Lateral Transport through Self-Assembled InAs Quantum Dots Located in the Narrow Gap Electrodes

1999 ◽  
Vol 571 ◽  
Author(s):  
S. K. Jung ◽  
S. W. Hwang ◽  
J. H. Park ◽  
B. D. Min ◽  
E. K. Kim ◽  
...  

ABSTRACTWe have fabricated and characterized the lateral electron transport through InAs quantum dots with double barrier system. Aluminum metal electrodes with the inter-electrode spacing of 30 nm have been deposited on an InAs self-assembled quantum dot wafer to form the planar type quantum dot devices. Current peak structure and negative differential resistance effects are observed above 77 K in current-voltage characteristics. These results are interpreted as due to 3D-0D resonant tunneling through the single quantum dot positioned in between the electrodes.

2006 ◽  
Vol 916 ◽  
Author(s):  
Hsing-Yeh Wang ◽  
C.H. Chen ◽  
H. Niu ◽  
S.C. Wu ◽  
C.P. Lee

AbstractThe strain status of the buried InAs self-assembled quantum dot was comprehended by measurement first time. Results show the in-plane strain is compressive and lattice in the growth direction is lager than the lattice of GaAs. The strain of the sample annealed at 650 degree relaxes in the growth direction. The growth and the lateral direction become relaxed in the sample annealed at 750 degree.


1999 ◽  
Vol 60 (16) ◽  
pp. R11289-R11292 ◽  
Author(s):  
H. Pettersson ◽  
R. J. Warburton ◽  
J. P. Kotthaus ◽  
N. Carlsson ◽  
W. Seifert ◽  
...  

2001 ◽  
Vol 171 (12) ◽  
pp. 1365
Author(s):  
E.E. Vdovin ◽  
Yu.N. Khanin ◽  
Yu.V. Dubrovskii ◽  
A. Veretennikov ◽  
A. Levin ◽  
...  

2005 ◽  
Vol 36 (3-6) ◽  
pp. 227-230 ◽  
Author(s):  
H. Pettersson ◽  
L. Landin ◽  
Ying Fu ◽  
M. Kleverman ◽  
M. Borgström ◽  
...  

2007 ◽  
Vol 18 (S1) ◽  
pp. 191-194 ◽  
Author(s):  
S. I. Jung ◽  
H. Y. Yeo ◽  
I. Yun ◽  
J. Y. Leem ◽  
I. K. Han ◽  
...  

2006 ◽  
Vol 17 (23) ◽  
pp. 5722-5725 ◽  
Author(s):  
G W Shu ◽  
C K Wang ◽  
J S Wang ◽  
J L Shen ◽  
R S Hsiao ◽  
...  

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