Dependent ◽  
Enhanced Diffusion ◽  
Thermally Activated ◽  
Transient Enhanced Diffusion ◽  
And Diffusion

AbstractWe report the transient enhanced diffusion of supersaturated phosphorus in ion-implanted SPE grown Si. Precipitation proceeds rapidly to a metastable SiP phase, which can be converted to an orthorhombic form or redissolved by subsequent heat treatment. The effects are strongly temperature dependent, and consistent with the trapped interstitial model. The behavior of different dopants follows their relative interstitialcy diffusion coefficients. The results suggest that ion implantation induced point defects dominate over thermally activated point defects during low temperature and certain rapid thermal processing, controlling dopant deactivation and diffusion in crystalline or amorphous silicon, and can also affect the SPE growth rate.

Rapid Thermal Processing and The Quest for Ultra Shallow Boron Junctions

1986 ◽  
Vol 71 ◽  
Author(s):  
Tom Sedgwick
Keyword(s):  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Attractive Potential ◽  
High Activation ◽  
Shallow Junction ◽  
Enhanced Diffusion ◽  
Transient Enhanced Diffusion ◽  
Diffusion Effects ◽  
Junction Formation ◽  
Short Time

AbstractRapid Thermal Processing (RTP) can minimize processing time and therefore minimize dopant motion during annealing of ion implanted junctions. In spite of the advantage of short time annealing using RTP, the formation of shallow B junctions is thwarted by channeling, transient enhanced diffusion and concentration enhanced diffusion effects all of which lead to deeper B profiles. Channeling and transient enhanced diffusion can be avoided by preamorphizing the silicon before the B implant. However, defects at the original amorphous/crystal boundary persist after annealing. Very low energy B implantation can lead to very shallow dopant profiles and in spite of channeling effects, offers an attractive potential shallow junction technology. In all of the shallow junction formation techniques RTP is required to achieve both high activation of the implanted species and minimal diffusion of the implanted dopant.

Rapid Thermal Processing of Implanted GaN Up to 1500°C

1998 ◽  
Vol 537 ◽  
Author(s):  
X. A. Cao ◽  
S. J. Pearton ◽  
R. K. Singh ◽  
C. R. Abernathy ◽  
J. Han ◽  
...  
Keyword(s):  
Point Defect ◽  
Diffusion Coefficients ◽  
Thermal Processing ◽  
Effective Diffusion ◽  
Rapid Thermal Processing ◽  
Strong Reduction ◽  
Lattice Disorder ◽  
Enhanced Diffusion ◽  
Effective Diffusion Coefficients ◽  
Activation Efficiency

AbstractGaN implanted with donor(Si, S, Se, Te) or acceptor (Be, Mg, C) species was annealed at 900-1500°C using AIN encapsulation. No redistribution was measured by SIMS for any of the dopants and effective diffusion coefficients are ≤2×10-13 cm2 s-1 at 1400°C, except Be, which displays damage-enhanced diffusion at 900°C and is immobile once the point defect concentration is removed. Activation efficiency of ∼90% is obtained for Si at 1400°C. TEM of the implanted material shows a strong reduction in lattice disorder at 1400-1500°C compared to previous results at 1100°C. There is minimal interaction of the sputtered AIN with GaN under our conditions, and it is readily removed selectively with KOH.

scholarly journals Rapid Thermal Processing of Implanted GaN up to 1500°C

1999 ◽  
Vol 4 (S1) ◽  
pp. 671-677 ◽  
Author(s):  
X. A Cao ◽  
S. J. Pearton ◽  
R. K. Singh ◽  
C. R. Abernathy ◽  
J. Han ◽  
...  
Keyword(s):  
Point Defect ◽  
Diffusion Coefficients ◽  
Thermal Processing ◽  
Effective Diffusion ◽  
Rapid Thermal Processing ◽  
Strong Reduction ◽  
Lattice Disorder ◽  
Enhanced Diffusion ◽  
Effective Diffusion Coefficients ◽  
Activation Efficiency

GaN implanted with donor(Si, S, Se, Te) or acceptor (Be, Mg, C) species was annealed at 900-1500 °C using AlN encapsulation. No redistribution was measured by SIMS for any of the dopants and effective diffusion coefficients are ≤2 × 10−13 cm2. s−1 at 1400 °C, except Be, which displays damage-enhanced diffusion at 900 °C and is immobile once the point defect concentration is removed. Activation efficiency of ∼90% is obtained for Si at 1400 °C. TEM of the implanted material shows a strong reduction in lattice disorder at 1400-1500 °C compared to previous results at 1100 °C. There is minimal interaction of the sputtered AlN with GaN under our conditions, and it is readily removed selectively with KOH.

