Development of Ultra-Clean Plasma Deposition Process

1999 ◽  
Vol 557 ◽  
Author(s):  
Toshihiro Kamei ◽  
Akihisa Matsuda
Keyword(s):  
Grain Size ◽  
Secondary Ion Mass Spectrometry ◽  
Plasma Deposition ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Ultra High Vacuum ◽  
Very High Frequency ◽  
Microscopic Mechanism ◽  
O 10

AbstractWe have developed a new type of ultra-high vacuum plasma-enhanced chemical vapor deposition (UHV/PECVD) system. According to high sensitivity secondary ion mass spectrometry, device quality hydrogenated amorphous silicon (a-Si:H) films deposited at 250°C at a deposition rate of 1 Å/s contains 1015 cm-3 of O, 1015 cm-3 of C, and 1014 cm-3 of N impurities, while low defect hydrogenated microcrystalline silicon (μc-Si:H) films deposited at 200°C at a very low rate of 0.1 Å/s include 1016 cm-3 of O, 1015 cm-3 of C and 1016 cm-3 of N. These are the lowest concentrations of atmospheric contaminants for these kinds of materials observed so far. The essential features of the present UHV/PECVD system are an extremely low outgassing rate of 8×10-9 Torr·s, extremely low partial pressure of contaminant gas species <10-12 Torn, and purification of feed gas SiH4 at “point of use”. These efforts are quite important not only for clarifying the microscopic mechanism of photo-induced degradation in a-Si:H, but also for enlarging the crystalline grain size in μc-Si:H. μc-Si:H with a grain size of ≍1000 Å as determined by Scherrer's formula can be obtained at the higher rate of 1.5 Å/s by utilizing a VHF (Very High Frequency) plasma. The specific origins of impurities in the films are also discussed.

Fabrication of High-Density Carbon-Nanotube Coatings on Microstructured Substrates

2000 ◽  
Vol 621 ◽  
Author(s):  
Zheng Chen ◽  
Yonhua Tzeng ◽  
Chao Liu
Keyword(s):  
Carbon Nanotubes ◽  
Carbon Nanotube ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Active Surface ◽  
Deposition Process ◽  
Ultra High Vacuum ◽  
Active Surface Area ◽  
Field Emission Properties ◽  
Ni Substrate

ABSTRACTFabrication and characterization of carbon nanotubes deposited on microstructured Ni substrate are presented. The highly active surface-area of the microstructured Ni substrate provides highdensity nucleation sites for carbon nanotubes. Coated fine Ni powder also serves as a catalyst for the nanotube growth. Hydrocarbon mixtures were used as the carbon source for the chemical vapor deposition process. Carbon nanotubes deposited on the microstructured Ni substrate were examined by SEM. An ultra high vacuum chamber was used to characterize the field emission properties of carbon nanotube coatings.

Sub-Half Micron Elevated SourceDrain NMOSFETS by Low Temperature Selective Epitaxial Deposition

1996 ◽  
Vol 429 ◽  
Author(s):  
J. Sun ◽  
R. F. Bartholomew ◽  
K. Bellur ◽  
P. A. O'Neil ◽  
A. Srivastava ◽  
...  
Keyword(s):  
Low Temperature ◽  
Epitaxial Growth ◽  
High Vacuum ◽  
Chemical Vapor ◽  
High Growth ◽  
Deposition Process ◽  
Deep Submicron ◽  
Ultra High Vacuum ◽  
Gas Source ◽  
Drain Bias

AbstractIn this paper we report the first NMOSFETs with elevated S/D selectively deposited by ultra high vacuum rapid thermal chemical vapor deposition (UHV-RTCVD). The deposition process included an in-situ vacuum prebake (750 °C for 10 sec) followed by selective epitaxial growth (SEG) at 800 °C. Si2H6 was used as the silicon gas source instead of the more commonly used SiH4 and SiH2Cl2 in order to achieve high growth rates at low pressure. To prevent nucleation from occurring on insulator surfaces during growth, an etching mechanism was introduced by the addition of Cl2. The gases included 100 sccm of 10% Si2H6 in H2 and 2 sccm of Cl2 at a process pressure of 24 mTorr. An epitaxial growth rate of 160 nm/min has been achieved. The final epi thickness was around 0.1 μm. The S/D junctions were formed via ion implantation into the epi. The subsequent RTA (10 sec at 950 °C) resulted in an effective junction depth about 75 nm beneath the starting Si substrate. Process and device simulations reveal the importance of maintaining a shallow LDD junction for deep submicron devices by using low temperature selective deposition. MOSFETs exhibit good subthreshold characteristics with subthreshold swing of 86 mV/dec at a drain bias of 2.5 V, and threshold variations due to charge sharing and drain-induced-barrierlowering (DIBL) were moderate for Leff down to 0.35 μm. The gate-induced junction leakage current is below 2 pA/μm at a bias of 2.5 V.

