Stability of Heavily Doped Si Formed by As+ Implantation and Rapid Thermal Annealing
Keyword(s):
ABSTRACTDeactivation of ion implanted and rapid thermal annealed (RTA) metastable arsenic in silicon during subsequent furnace annealing has been studied by sheet resistance measurement, Rutherford backs cat t ering/ channeling (RBS), and transmission electron microscopy (TEM). Following RTA, thermal annealing induces deactivation of the dopant which increases the sheet resistivity monotonically with temperature for a very short time, Dislocation loops are formed near the peak of As concentration at post-anneal temperatures of 750°C or higher, where deactivation rate is fast. At lower temperatures deactivation is accompanied by displacement of As atoms, possibly forming clusters.
1970 ◽
Vol 28
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pp. 412-413
1978 ◽
Vol 36
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pp. 328-329
1985 ◽
Vol 43
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pp. 172-173
1995 ◽
Vol 449
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pp. 295-313
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1972 ◽
Vol 26
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pp. 1233-1235
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