Novel Design and Fabrication of Thermal Battery Cathodes Using Thermal Spray

1998 ◽  
Vol 548 ◽  
Author(s):  
Hui Ye ◽  
Chris Strock ◽  
T. Danny Xiao ◽  
Peter R. Strutt ◽  
David E. Reisner ◽  
...  

ABSTRACTLi-Alloy/FeS2 thermal batteries are the predominant thermal battery chemistry today. Conventional electrodes are fabricated by cold pressing of powders. A better means of providing thin electrodes would dramatically increase volumetric and gravimetric energy densities and cost efficiency of thermal batteries. In this study, experiments were conducted on fabricating the cathode via high-velocity oxygen-fuel (HVOF) and dc-arc plasma thermal spray technique. The deposited films were characterized by cross-section examination using Scanning Electron Microscopy (SEM) and X-ray Diffraction. The thermal decomposition of pyrite was suppressed by a proprietary additive. The electrochemical test results showed that pyrite cathodes prepared by dc-arc plasma spraying with additives demonstrated better performance compared traditional pressed-powder electrodes.

2006 ◽  
Vol 315-316 ◽  
pp. 742-747 ◽  
Author(s):  
Rong Fa Chen ◽  
Dun Wen Zuo ◽  
Duo Sheng Li ◽  
Bing Kun Xiang ◽  
Li Gang Zhao ◽  
...  

High quality diamond film wafers with different thickness are prepared by high power DC arc plasma jet CVD (DCPJ CVD) method using a CH4/Ar/H2 gas mixture. The effects of methane concentration on the growth of carbon balls in anode nozzle and arc stability are studied with theoretical analysis and experimental investigation. The results indicate that different sizes of carbon balls may rapidly grow in the anode nozzle with methane concentration higher than 2 Vol-%, symmetry and uniformity of the rotating arc are strongly affected with the occurrence of carbon balls, which will result in non-uniform deposition of diamond films over a large substrate area. The methane concentration should be controlled at a low level to keep diamond film wafers growth stable. Characterization by X-ray diffraction, Raman spectroscopy and SEM analysis are also carried out.


2019 ◽  
Vol 25 (4) ◽  
pp. 276
Author(s):  
Trinh Van Trung ◽  
Pham Hong Tuan ◽  
Nguyen Thanh Hop ◽  
Nguyen Van Thanh

<p class="AMSmaintext1">Thin films were deposited on SUS440 stainless steel samples by arc plasma evaporation at bias voltage range from -10 to -100 V. X-ray diffraction, optical microscopy, field emission scanning electron microscopy, energy dispersive spectroscopy, microhardness test, and electrochemical test were used to investigate the morphology and properties of the thin films. Particularly, the thin films were composed of chromium nitride (CrN, phases of CrN + Cr) and 0.76 mm thick. They were deposited with microdroplets on the samples. The surface hardness of these films reached the highest value of 1492 HV at the bias of -20 V. As the bias voltage increased, the adhesion of the CrN thin films decreased. The excessively high bias voltage of -100 V led to the delamination of the CrN thin films. The electrochemical test demonstrated that the corrosion resistance in the 3% NaCl solution of CrN coating can be improved.</p>


2007 ◽  
Vol 336-338 ◽  
pp. 2082-2085
Author(s):  
Hideo Okuyama ◽  
Satoru Ohno ◽  
Yoshio Sakka

Composite nanoparticles of Ni-TiC and Ni-TiN were prepared by an active plasma-metal reaction method. The structure and morphology were evaluated by X-ray diffraction and transmission electron microscopy observations. The morphology of the composite particles is dice-like or dumbbell-like, where the outer sides are metallic and the inner part of the rod (or dice)-like structure is TiC or TiN. The formation mechanism of the composite particles is considered by analogy to the VSL mechanism. The thermal stability of the nanocomposite particles is vastly superior to that of the metal particle. The excellent catalytic property of the Ni-TiN composite particle was confirmed when compared to the well-known Raney Ni particle and mixed particles of Ni and TiC.


2011 ◽  
Vol 175 ◽  
pp. 245-248
Author(s):  
Rong Fa Chen ◽  
Liang Gang Dai ◽  
Rui Zhu ◽  
Xian Liang Zhang ◽  
Tao Liu ◽  
...  

. High quality diamond film wafers with different thickness are prepared by high power DC arc plasma jet CVD (DCPJ CVD) method using a CH4/Ar/H2 gas mixture. The effect of substrate temperature on the quality of diamond film was studied with theoretical analysis and experimental investigation. The results indicate that different structures in diamond film may grow with different substrate temperatures. The temperatures of 800°C, 900°C and 1000°C were tested in the experiments. The quality of diamond film showed the best at the temperature of 900°C. Characterization by X-ray diffraction, Raman spectroscopy and SEM analysis are also carried out.


2010 ◽  
Vol 426-427 ◽  
pp. 564-567
Author(s):  
Wen Zhuang Lu ◽  
Jia Jing Yuan ◽  
Dun Wen Zuo ◽  
Feng Xu ◽  
Yu Li Sun

The present paper describes research on stress in freestanding diamond thick film, diameter of 60mm, prepared on Mo substrate by DC arc plasma jet chemical vapor deposition (DCPCVD) method. The stress in the CVD diamond film was investigated by X-ray diffraction and Raman spectrum. The results show that the stress in the film is compressive. The stress changes little at the same homocentric round. The compressive stress along radial direction is that the stress in the centre of the film is lower than that in the edge at both the final surface and the original surface.


Author(s):  
Milan Hrabovsky ◽  
M. Konrad ◽  
Vladimir Kopecky ◽  
J. Hlina ◽  
J. Benes ◽  
...  

Author(s):  
Zhenggang Tang ◽  
Minjie Hou ◽  
Xin He ◽  
Kai Ye ◽  
Da Zhang ◽  
...  

Author(s):  
Alireza Zaheri ◽  
Mohammadreza Farahani ◽  
Alireza Sadeghi ◽  
Naser Souri

The bonding strength, and microstructures of Cu and Al couples using metallic powders as interlayer during transient liquid phase bonding (TLP bonding) were investigated. The interfacial morphologies and microstructures were studied by scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. First, to explore the optimum bonding time and temperature, nine samples were bonded without interlayers in a vacuum condition. Mechanical test results indicated that bonding at 560°C in 20 min returns the highest bond strength (84% of Al). This bonding condition was used to join ten samples with powder interlayers. Powders were prepared by mixing different combinations of Cu, Al (+Fe nanoparticles) and Zn. In the bonding zone, different Cu9Al4, CuAl, and CuAl2 intermetallic co-precipitate. The strongest bonding is formed in the sample with the 70Al (+Fe)-30Cu powder interlayer. Powder interlayers present thinner and more uniform intermetallic layers at the joint interface.


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