Challenge to 200 mm 3C-SiC Wafers Using SOI

2005 ◽  
Vol 483-485 ◽  
pp. 205-208 ◽  
Author(s):  
Motoi Nakao ◽  
Hirofumi Iikawa ◽  
Katsutoshi Izumi ◽  
Takashi Yokoyama ◽  
Sumio Kobayashi
Keyword(s):  
Cross Section ◽  
Vapor Deposition ◽  
Seed Layer ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Ultra High Vacuum ◽  
Average Thickness ◽  
Entire Region ◽  
Transmission Electron ◽  
Good Crystallinity

200 mm wafer with 3C-SiC/SiO2/Si structure has been fabricated using 200 mm siliconon- insulator (SOI) wafer. A top Si layer of 200 mm SOI wafer was thinned down to approximately 5 nm by sacrificial oxidization, and the ultrathin top Si layer was metamorphosed into a 3C-SiC seed layer using a carbonization process. Afterward, an epitaxial SiC layer was grown on the SiC seed layer with ultra-high vacuum chemical vapor deposition. A cross-section transmission electron microscope indicated that a 3C-SiC seed layer was formed directly on the buried oxide layer of 200 mm wafer. The epitaxial SiC layer with an average thickness of approximately 100 nm on the seed was recognized over the entire region of the wafer, although thickness uniformity of the epitaxial SiC layer was not as good as that of SiC seed layer. A transmission electron diffraction image of the epitaxial SiC layer showed a monocrystalline 3C-SiC(100) layer with good crystallinity. These results indicate that our method enables to realize 200 mm SiC wafers.

Ultra-high vacuum chemical vapor deposition and in situ characterization of titanium oxide thin films

1991 ◽  
Vol 6 (9) ◽  
pp. 1913-1918 ◽  
Author(s):  
Jiong-Ping Lu ◽  
Rishi Raj
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Titanium Oxide ◽  
Vapor Deposition ◽  
Photoelectron Spectroscopy ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Titanium Isopropoxide ◽  
Ultra High Vacuum

Chemical vapor deposition (CVD) of titanium oxide films has been performed for the first time under ultra-high vacuum (UHV) conditions. The films were deposited through the pyrolysis reaction of titanium isopropoxide, Ti(OPri)4, and in situ characterized by x-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES). A small amount of C incorporation was observed during the initial stages of deposition, through the interaction of precursor molecules with the bare Si substrate. Subsequent deposition produces pure and stoichiometric TiO2 films. Si–O bond formation was detected in the film-substrate interface. Deposition rate was found to increase with the substrate temperature. Ultra-high vacuum chemical vapor deposition (UHV-CVD) is especially useful to study the initial stages of the CVD processes, to prepare ultra-thin films, and to investigate the composition of deposited films without the interference from ambient impurities.

Homoepitaxy of Ge on ozone-treated Ge (1 0 0) substrate by ultra-high vacuum chemical vapor deposition

2019 ◽  
Vol 507 ◽  
pp. 113-117 ◽  
Author(s):  
Jiaqi Wang ◽  
Limeng Shen ◽  
Guangyang Lin ◽  
Jianyuan Wang ◽  
Jianfang Xu ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Ultra High Vacuum

Carbon Incorporation in Gaas grown by UHVCVD Using Trimethylgallium and Arsine

1992 ◽  
Vol 281 ◽  
Author(s):  
Seong-Ju Park ◽  
Jeong-Rae Ro ◽  
Jae-Ki Sim ◽  
El-Hang Lee
Keyword(s):  
Growth Rates ◽  
Hole Concentration ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Ultra High Vacuum ◽  
Chemical Beam Epitaxy ◽  
Hydrogen Atoms ◽  
Carbon Incorporation ◽  
Significant Drop ◽  
P Type

ABSTRACTWe present results of a study on the effect of unprecracked arsine(AsH3) and trimethylgallium(TMGa) on carbon incorporation in UHVCVD(Ultra High Vacuum Chemical Vapor Deposition) grown GaAs epilayers on GaAs(100). Three distinct temperature-dependent regions of growth rates were identified as growth temperature was increased from 570 to 690°C. The growth rates were also strongly dependent on V/III ratio in a range of 5 to 30, which clearly indicates that the growth rate is determined by the amount of arsenic adsorbed on the surface at low V/III ratio and adsorption of TMGa or decomposition process at high V/III ratio. Hall concentration measurements and low temperature photoluminescence data show that the films are all p-type and their impurity concentrations are reduced by two orders of magnitude compared to those of epilayers grown by CBE(Chemical Beam Epitaxy) which employs TMGa and arsenic(precracked arsines) as source materials. Our results indicate that the hydrogen atoms dissociated from adsorbed arsine may remove hydrocarbon species resulting in a significant drop in hole concentration.

Water Desorption from Magnesium Oxide Films Fabricated by Chemical Vapor Deposition

2006 ◽  
Vol 11-12 ◽  
pp. 693-696 ◽  
Author(s):  
S. Kawaguchi ◽  
K.C. Namiki ◽  
S. Ohshio ◽  
Junichi Nishino ◽  
H. Saitoh
Keyword(s):  
Chemical Vapor Deposition ◽  
Magnesium Oxide ◽  
Vapor Deposition ◽  
High Vacuum ◽  
Secondary Electron Emission ◽  
Film Surface ◽  
Chemical Vapor ◽  
Ultra High Vacuum ◽  
Water Desorption ◽  
Plasma Sputtering

Magnesium oxide (MgO) films are utilized for the anti-plasma sputtering coating with excellent ability of secondary electron emission in plasma display panels (PDP). These properties are degraded by the impurities adsorbed on the film surface. Therefore, we should obtain impurity-free surface during the PDP manufacturing process. We have synthesized whisker and continuous film types of metal oxide using a chemical vapor deposition (CVD) method operated under atmosphere. In this study, a temperature programmed desorption method has been applied to detect residual species adsorbed on the surface of the present films in the ultra-high vacuum atmosphere. The amount of water adsorption was determined by this method.

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