Micromachined SFM Probes for High-Frequency Electric and Magnetic Fields

1997 ◽  
Vol 500 ◽  
Author(s):  
D. W. Van Der Weide ◽  
V. Agrawal ◽  
P. Neuzil ◽  
T. Bork
Keyword(s):  
Millimeter Wave ◽  
High Frequency ◽  
Magnetic Loop ◽  
Complete Characterization ◽  
Wave Regime ◽  
Simultaneous Acquisition ◽  
Electric And Magnetic Fields ◽  
Scanning Force ◽  
Characterization Of Materials

ABSTRACTWe discuss micromachined localized high-frequency electric (coaxial) and magnetic (loop) field probes integrated with scanning force microscopes. Our approach enables simultaneous acquisition of both field and topography in the radio frequency (RF) through millimeter-wave regime, enabling more complete characterization of materials, devices and circuits.

scholarly journals Complete Characterization of Novel MHMICs for V-Band Communication Systems

2013 ◽  
Vol 2013 ◽  
pp. 1-9 ◽  
Author(s):  
C. Hannachi ◽  
D. Hammou ◽  
T. Djerafi ◽  
Z. Ouardirhi ◽  
S. O. Tatu
Keyword(s):  
Wireless Communication ◽  
Millimeter Wave ◽  
Communication Systems ◽  
Complete Characterization ◽  
Power Divider ◽  
Wireless Communication Systems ◽  
V Band ◽  
Hybrid Coupler ◽  
Millimeter Wave Circuits

This paper presents the characterization results of several new passive millimeter wave circuits integrated on very thin ceramic substrate. The work is focused on the design and characterization of a novel rounded Wilkinson power divider, a 90° hybrid coupler, a rat-race coupler, and a novel six-port (multiport) circuit. Measurements show the wideband characteristics, allowing therefore their use for multi-Gb/s V-band wireless communication systems.

scholarly journals Characterization of Natural Gypsum Materials and Their Composites for Building Applications

2019 ◽  
Vol 9 (12) ◽  
pp. 2443 ◽  
Author(s):  
Said Bouzit ◽  
Said Laasri ◽  
Mohamed Taha ◽  
Abdelaziz Laghzizil ◽  
Abdelowahed Hajjaji ◽  
...  
Keyword(s):  
Water Content ◽  
High Frequency ◽  
Transmission Loss ◽  
Complete Characterization ◽  
Sound Insulation ◽  
Acoustic Characteristics ◽  
Acoustic Performance ◽  
Heating And Cooling ◽  
Insulation Performance

Building retrofitting plays a key-role in energy saving and a growing interest is focused on insulating materials that allow a reduction in heat loss from envelopes with low thickness, by a process of reducing heating and cooling demand. In this context, a complete characterization of the physical properties of Moroccan natural gypsum materials was carried out. Basic information on the mineralogical, microstructure, thermal, mechanical, and acoustic characteristics of the rocks sampled from two Moroccan regions is provided. It was found that mineralogy, porosity, and water content are the main factors governing the development of the structure and the strength of the samples. The measured values of the porosity were 8.94%, the water content varied between 2.5–3.0% for the two studied typologies, coming from Agadir and Safi, respectively. Gypsum powder was used for fabricating samples, which were investigated in terms of thermal and acoustic performance. Thermal properties were measured by means of a hot disk apparatus and values of conductivity of 0.18 W/mK and 0.13 W/mK were obtained for Agadir and Safi Gypsum, respectively. The acoustic performance was evaluated in terms of absorption coefficient and sound insulation, measured by means of a Kundt’s Tube (ISO 10534-2). The absorption coefficients were slightly higher than the ones of conventional plasters with similar thickness. A good sound insulation performance was confirmed, especially for Safi Gypsum, with a transmission loss-value up to about 50 dB at high frequency.

Multi-Physics of Nanoscale Thin Films and Interfaces

2011 ◽  
Author(s):  
M. A. Haque
Keyword(s):  
Thin Films ◽  
Tensile Fracture ◽  
Simultaneous Acquisition ◽  
Transmission Electron ◽  
Properties Of Materials ◽  
Mechanical Tensile ◽  
Characterization Of Materials ◽  
Materials Behavior

We present the design and fabrication of a microchip capable of performing mechanical (tensile, fracture, fatigue), electrical (conductivity and band gap) and thermal (conductivity and specific heat) characterization of materials and interfaces. The chip can study thin films and wires of any material that can be deposited on a substrate or study thin coupons if the specimen is in bulk form. The 3 mm × 3 mm size of the chip results in the unique capability of in-situ testing in analytical chambers such as the transmission electron microscope. The basic concept is to ’see’ the micro-mechanisms while ‘measuring’ the deformation and transport properties of materials and interfaces. The advantage of such simultaneous acquisition of quantitative and qualitative data is the accurate and quick physics-based modeling of materials behavior. We present preliminary studies on multi-physics, or the coupling among mechanical thermal and electrical domains in materials will be presented. These results are particularly important when the specimen dimension becomes comparable to the mean free paths of electron and phonons.

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