Deformable interconnects for conformal integrated circuits

2002 ◽  
Vol 736 ◽  
Author(s):  
Stéphanie Périchon Lacour ◽  
Zhenyu Huang ◽  
Zhigang Suo ◽  
Sigurd Wagner
Keyword(s):  
Integrated Circuits ◽  
Layer Thickness ◽  
Electrical Resistance ◽  
Mechanical Response ◽  
Tensile Deformation ◽  
Gold Layer ◽  
Maximum Strain ◽  
Silicone Membrane ◽  
Compliant Substrate ◽  
Gold Layer Thickness

ABSTRACTThe electro-mechanical response of thin gold layers evaporated onto silicone substrates is reported. Gold layers are prepared either thin and flat or thin and wavy on the compliant substrate. The electrical resistance of gold/silicone stripes is measured and analyzed during tensile deformation. For a 100-nm thick gold layer evaporated on a 1-mm thick silicone membrane, we have observed electrical continuity up to ∼ 22 % strain. This maximum strain decreases when the gold layer thickness is raised.

scholarly journals Multi-response optimization of chromium/gold-based nanofilm Kretschmann-based surface plasmon resonance glucose sensor using finite-difference time-domain and Taguchi method

2020 ◽  
Vol 10 ◽  
pp. 184798042098211
Author(s):  
Najmiah Radiah Mohamad ◽  
Mohd Farhanulhakim Mohd Razip Wee ◽  
Mohd Ambri Mohamed ◽  
Azrul Azlan Hamzah ◽  
P Susthitha Menon
Keyword(s):  
Surface Plasmon Resonance ◽  
Layer Thickness ◽  
Surface Plasmon ◽  
Plasmon Resonance ◽  
Finite Difference Time Domain ◽  
Gold Layer ◽  
Full Width ◽  
Optical Wavelength ◽  
Factor Effect ◽  
Gold Layer Thickness

Kretschmann-based surface plasmon resonance sensor utilizing chromium and gold nanofilms is ideal for label-free biomedical sensing. In this work, Taguchi’s L9 orthogonal array method was used to optimize the effects of three control factors and noise factor, which are the incident optical wavelength, chromium and gold nanofilm thicknesses, and their root-mean-square surface roughness, on the performance of the Kretschmann-based surface plasmon resonance sensor. The control factors were varied at three levels for a novel multi-response optimization of the Kretschmann-based surface plasmon resonance sensor for the minimum reflectivity, the full-width-at-half-maximum, and the sensitivity of 3% glucose detection, executed using Lumerical’s two-dimensional finite-difference time-domain method. Using Taguchi method, the best control factor setting in air was A3B2C2 corresponding to 785 nm optical wavelength, 0.5 nm chromium, and 50 nm gold layer thickness, respectively, with minimum reflectivity of 0.0017%, full-width-at-half-maximum of 0.4759°, and glucose-sensing sensitivity of 106.73°·RIU−1. The detection accuracy and quality factor were 0.01 and 224.26 RIU−1, respectively. It was also indicated that chromium nanofilm thickness of 0.5–3 nm and its root-mean-square surface roughness has a negligible factor effect compared to other control factors. Taguchi method’s factor effect analysis showed that for chromium layer thickness of 1–3 nm, the minimum reflectivity values are predominantly determined by the gold layer thickness with 75% factor effect, followed by optical wavelength with 11%. Factor effect of full-width-at-half-maximum is determined by optical wavelength (57%), followed by gold layer thickness (38%). Sensitivity is 88% determined by optical wavelength and 10% determined by gold layer thickness. The Kretschmann-based surface plasmon resonance glucose sensor with the best glucose-sensing sensitivity was at optical wavelength of 632.8 nm with a higher sensitivity value of 163.415°·RIU−1 but lower detection accuracy and quality factor values of 0.001 and 24.86 RIU−1, respectively, compared to near-infrared wavelength of 785 nm. In conclusion, finite-difference time-domain and Taguchi method is suitable for multi-response optimization of control and noise factors of Kretschmann-based surface plasmon resonance sensors.

Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

2003 ◽  
Vol 125 (4) ◽  
pp. 609-616 ◽  
Author(s):  
G. B. Dou ◽  
Y. C. Chan ◽  
Johan Liu
Keyword(s):  
Layer Thickness ◽  
Numerical Solutions ◽  
Gold Layer ◽  
Conductive Adhesive ◽  
Nickel Layer ◽  
Anisotropic Conductive Adhesive ◽  
Transformation Factor ◽  
Primary Object ◽  
Resistance Function ◽  
Gold Layer Thickness

In anisotropic conductive adhesive (ACA) interconnections, the particles are electrical conductors providing current paths in the fine pitch electronic packaging as well as physical parts connecting with the chip bumps and the substrate pads through the mechanical deformation interfaces. The primary object of this fundamental research is to reveal the electrical conductive characteristics of Ni/Au coated resin particles. Such an ACA particle resistance is resulted from two metal coated layers, which are two parallel resistors in the circuit determined by the particle transformation degree. In order to investigate the effect of the particle transformation degree upon the particle resistance, the particle transformation factor is defined. The mathematical electrical resistance function of an ACA particle, an integral function of the transformation factor and the particle geometries, resin diameter, nickel layer thickness, and gold layer thickness, is worked out from the physical model of an ACA particle. To carry out the solutions of the function, MathCAD software is applied. According to the numerical solutions, the deeper the particle transformation, the thicker the metal coated layer thicknesses and the longer the resin diameter are, the lower the particle resistance is. In conclusion, it is stated that the ACA particle resistance is determined by the particle transformation and the particle geometries, however, the transformation and the nickel layer thickness are more sensitive than the resin diameter and the gold layer thickness. Finally, the resistance function will explain the conductive mechanism of the deformed ACA particle.

Continuum Description of the Time- and Strain-Dependent Poisson’s Ratio of Ligament Under Finite Deformation

2013 ◽  
Author(s):  
Aaron M. Swedberg ◽  
Shawn P. Reese ◽  
Steve A. Maas ◽  
Benjamin J. Ellis ◽  
Jeffrey A. Weiss
Keyword(s):  
Large Scale ◽  
Mechanical Response ◽  
Tensile Deformation ◽  
Large Strain ◽  
Fiber Direction ◽  
Strain Behavior ◽  
Nonlinear Stress ◽  
Poisson's Ratios ◽  
Poisson’S Ratios ◽  
Strain Dependent

Ligament volumetric behavior controls fluid and thus nutrient movement as well as the mechanical response of the tissue to applied loads. The reported Poisson’s ratios for tendon and ligament subjected to tensile deformation loading along the fiber direction are large, ranging from 0.8 ± 0.3 in rat tail tendon fascicles [1] to 2.98 ± 2.59 in bovine flexor tendon [2]. These Poisson’s ratios are indicative of volume loss and thus fluid exudation [3,4]. We have developed micromechanical finite element models that can reproduce both the characteristic nonlinear stress-strain behavior and large, strain-dependent Poisson’s ratios seen in tendons and ligaments [5], but these models are computationally expensive and unfeasible for large scale, whole joint models. The objectives of this research were to develop an anisotropic, continuum based constitutive model for ligaments and tendons that can describe strain-dependent Poisson’s ratios much larger than the isotropic limit of 0.5. Further, we sought to demonstrate the ability of the model to describe experimental data, and to show that the model can be combined with biphasic theory to describe the rate- and time-dependent behavior of ligament and tendon.

Stretchability of complex patterns of thin metal conductors on elastomeric skin

2004 ◽  
Vol 854 ◽  
Author(s):  
Stéphanie P. Lacour ◽  
Sigurd Wagner
Keyword(s):  
Electrical Properties ◽  
Integrated Circuits ◽  
Electrical Conduction ◽  
Thin Metal ◽  
Silicone Membrane ◽  
Uniaxial Stretching ◽  
Biaxial Stretching ◽  
Mechanical And Electrical Properties ◽  
Electrical Interconnects ◽  
Thick Gold

ABSTRACTWe have previously shown that 25nm thick gold stripes on 1mm thick silicone membrane retain electrical conduction when stretched up to 100% along their long dimension. To function as electrical interconnects in conformable integrated circuits, the metallization must be stretchable in arbitrary directions. Therefore we have made and tested the mechanical and electrical properties of complex conductor patterns including X and Y oriented lines and cross junctions. We find that the metal patterns continue to conduct under uniaxial stretching in the X or Y direction and under radial, biaxial stretching.

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