Investigation of the Morphology of AlN Films Grown on Sapphire by MOCVD Using Transmission Electron Microscopy

1999 ◽  
Vol 572 ◽  
Author(s):  
W. L. Samey ◽  
L. Salamanca-Ribal ◽  
P. Zhou ◽  
S. Wilson ◽  
M. G. Spencer ◽  
...  

ABSTRACTTo determine the effect of growth conditions on AlN film morphology, we investigated several AlN films grown on sapphire by MOCVD with various V/III ratios. Transmission electron microscopy was used to characterize the film's crystalline quality and defect morphology. TEM results show that the resulting film morphology depends on the V/III ratio. Films grown with NH3 flow rates below 170 sccm have high crystalline quality. In contrast, we observe columnar growth and secondary interfaces in films grown with NH3 flow rates at or above 170 sccm. The secondary interfaces are likely to be inversion domain boundaries (IDBs) and may be associated with strain relaxation. We discuss the V/III ratio's effect on crystalline quality, surface roughness, and IDB and columnar structure formation.

1986 ◽  
Vol 64 (10) ◽  
pp. 1369-1373 ◽  
Author(s):  
U. von Sacken ◽  
D. E. Brodie

The structure of polycrystalline Zn3P2 films has been studied for 1- to 2-μm-thick vacuum-deposited films on glass substrates. Transmission electron microscopy and X-ray diffraction techniques have been used to obtain a detailed, quantitative analysis of the film structure. The initial growth consists of small (≤ 10 nm), randomly oriented grains. As the film thickness increases, the growth of crystallites with the {220} planes oriented approximately parallel to the substrate is favoured, and a columnar structure develops along with a highly preferred orientation. This structure has been observed directly by transmission electron microscopy of thin cross sections of the films. The size of the grains at the free surface increases with the film thickness, reaching approximately 200–300 nm when the film is 1 μm thick. The effects of substrate temperature and low-energy (0.5–2 keV) electron bombardment of the film during growth have also been studied. Neither substrate temperature nor electron bombardment appear to have a major effect on the film structure. The primary effect of electron bombardment appears to be the creation of preferred nucleation sites on the substrate.


2011 ◽  
Vol 1324 ◽  
Author(s):  
Y. Wang ◽  
P. Ruterana ◽  
L. Desplanque ◽  
S. El Kazzi ◽  
X. Wallart

ABSTRACTHigh resolution transmission electron microscopy in combination with geometric phase analysis is used to investigate the interface misfit dislocations, strain relaxation, and dislocation core behavior versus the surface treatment of the GaAs for the heteroepitaxial growth of GaSb. It is pointed out that Sb-rich growth initiation promotes the formation of a high quality network of Lomer misfit dislocations that are more efficient for strain relaxation.


2003 ◽  
Vol 779 ◽  
Author(s):  
Hyung Seok Kim ◽  
Sang Ho Oh ◽  
Ju Hyung Suh ◽  
Chan Gyung Park

AbstractMechanisms of misfit strain relaxation in epitaxially grown Bi4-xLaxTi3O12 (BLT) thin films deposited on SrTiO3 (STO) and LaAlO3 (LAO) substrates have been investigated by means of transmission electron microscopy (TEM). The misfit strain of 20 nm thick BLT films grown on STO substrate was relaxed by forming misfit dislocations at the interface. However, cracks were observed in 100 nm thick BLT films grown on the same STO. It was confirmed that cracks were formed because of high misfit strain accumulated with increasing the thickness of BLT, that was not sufficiently relaxed by misfit dislocations. In the case of the BLT film grown on LAO substrate, the magnitude of lattice misfit between BLT and LAO was very small (~1/10) in comparison with the case of the BLT grown on STO. The relatively small misfit strain formed in layered structure of the BLT films on LAO, therefore, was easily relaxed by distorting the film, rather than forming misfit dislocations or cracks, resulting in misorientation regions in the BLT film.


2004 ◽  
Vol 19 (4) ◽  
pp. 1093-1104 ◽  
Author(s):  
Q. Luo ◽  
D.B. Lewis ◽  
P.Eh. Hovsepian ◽  
W-D. Münz

Cubic NaCl-B1 structured multilayer TiAlN/VN with a bi-layer thickness of approximately 3 nm and atomic ratios of (Ti+Al)/V = 0.98 to 1.15 and Ti/V = 0.55 to 0.61 were deposited by unbalanced magnetron sputtering at substrate bias voltages between -75 and -150 V. In this paper, detailed transmission electron microscopy and x-ray diffraction revealed pronounced microstructure changes depending on the bias. At the bias -75 V, TiAlN/VN followed a layer growth model led by a strong (110) texture to form a T-type structure in the Thornton structure model of thin films, which resulted in a rough growth front, dense columnar structure with inter-column voids, and low compressive stress of -3.8 GPa. At higher biases, the coatings showed a typical Type-II structure following the strain energy growth model, characterized by the columnar structure, void-free column boundaries, smooth surface, a predominant (111) texture, and high residual stresses between -8 and -11.5 GPa.