Diffusion of Zn into Gaas 0.6 P0.4:Te From Zn-Doped Oxide Films By Rapid Thermal Processing

1987 ◽  
Vol 92 ◽  
Author(s):  
A. Usami ◽  
Y. Tokuda ◽  
H. Shiraki ◽  
H. Ueda ◽  
T. Wada ◽  
...  
Keyword(s):  
Diffusion Coefficient ◽  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Oxide Films ◽  
Zn Diffusion ◽  
Enhanced Diffusion ◽  
Conventional Furnace ◽  
Zn Concentration ◽  
The Difference ◽  
Doped Oxide

ABSTRACTRapid thermal processing using halogen lamps was applied to the diffusion of Zn into GaAs0.6 P0.4:Te from Zn-doped oxide films. The Zn diffusion coefficient of the rapid thermal diffused (RTD) samples at 800°C for 6 s was about two orders of magnitude higher than that of the conventional furnace diffused samples at 800°C for 60 min. The enhanced diffusion of Zn by RTD may be ascribed to the stress field due to the difference in the thermal expansion coefficient between the doped oxide films and GaAs0.6P0.4 materials, and due to the temperature gradient in GaAs0.6P0 4 materials. The Zn diffusion coefficient at Zn concentration of 1.0 × l018 cm−3 was 3.6 × 10−11, 3.1 × 10−11 and 5.0 × 10−12 cm2 /s for the RTD samples at 950°C for 6 s from Zn-, (Zn,Ga)- and (Zn,P)-doped oxide films, respectively. This suggests that Zn diffusibility was controlled by the P in the doped oxide films.

ON THE ROLE OF STACKING FAULTS IN SOME PROBLEMS OF GLIDE AND TWINNING IN CUBIC METALS

1967 ◽  
Vol 45 (2) ◽  
pp. 481-492 ◽  
Author(s):  
B. Escaig ◽  
G. Fontaine ◽  
J. Friedel
Keyword(s):  
Point Defects ◽  
Stacking Faults ◽  
Stacking Fault ◽  
Dislocation Network ◽  
Thermal Variation ◽  
Temperature Dependent ◽  
Cubic Metals ◽  
Thermally Activated ◽  
Stacking Fault Energies

The possible role of stacking faults is discussed in some problems of glide and twinning of cubic metals, especially at low temperatures.The first part analyzes a model for the thermal variation of macroyield in b.c.c. metals. If one assumes that the dislocations of such metals split along either the (110) or the (112) planes, the screw dislocations will be sessile. The strong temperature variation of macroyield could be due to the thermally activated slip of such screws, previously developed at lower stresses during the less temperature-dependent microyield. Reasonably high stacking-fault energies are required for satisfactory numerical fits.The second part studies the influence of a dense dislocation network on the propagation of a stacking fault. The friction force acting on the partial that propagates the fault must be taken into account when deducing a stacking-fault energy from the stress at which stacking faults develop in a strongly work-hardened (f.c.c.) metal. The trails of dipoles left at each tree crossed should prevent any creation of point defects; they should lead, after the faults have propagated some length, to its multiplication into a twin or martensitic lamella. The analogies with problems of slip bauds and dipole formation in easy glide are stressed.

Investigation of Fluorine Effect on the Boron Diffusion by Mean of Boron Redistribution in Shallow Delta-doped Layers

2004 ◽  
Vol 810 ◽  
Author(s):  
A. Halimaoui ◽  
J. M. Hartmann ◽  
C. Laviron ◽  
R. El-Farhane ◽  
F. Laugier
Keyword(s):  
Point Defects ◽  
Depth Profiling ◽  
Boron Diffusion ◽  
Enhanced Diffusion ◽  
Boron Doped ◽  
Transient Enhanced Diffusion ◽  
Sims Depth Profiling

ABSTRACTPreviously published articles have shown that co-implanted fluorine reduces transient enhanced diffusion of boron. However, it is not yet elucidated whether this effect is due to interaction of fluorine with point-defects or boron atoms. In this work, we have used boron redistribution in a shallow Delta-doped Si structures in order to get some insights into the role of fluorine in the boron diffusion. The structures consisted of 3 boron-doped layers separated by 40nm-thick undoped silicon. The samples were given to Ge preamorphization and F co-implant. SIMS depth profiling was used to analyse boron redistribution after annealing. The results we obtained strongly suggest that fluorine is not interacting with point-defects. The reduction in boron TED is most probably due to boron-fluorine interaction.

