Growth Processes of Hydrogenated Amorphous Silicon
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ABSTRACTThe surface and subsurface processes occurring during the growth of a-Si:H are analysed to understand why dangling bond defects and weak Si-Si bonds form. We argue that hydrogen elimination to form the Si-Si network is the rate limiting process at low temperature, and this leads to the creation of weak Si-Si bonds. Dangling bonds form subsequently from weak bonds by a defect pool type process. Plasma processes, such as ion bombardment, which dehydrogenate the surface layers, can reduce the weak bond density.
1994 ◽
Vol 33
(Part 2, No. 9B)
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pp. L1295-L1297
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2001 ◽
Vol 66
(1-4)
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pp. 259-265
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2020 ◽
Vol 5
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pp. 100044
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