1993 ◽  
Vol 8 (5) ◽  
pp. 1019-1027 ◽  
Author(s):  
F. Hakkens ◽  
A. De Veirman ◽  
W. Coene ◽  
Broeder F.J.A. den

The structure of Co/Pd and Co/Au (111) multilayers is studied using transmission electron microscopy and high resolution electron microscopy. We focused on microstructure, atomic stacking (especially at the interfaces), and coherency, as these are structural properties that have considerable magnetic effects. A columnar structure with a strong curvature of the multilayer influenced by substrate temperature during growth is observed. High resolution imaging shows numerous steps at the interfaces of the multilayer structure and the presence of misfit dislocations. In bright-field images, periodic contrast fringes are observed at these interfaces as the result of moiré interference. These moiré fringes are used to study the misfit relaxation at the interfaces, whereas electron diffraction gives the average relaxation over the whole layer. Both measurements determined that, for Co/Pd as well as Co/Au multilayers, 80–85% of the misfit is relaxed and 20–15% remains in the form of strain, independent of the Co layer thickness in the regime studied.


2001 ◽  
Vol 16 (8) ◽  
pp. 2336-2342 ◽  
Author(s):  
A. M. Serventi ◽  
M. A. El Khakani ◽  
R. G. Saint-Jacques ◽  
D. G. Rickerby

Highly conductive iridium dioxide (IrO2) thin films have been deposited onto in situ oxidized Si(100) substrates by means of a reactive pulsed laser deposition (PLD) process. The polycrystalline IrO2 films were obtained by ablating a metal iridium target under an optimal oxygen background pressure of 200 mtorr and at different substrate deposition temperatures (Td ) ranging from 350 to 550 °C. Conventional and high-resolution transmission electron microscopy (HRTEM) techniques were used to investigate the micro- and nanostructural changes of the PLD IrO2 films as a function of their deposition temperatures. The microstructure and the morphology of the PLD IrO2 films was found to change drastically from an irregular and loosely packed columnar structure at Td = 300 °C to a uniform and densely packed columnar structure for higher Td (≥350 °C). For IrO2 films deposited in the 350 ≤ Td ≤ 550 °C range, HRTEM have revealed the presence of highly textured arrangements of almost spherical IrO2 nanograins (of 3–5 nm diameter, regardless of Td) in the columns (of which diameter was found to increase from 85 ± 15 to 180 ± 20 nm as Td increases from 350 to 550 °C). Lattice resolution and dark-field imaging have pointed out the presence of large IrO2 crystallites made of many similarly oriented nanograins (i.e., under the same Bragg diffraction conditions). Moreover, a high continuity of the lattice planes across the entire crystallite was clearly observed. This latter aspect together with the highly textured nanostructure of the IrO2 films correlate well with their high conductivity (42 ± 6 μω cm for Td ≥ 400), which was found to be comparable with that of bulk single-crystal IrO2.


Geofluids ◽  
2017 ◽  
Vol 2017 ◽  
pp. 1-8 ◽  
Author(s):  
Zhi-yu Liu ◽  
Fu-jian Zhou ◽  
Hong-yan Qu ◽  
Zhao Yang ◽  
Yu-shi Zou ◽  
...  

Many studies have focused on the drag reduction performance of slick-water, but the microdrag reduction mechanism remains unclear since the microstructure of the drag reducer and its effect on this mechanism have not been well studied. In this study, the microstructure of the drag reducer in slick-water was effectively characterized by transmission electron microscopy. The viscoelasticity and drag reduction performance of the drag reducer with different microstructures were then investigated. Further, the effects of the microstructure of the drag reducer on the viscoelasticity and drag reduction performance of slick-water were analyzed. The results demonstrated that the viscoelasticity of slick-water is governed by the microstructure of the drag reducer, which exhibits a network structure. In addition, the drag reduction performance is related to the viscoelasticity. At low flow rates, the drag reduction performance is dominantly influenced by viscosity, whereas, at high flow rates, it is governed mainly by elasticity. Furthermore, the drag reducer with a uniformly distributed network structure exhibits the most stable drag reduction performance. This drag reducer was used in a field test and the obtained results were consistent with those of a laboratory experiment.


1989 ◽  
Vol 160 ◽  
Author(s):  
B.J. Robinson ◽  
B.T. Chilton ◽  
P. Ferret ◽  
D.A. Thompson

AbstractSingle strained layer structures of up to 30 nm of Si1-xGex. on (100) Si and capped with 30-36 nm of Si have been amorphized by implantation with 120 keV As . The amorphized region, extending to a depth of 130 nm, has been regrown by solid phase epitaxy (SPE) at 600°C. Characterization of the regrown structure by Rutherford backscattering/channeling techniques and transmission electron microscopy indicates that for x < 0.18 the SPE process results in the recovery of strain, while for x > 0.18 there is increasing strain relaxation and a deterioration of crystal quality.


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