Diffusion Modeling of the Redistribution of Ion Implanted Impurities

1985 ◽  
Vol 52 ◽  
Author(s):  
Alwin E. Michel
Keyword(s):  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Device Fabrication ◽  
Diffusion Modeling ◽  
Enhanced Diffusion ◽  
The Common ◽  
Diffusion Mechanisms ◽  
Silicon Device ◽  
Temperature Furnace ◽  
Ion Implanted

ABSTRACTTransient enhanced diffusion during rapid thermal processing has been reported for most of the common dopants employed for silicon device fabrication. For arsenic a large amount of the available data is fit by a computational model based on accepted diffusion mechanisms. Ion implanted boron on the other hand exhibits anomalous tails and transient motiou. A time dependence of this displacement is demonstrated at lower temperatures. High temperature rapid anneals are shown to reduce some of the anomalous motion observed for low temperature furnace anneals. A model is described that links the electrical activation with the diffusion and describes both the transient diffusion of rapid thermal processing and the large anomalous diffusion reported many years ago for furnace anneals.

Modelling of Temperature Distribution of Semiconductors During Rapid Thermal Processing

1994 ◽  
Vol 342 ◽  
Author(s):  
Andreas Tillmann
Keyword(s):  
Temperature Distribution ◽  
Material Property ◽  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Two Dimensional ◽  
Temperature Uniformity ◽  
Temperature Dependent ◽  
Incident Intensity ◽  
Circular Test ◽  
Contour Plots

ABSTRACTThe modelling of temperature distribution on semiconductor wafers in common RTP-equipment is described. The incident intensity distribution on the wafer is calculated using raytracing. Based on this distribution the temperature distribution on the wafer is determined solving the two-dimensional heat conduction equation. If the dependence of a considered material property on the process temperature is known, the calculated temperature distribution can be convened to a distribution of this parameter.The distinctive feature of the described algorithms is the two-dimensional treatment of the distributions using a grid of ring segments, each with equal area. This grid is identical to the usual circular test patterns of multipoint measurement equipment. This is convenient since the evaluation of temperature uniformity in RTP equipment is done mostly by mapping an appropriate temperature dependent material property. All calculated distributions can be presented by contour plots as well as 3-D plots. This results in a very suitable method to compare simulated and experimental wafer maps.The agreement between simulated and experimental temperature distributions is shown.

Fabrication and Dielectric Properties of Phase-Pure Ba2Ti9O20 Microwave Resonators

1996 ◽  
Vol 453 ◽  
Author(s):  
Wen-Yi Lin ◽  
Rosario A. Gerhardt ◽  
Robert F. Speyer ◽  
Wesley S. Hackenberger ◽  
Thomas R. Shrout
Keyword(s):  
Heat Treatment ◽  
Solid Solution ◽  
Thermal Processing ◽  
Substitutional Solid Solution ◽  
Dielectric Constants ◽  
Quality Factors ◽  
Heating Rates ◽  
Temperature Dependent ◽  
Microwave Resonators ◽  
Phase Pure

AbstractThe thermal processing schedules necessary to form phase pure Ba2TigO20, with and without substitutional solid solution were investigated. Undoped compositions formed the compound most easily under rapid (500°C/min) heating rates, where diffusional agglomeration of the. TiO2 batch constituent was minimized. The compound formed most easily with minor (0.82%) substitutions of SnO2 and ZrO2 for TiO2. The solubility of Sn in Ba2Ti9O20 was higher than that of Zr. Extended heat treatment (16 vs. 6 h at 1390°C) resulted in volitalization of grain boundary liquid phase, leading to a more porous and slightly degraded resonators. The effects of dopant concentrations and soak periods at 1390°C on dielectric constants and temperature-dependent quality factors are reported.

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