Effect of Film Thickness and Cure Temperature on the Mechanical Properties of FOx® Flowable Oxide Thin Films

1999 ◽  
Vol 565 ◽  
Author(s):  
Huey-Chiang Liou ◽  
John Pretzer
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Film Thickness ◽  
Thermal Stresses ◽  
Coefficient Of Thermal Expansion ◽  
Structure Change ◽  
Curing Temperature ◽  
Different Temperatures ◽  
Cure Temperature ◽  
Different Thickness

AbstractThe mechanical properties and thermal stresses of FOx thin films at different thickness and cured at different temperatures have been investigated by a nanoindentor and a profilometer. In this study, the correlation between structure change, thickness, Si-H/Si-O ratio, modulus, hardness, and calculated coefficient of thermal expansion (CTE) of FOx films have been established. The results show that the modulus of 400°C cured FOx film decreases with increasing film thickness while the hardness slightly varies with increasing film thickness. The calculated CTE of FOx film increases with increasing film thickness. In addition, both the modulus and hardness of FOx films increase with increasing curing temperature. However, the calculated CTE of FOx film decreases with increasing curing temperature. The Si-H/Si-O ratio increases with increasing film thickness but decreases with increasing curing temperature. These results indicate that the increase in modulus and hardness and the decreases in CTE for FOx films are either due to the remaining of Si-H bonds in FOx film at different film thickness or the conversion of Si-H into Si-O when forming the network structure in the FOx film at higher curing temperatures.

Viscoelastic Behavior of Polymer Thin‐Films Under Thermal Stresses

1996 ◽  
Vol 445 ◽  
Author(s):  
Stephen D. Bluestein ◽  
Dewi P. Y. Bramono ◽  
Ioannis N. Miaoulis ◽  
Peter Y. Wong
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Thermal Loading ◽  
Thermal Stresses ◽  
Viscoelastic Behavior ◽  
Polymer Materials ◽  
Microelectronic Packaging ◽  
Polyimide Films ◽  
Different Temperatures

AbstractStresses and deformation in microelectronic packaging are affected by the viscoelastic behavior of polymer materials during manufacture or operation. Predicting and measuring these thermo‐mechanical effects is important for new devices, components, and materials. The viscoelastic response of Nycoa 851 polyimide thin‐films during thermal loading is investigated. The time‐dependent relaxation of polyimide films was measured in‐situ, focusing on the change in thermo‐mechanical properties based on the thickness of the polyimide layer. The curvature change of the multilayer structure (silver‐polyimide‐quartz heterostructure) was obtained for different temperatures and polymer film thicknesses. The polyimide relaxation time constant and activation energy were determined. Results indicate that the thermo‐mechanical properties of polyimide thin films are dependent on the thickness of the polymer layer.

Mechanical Properties of Electroplated Copper Thin Films

1999 ◽  
Vol 594 ◽  
Author(s):  
R. Spolenak ◽  
C. A. Volkert ◽  
K. Takahashi ◽  
S. Fiorillo ◽  
J. Miner ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Grain Size ◽  
Film Thickness ◽  
Yield Stress ◽  
Laser Scanning ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cu Films ◽  
Electroplated Copper

AbstractIt is well known that the mechanical properties of thin films depend critically on film thickness However, the contributions from film thickness and grain size are difficult to separate, because they typically scale with each other. In one study by Venkatraman and Bravman, Al films, which were thinned using anodic oxidation to reduce film thickness without changing grain size, showed a clear increase in yield stress with decreasing film thickness.We have performed a similar study on both electroplated and sputtered Cu films by using chemical-mechanical polishing (CMP) to reduce the film thickness without changing the grain size. Stress-temperature curves were measured for both the electroplated and sputtered Cu films with thicknesses between 0.1 and 1.8 microns using a laser scanning wafer curvature technique. The yield stress at room temperature was found to increase with decreasing film thickness for both sets of samples. The sputtered films, however, showed higher yield stresses in comparison to the electroplated films. Most of these differences can be attributed to the different microstructures of the films, which were determined by focused ion beam (FIB) microscopy and x-ray diffraction.

