Microstructural Observations and Mechanical Behavior of Pb-Sn Solder on Copper Plates
Keyword(s):
AbstractThe microstructure and mechanical properties of Pb-Sn solder joining Cu plates were studied. Yticrostructural observations were made on both the bulk Pb-Sn solder and on the interface between the solder and Cu plates. Pb-Sn solder has a two-phase microstructure in which the Pb-rich phase is the weaker. β-Sn precipitates in the Pb-rich phase were characterized in TEM. Intermetallic phases (Cu6 Sn5 and Cu3Sn) that form during the reaction of molten Pb-Sn solder with Cu were investigated. Solder joints were tested to fracture in both shear and tensile configurations. The mechanical properties and fracture surface characteristics are reported.
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