Electrical Properties of Novel Anodic Films Formed in Nonaqueous Electrolyte Solutions

1997 ◽  
Vol 500 ◽  
Author(s):  
F. Mizutani ◽  
S. Takeuchi ◽  
T. Nishiwaki ◽  
N. Sato ◽  
M. Ue

ABSTRACTAn aluminum alloy (Al - 1.0% Si - 0.5% Cu) was anodized in nonaqueous electrolyte solutions containing propylene carbonate (PC), ethylene glycol (EG), or γ-butyrolactone (GBL) as a solvent. MIM (metal-insulator-metal) elements using these anodic films were made to evaluate their electrical properties. Leakage current of the anodic films formed in the nonaqueous solutions was lower than those formed in aqueous electrolyte solutions. These novel films are useful as a high insulating film used for a gate insulator in thin film transistor liquid crystal displays (TFT-LCD).

1992 ◽  
Vol 284 ◽  
Author(s):  
S. Scaglione ◽  
L. Mariucci ◽  
A. Mattacchini ◽  
A. Pecora ◽  
G. Fortunato

ABSTRACTIn the present work structural and electrical properties of thin films, deposited by PECVD from He-diluted S1H4+NH3+N2O gas mixtures, have been studied. Film compositions have been analyzed by NRA, RBS and hydrogen content has been determinated by ERDA while Infrared spectroscopy has been used to evaluate the local bonding configurations. Electrical properties have been measured in metal-insulator-metal structures by I-V ramp. From the results obtained, the oxynitride films show suitable properties for application as gate insulator in amorphous silicon thin film transistor.


2002 ◽  
Vol 107 (1) ◽  
pp. 80-89 ◽  
Author(s):  
Guillaume Herlem ◽  
Pierre Tran-Van ◽  
Pascal Marque ◽  
Sébastien Fantini ◽  
Jean-François Penneau ◽  
...  

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