scholarly journals The Effect of Film Thickness on the Structural Properties of Vacuum Evaporated Poly(3-methylthiophene) Thin Films

2012 ◽  
Vol 2012 ◽  
pp. 1-8 ◽  
Author(s):  
Sandip V. Kamat ◽  
Vijaya Puri ◽  
R. K. Puri
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Surface Roughness ◽  
Surface Morphology ◽  
Film Thickness ◽  
Structural Properties ◽  
Vacuum Evaporation ◽  
Intrinsic Stress ◽  
Glass Substrates ◽  
Structure Surface

This paper reports on the structural properties of poly(3-methylthiophene) P3MeT thin films prepared by vacuum evaporation on the glass substrates. The structural and surface morphology, wettability, adhesion, and intrinsic stress of these thin films were studied for three different thicknesses. The variation of the film thickness affects the structure, surface, and mechanical properties of P3MeT thin films. Vapor chopping also strongly influences the surface morphology, surface roughness, and wettability of the thin films. It was found that there is a decrease in the intrinsic stress and (RMS) roughness, while the adhesion increases with increase in film thickness.

The Effect of Film Thickness on Mechanical Properties of TiN Thin Films

2011 ◽  
Vol 4 (11) ◽  
pp. 3570-3575 ◽  
Author(s):  
Jao-Hwa Kuang ◽  
Hui-Lung Chien
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Film Thickness ◽  
Tin Thin Films

Appling of New Optical Measurement and Theory in Mechanical Properties of Thin Film

2011 ◽  
Vol 121-126 ◽  
pp. 4295-4299
Author(s):  
Hao MA Yun ◽  
Lu Ping Chao ◽  
J. S Hsu
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Thermal Stresses ◽  
Optical Measurement ◽  
Phase Shifting ◽  
Deposition Condition ◽  
Full Field ◽  
Evaporation Technique ◽  
Film Substrate

The thesis aims to characterize the mechanical properties and stresses for thin films deposited on the circular substrates. First, the thin films with the same deposition condition were successively deposited on the distinct substrates using the evaporation technique. The phase-shifting Twyman-Green interferometer (PSTGI) was then employed to measure the warpage of the film-substrate structures and therefore the intrinsic stresses and thermal stresses can be calculated from the well-known Stoney’s formula. The coefficients of thermal expansion (CTE) and Young’s modulus of thin films were also obtained from the Stoney’s theory. Furthermore, the merit of full-field character of optical interferometry was used to propose a novel methodology using the Chen and Ou’s theory to improve the accuracy and to reduce the experiment procedures in the traditional measurement of the aforementioned mechanical properties. Finally, the measured results corresponding to the traditional and proposed methods were respectively substituted into their adopted theories to compare their difference. The results reveal that the accuracy of proposed methodology is considerably improved and the experimental procedures are reduced to those of the traditional methods.

Effects of Substrate Materials on Nanoindentation Tests of AlN Thin Films

2002 ◽  
Vol 750 ◽  
Author(s):  
Shuichi Miyabe ◽  
Masami Aono ◽  
Nobuaki Kitazawa ◽  
Yoshihisa Watanabe
Keyword(s):  
Thin Films ◽  
Film Thickness ◽  
Penetration Depth ◽  
Ion Beam ◽  
Fused Silica ◽  
Indentation Hardness ◽  
Ion Beam Assisted Deposition ◽  
Film Hardness ◽  
Aln Film ◽  
Different Thickness

ABSTRACTAluminum nitride (AlN) thin films with different thickness were synthesized by ion-beam assisted deposition on various substrates, Corning 7059 glass, fused silica, Si single crystal, and sapphire, which show the hardness ranging from 7 to 37 GPa. Effects of substrate materials on indentation-hardness of AlN films were studied by using a nanoindentation system equipped with a diamond Berkovich indenter. The maximum force applied to the films was kept at 3 mN. For the films on the Corning 7059 glass substrate, when the normalized penetration depth to the film thickness is 0.98, the film hardness is found to be about 7 GPa, which is close to the hardness of the substrate. While the normalized penetration depth is reduced to 0.11, the film hardness becomes to be about 16 GPa. On the other hand, for the films on the sapphire substrate, when the normalized penetration depth is 0.83, the film hardness is observed to be about 25 GPa, while the normalized penetration depth is reduced to 0.10, the film hardness is found to be about 15 GPa. These results reveal that when the normalized penetration depth to the film thickness is about 0.1, the hardness of the AlN film can be evaluated to be about 15 GPa without being affected by substrate materials.

