Photoelectronic Properties of a-Si:Sex and a-Si:Tex Thermally Evaporated Films.

1986 ◽  
Vol 70 ◽  
Author(s):  
F. G. Wakim
Keyword(s):  
Activation Energy ◽  
Solar Cells ◽  
Glow Discharge ◽  
Amorphous Silicon ◽  
Thermal Activation ◽  
Thermal Activation Energy ◽  
Dangling Bonds ◽  
Optical Gap ◽  
Si Films

ABSTRACTThe presence of selenium (Se) or Telurium (Te) in amorphous silicon films seems to improve the quality of these films by reducing the number of unsatisfied or dangling bonds and changing the optical gap and thermal activation energy. The thermal activation energies of a-Si:Sex and a-Si:Tex were always larger than that of a-Si films. The measured optical gap can be tailored to some value between 0.8 eV and 1.8 eV depending on the use of Se or Te and on the relative concentrations. The presence of Se or Te in a-Si films seems to have the same effect as that of hydrogen in a-Si films prepared by glow discharge of silane and used in solar cells.

Steady-State Photoconductivity in Undoped Amorphous Silicon

1989 ◽  
Vol 149 ◽  
Author(s):  
Jeffrey Zhaohuai Liu ◽  
S. Wagner
Keyword(s):  
Experimental Data ◽  
Activation Energy ◽  
Steady State ◽  
Amorphous Silicon ◽  
Thermal Activation ◽  
Hydrogenated Amorphous Silicon ◽  
Thermal Activation Energy ◽  
Strong Temperature Dependence ◽  
Quasi Fermi Level ◽  
Hydrogenated Amorphous

ABSTRACTAn analytical expression for the thermal activation energy of the steady-state photoconductivity is shown to agree with experimental data in a range of temperature and generation rate for undoped hydrogenated amorphous silicon (a-Si:H). This agreement supports our suggestion that the commonly observed small activation energy of the photoconductivity in undoped a-Si:H originates in the strong temperature dependence of the quasi-Fermi level for electrons.

About the Electrical Activation of 1×1020 cm-3 Ion Implanted Al in 4H-SiC at Annealing Temperatures in the Range 1500 - 1950°C

2018 ◽  
Vol 924 ◽  
pp. 333-338 ◽  
Author(s):  
Roberta Nipoti ◽  
Alberto Carnera ◽  
Giovanni Alfieri ◽  
Lukas Kranz
Keyword(s):  
Activation Energy ◽  
Sheet Resistance ◽  
Annealing Time ◽  
Thermal Activation ◽  
Room Temperature ◽  
Annealing Temperature ◽  
Thermal Activation Energy ◽  
Electrical Activation ◽  
Temperature Range ◽  
Annealing Temperatures

The electrical activation of 1×1020cm-3implanted Al in 4H-SiC has been studied in the temperature range 1500 - 1950 °C by the analysis of the sheet resistance of the Al implanted layers, as measured at room temperature. The minimum annealing time for reaching stationary electrical at fixed annealing temperature has been found. The samples with stationary electrical activation have been used to estimate the thermal activation energy for the electrical activation of the implanted Al.

Temperature/Doping-Dependency of the Electrical Properties of the Nickel Doped Copper Oxide Thin Films

2021 ◽  
Vol 16 (2) ◽  
pp. 163-169
Author(s):  
Alaa Y. Mahmoud ◽  
Wafa A. Alghameeti ◽  
Fatmah S. Bahabri
Keyword(s):  
Thin Films ◽  
Activation Energy ◽  
Electrical Properties ◽  
Thermal Activation ◽  
Doping Concentration ◽  
Energy Gap ◽  
Cupric Oxide ◽  
Electrical Energy ◽  
Thermal Activation Energy ◽  
Ni Doping

The electrical properties of the Nickel doped cupric oxide Ni-CuO thin films with various doping concentrations of Ni (0, 20, 30, 70, and 80%) are investigated at two different annealing temperatures; 200 and 400 °C. The electrical properties of the films; namely thermal activation energy and electrical energy gap are calculated and compared. We find that for the non-annealed Ni-CuO films, both thermal activation energy and electrical energy gap are decreased by increasing the doping concentration, while for the annealed films, the increase in the Ni doping results in the increase in thermal activation energy and electrical energy gap for most of the Ni-CuO films. We also observe that for a particular concentration, the annealing at 200 °C produces lower thermal activation energy and electrical energy gap than the annealing at 400 °C. We obtained two values of the activation energy varying from -5.52 to -0.51 eV and from 0.49 to 3.36 eV, respectively, for the annealing at 200 and 400 °C. We also obtained two values of the electrical bandgap varying from -11.05 to -1.03 eV and from 0.97 to 6.71 eV, respectively, for the annealing at 200 and 400 °C. It is also noticeable that the increase in the doping concentration reduces the activation energy, and hence the electrical bandgap energies.

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