Lateral Reactions of Gaas with Ni Studied by Transmission Electron Microscopy

1985 ◽  
Vol 54 ◽  
Author(s):  
S. H. Chen ◽  
C. B. Carter ◽  
C. J. Palmstrøm ◽  
T. Ohashi
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Annealing Temperature ◽  
Lateral Diffusion ◽  
Diffusion Couples ◽  
Product Phase ◽  
Transmission Electron ◽  
Good Agreement

ABSTRACTA new method has been developed for making self-supporting, thin films which can be used for the in situ study, by hot-stage, transmission electron microscopy, of the reaction between Ni and GaAs. The thin-film, lateral diffusion-couples have been used to study both the kinetics and the formation of new phases. The growth rate of the ternary compound, N2GaAs showed a parabolic time dependence. At an annealing temperature of 300*C, the present experimental results show that Ni is the diffusing species and that the Ga and As remain essentially immobile. Diffusion coefficients obtained by this method are in very good agreement with those which have been obtained using conventional thin-film techniques. The results of this new technique are particularly important in view of the difficulty in identifying the composition of the product phase by methods which do not have the same lateral resolution.

Lateral diffusion in Ni–GaAs couples investigated by transmission electron microscopy

1988 ◽  
Vol 3 (6) ◽  
pp. 1385-1396 ◽  
Author(s):  
S. H. Chen ◽  
C. B. Carter ◽  
C. J. PalmstrΦm
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Time Dependence ◽  
Ternary Phase ◽  
Lateral Diffusion ◽  
Diffusion Couples ◽  
Bulk Gaas ◽  
Transmission Electron

A method has been devised for preparing lateral Ni–GaAs diffusion couples for transmission electron microscopy investigations. By annealing diffusion couples in situ in a hot stage, the growth of a ternary phase has been observed in the microscope, and shows parabolic time dependence of the growth. In the temperature range of 200–300 °C, Ni is the predominant diffusing species in the ternary phase while Ga and As are essentially immobile. The experimental results are compared with previous investigations of the reactions of Ni thin films with bulk GaAs.

Lateral-diffusion couples studied by transmission electron microscopy

1984 ◽  
Vol 2 (6) ◽  
pp. 469-476 ◽  
Author(s):  
S.H. Chen ◽  
L.R. Zheng ◽  
J.C. Barbour ◽  
E.C. Zingu ◽  
L.S. Hung ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Lateral Diffusion ◽  
Diffusion Couples ◽  
Transmission Electron

Metastable Phases and the Molecular Beam Epitaxy of Metal Silicides

1987 ◽  
Vol 104 ◽  
Author(s):  
J. M. Gibson
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Molecular Beam ◽  
Interface Energy ◽  
Metastable Phases ◽  
Transmission Electron ◽  
Metal Silicides

ABSTRACTThe growth of the epitaxial silicides NiSi2 and CoSi2 on Si is discussed from observations made by in-situ transmission electron microscopy. In particular, we observe the occurrence of epitaxial metastable phases which arise from the dominance of interface energy in extremely thin films. Such phases relate to the thickness dependence of the microstructure in these silicides and may be expected to occur in many binary and more complex thin film systems.

Investigation of Intermetallic Phase Formation and Structural Analysis in Annealed Al/Cu Bilayer Thin Films

2013 ◽  
Vol 845 ◽  
pp. 221-225
Author(s):  
Zulhelmi Alif Abdul Halim ◽  
Muhammad Azizi Mat Yajid ◽  
Zulkifli Mohd Rosli ◽  
Riyaz Ahmad Mohamad Ali
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Structural Analysis ◽  
Annealing Temperature ◽  
Intermetallic Phase ◽  
Intermetallic Phases ◽  
X Ray ◽  
Transmission Electron

The growth of intermetallic phases in Al/Cu bilayers thin film having 2/3 layer thickness ratios were characterized by X-ray powder diffraction (XRD), energy dispersive X-ray (EDX) and transmission electron microscopy (TEM). In annealing temperature of 200 °C, the growth is controlled by Cu diffusion which resulted to formation of θ-Al2Cu, η-AlCu, ζ-Al3Cu4 and γ-Al4Cu9 phase.

Finite element modeling of stress variation in multilayer thin-film specimens for in situ transmission electron microscopy experiments

2007 ◽  
Vol 22 (10) ◽  
pp. 2737-2741 ◽  
Author(s):  
H. Mei ◽  
J.H. An ◽  
R. Huang ◽  
P.J. Ferreira
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Finite Element Method ◽  
Transmission Electron Microscopy ◽  
Finite Element ◽  
Residual Stresses ◽  
Multilayer Thin Film ◽  
Stress Variation ◽  
Transmission Electron

Multilayer thin-film materials with various thicknesses, compositions, and deposition methods for each layer typically exhibit residual stresses. In situ transmission electron microscopy (TEM) is a powerful technique that has been used to determine correlations between residual stresses and the microstructure. However, to produce electron transparent specimens for TEM, one or more layers of the film are sacrificed, thus altering the state of stresses. By conducting a stress analysis of multilayer thin-film TEM specimens, using a finite element method, we show that the film stresses can be considerably altered after TEM sample preparation. The stress state depends on the geometry and the interactions among multiple layers.

Kinetics of Vacancy Ordering in YSi2−x Thin Film on Silicon

1991 ◽  
Vol 230 ◽  
Author(s):  
T. L. Lee ◽  
L. J. Chen ◽  
F. R. Chen
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Annealing Temperature ◽  
Stacking Faults ◽  
Step Structure ◽  
Transmission Electron ◽  
Vacancy Ordering ◽  
Kinetics Of

AbstractHigh resolution and conventional transmission electron microscopy have been applied to study the interfacial reaction of yttrium thin films on Si. Epitaxial Ysi2−x film was grown on (111)Si by rapid thermal annealing at 500–1000 °C. The orientation relationship between yttrium silicide and (111)Si was determined to be [0001]Ysi2−x//[111]Si and (1010)Ysi2−x//(112)Si. The vacancies in the Ysi2−x film were found to be ordered in the Si sublattice plane and form an out-of-step structure. The range of M values of the out-of-step structure was found to narrow with annealing temperature and time. Defects along specific crystallographic directions were observed and analyzed to be intrinsic stacking faults.

scholarly journals Nanocrystal Diffusion in a Liquid Thin Film Observed by in Situ Transmission Electron Microscopy

Nano Letters ◽  
2009 ◽  
Vol 9 (6) ◽  
pp. 2460-2465 ◽  
Author(s):  
Haimei Zheng ◽  
Shelley A. Claridge ◽  
Andrew M. Minor ◽  
A. Paul Alivisatos ◽  
Ulrich Dahmen
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Transmission Electron
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