Thermal Fracture of Oxidized Polydimethylsiloxane and its Implications in Soft Lithography

2011 ◽  
Author(s):  
Wes W. Tooley ◽  
Shirin Feghhi ◽  
Sangyoon J. Han ◽  
Junlan Wang ◽  
Nathan J. Sniadecki
Keyword(s):  
Soft Lithography ◽  
Thermal Stresses ◽  
Elevated Temperatures ◽  
Coefficient Of Thermal Expansion ◽  
Curing Temperature ◽  
Surface Cracks ◽  
Element Analysis ◽  
Circular Test ◽  
Cte Mismatch ◽  
Cellular Forces

During the fabrication of nanopost arrays for measuring cellular forces, we have observed surface cracks in the negative molds used to replicate the arrays from a silicon master. These cracks become more numerous and severe with each replication such that repeated castings lead to arrays with missing or broken posts. This loss in pattern fidelity from the silicon master undermines the spatial resolution of the nanopost arrays in measuring cellular forces. We hypothesized that these cracks are formed because of a mismatch in the coefficient of thermal expansion (CTE) of PDMS and its oxidized surface layer. To study the fracture of PDMS due to thermal effects, we treated circular test samples of PDMS with oxidizing plasma and then heated them to cause surface cracks. These cracks were found to be more abundant at 180 °C than at lower temperatures. Finite element analysis of a bilayer material with a CTE mismatch was used to validate that thermal stresses are sufficient to overcome the fracture toughness of oxidized PDMS when heated to a curing temperature for PDMS. As a consequence, we have ascertained that elevated temperatures are a significant detriment to the reproducibility of nanoscale features in PDMS during replica molding.

A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film

2002 ◽  
Vol 124 (2) ◽  
pp. 274-277 ◽  
Author(s):  
Martin Y. M. Chiang ◽  
Chwan K. Chiang ◽  
Wen-li Wu
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Elastic Modulus ◽  
Coefficient Of Thermal Expansion ◽  
Thermal And Mechanical Properties ◽  
Reduction Scheme ◽  
Coupled Equations

A technique for determining the in-plane modulus and the coefficient of thermal expansion (CTE) of supported thin films has been developed. The modulus and CTE are calculated by solving two coupled equations that relate the curvature of film samples deposited on two different substrates to the thermal and mechanical properties of the constituents. In contrast with the conventional method used to calculate modulus and CTE, which involves differentiation of the thermal stress in the film, this new technique does not require the differentiation of the thermal stress, and can also provide the temperature-dependence of the in-plane CTE and elastic modulus of supported thin films. The data reduction scheme used for deducing CTE and elastic modulus is direct and reliable.

Surface Morphology of Mechanically Strained Silicate Glass Films on Alumina Substrates

1997 ◽  
Vol 3 (S2) ◽  
pp. 1281-1282
Author(s):  
A.V. Zagrebelny ◽  
C.B. Carter
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Integrated Circuits ◽  
Surface Morphology ◽  
Silicate Glass ◽  
Thermal Stresses ◽  
Thin Layers ◽  
Common Mechanism ◽  
The Matrix ◽  
Glass Films

It has been long recognized that the understanding of mechanical properties of thin films on substrates requires an understanding of the stresses in the film structures as well as a knowledge of mechanisms by which thin films deform. It has also been shown that these stresses may compromise the performance of integrated circuits, magnetic media, etc. The presence of residual and thermal stresses between the matrix and intergranular films in structural multiphase ceramics is the most common mechanism of failure that often causes deformation and fractureIn this paper, the effect of residual stress on mechanical properties of silicate-glass films on single-crystal α-Al2O3 substrates has been studied with AFM with the emphasis on the changes in surface morphology associated with the film strain and relaxation. The deformation of thin layers of glass on crystalline materials has also been examined using newly developed experimental methods for nanomechanical testing.

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