Low Dielectric Constant Fluorocarbon Films

1998 ◽  
Vol 544 ◽  
Author(s):  
K. K. S. Lau ◽  
K. K. Gleason
Keyword(s):  
Dielectric Constant ◽  
Chemical Vapor Deposition ◽  
Surface Properties ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Market Potential ◽  
Low Dielectric Constant ◽  
Fluorocarbon Films ◽  
Low Dielectric

IntroductionChemical vapor deposition (CVD) continues to generate immutable interest as a method of producing thin fluorocarbon films. This impetus stems from both the process advantages of CVD and the extensive market potential for the resultant films. Fluorocarbon films find extremely diverse applications because of their unique electrical, chemical and surface properties. They are currently being evaluated, among other applications, as dielectric interconnects in microelectronic circuits1–3 and as passivation coatings in clinical devices.

Preparation of low dielectric constant F‐doped SiO2 films by plasma enhanced chemical vapor deposition

1996 ◽  
Vol 68 (6) ◽  
pp. 832-834 ◽  
Author(s):  
Sang Woo Lim ◽  
Yukihiro Shimogaki ◽  
Yoshiaki Nakano ◽  
Kunio Tada ◽  
Hiroshi Komiyama
Keyword(s):  
Dielectric Constant ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Low Dielectric Constant ◽  
Sio2 Films ◽  
Low Dielectric

Low-Dielectric-Constant SiOC(-H) Films Prepared from DMDMS and O2 Precursors by Using Plasma Enhanced Chemical Vapor Deposition

2007 ◽  
Vol 50 (6) ◽  
pp. 1814 ◽  
Author(s):  
Seung Hyung Kim ◽  
R. Navamathavan ◽  
An Soo Jung ◽  
Yong Jun Jang ◽  
Kwang-Man Lee ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Low Dielectric Constant ◽  
Low Dielectric
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