Effects of Sputtered Ir and IrO2 Electrodes on the Properties of PZT Thin Films Deposited By MOCVD

1997 ◽  
Vol 493 ◽  
Author(s):  
M. Shimizu ◽  
H. Fujisawa ◽  
S. Hyodo ◽  
S. Nakashima ◽  
H. Niu ◽  
...  

ABSTRACTThe effect of bottom electrode thickness on the electrical properties of PZT capacitors with Ir and IrO2, electrodes was investigated, with particular attention to switching endurance characteristics. Ir and IrO2 electrodes were prepared by rf magnetron sputtering. PZT films were grown by MOCVD. Secondary ion mass spectrometry (SIMS) analysis showed thick Ir and IrO2 electrodes performed well as a barrier to the PZT elements. On the other hand, strong diffusion at the interface between PZT and the electrodes was observed, when the Ir and IrO2 electrodes were thin. From transmission electron microscope (TEM) observation, it was also found that there was an amorphous intermediate layer at the interface between the PZT and the thick Ir bottom electrode. The switching endurance characteristics were influenced by the thickness of the Ir bottom electrode.

1999 ◽  
Vol 557 ◽  
Author(s):  
W. Qin ◽  
D. G. Ast ◽  
T. I. Kamins

AbstractThe segregation of phosphorus to grain boundaries in phosphorus implanted Si0.87Ge0.13 films, deposited by chemical vapor deposition (CVD), was directly observed by scanning transmission electron microscopy (STEM) with energy dispersive x-ray (EDX) microanalysis. The segregation was determined to be a thermal equilibrium process by measuring and comparing the average phosphorus concentrations at the grain boundaries in Si0.87Ge0.13 films subjected to 700, 750 or 800°C annealing, following the implantation and 1000°C annealing processes. The measured segregation energy was 0.28 eV/atom. No Ge segregation was found at grain boundaries in phosphorus implanted Si0.87Ge0.13 films by STEM x-ray microanalysis. Neither was evidence shown by STEM microanalysis that Ge segregated to grain boundaries in intrinsic Si1-xGex films with x = 0.02, 0.13 and 0.31. Secondary ion mass spectrometry (SIMS) analysis showed that these intrinsic Si1-xGex films contained 1019 to 4 × 1019/cm-3H, depending on the deposition temperature.


2013 ◽  
Vol 1538 ◽  
pp. 9-14 ◽  
Author(s):  
M. Edoff ◽  
P.M.P. Salomé ◽  
A. Hultqvist ◽  
V. Fjällström

ABSTRACTNaF precursor layers used for providing Na to Cu(In,Ga)Se2 (CIGS) grown on Na-free substrates have been studied. The NaF layers were deposited on top of the Mo back contact prior to the CIGS co-evaporation process. The co-evaporation process was interrupted after the preheating steps, and after part of the CIGS layer was grown. Completed samples were also studied. After the preheating, the NaF layers were analyzed with X-ray Photoelectron Spectroscopy and after growing part and all of the CIGS film, the Mo/NaF/CIGS stack was characterized using transmission electron microscopy (TEM) and secondary ion mass spectrometry (SIMS). The NaF layers were found to be stable in thickness and composition during the pre-heating in selenium containing atmosphere before the CIGS process. The TEM analyses on the partly grown samples show a layer at the CIGS/Mo interface, which we interpret as a partly consumed NaF layer. This is corroborated by the SIMS analysis. In finalized samples the results are less clear, but TEM images show an increased porosity at the position of the NaF layer.


Author(s):  
Yanhua Huang ◽  
Lei Zhu ◽  
Kenny Ong ◽  
Hanwei Teo ◽  
Younan Hua

Abstract Contamination in the gate oxide layer is the most common effect which cause the gate oxide integrate (GOI) issue. Dynamic Secondary Ion Mass Spectrometry (SIMS) is a mature tool for GOI contamination analysis. During the sample preparation, all metal and IDL layers above poly should be removed because the presence of these layers added complexity for the subsequent SIMS analysis. The normal delayering process is simply carried out by soaking the sample in the HF solution. However, the poly surface is inevitably contaminated by surroundings even though it is already a practice to clean with DI rinse and tape. In this article, TOFSIMS with low energy sputter gun is used to clean the sample surface after the normal delayering process. The residue signals also can be monitored by TOF SIMS during sputtering to confirm the cross contamination is cleared. After that, a much lower background desirable by dynamic SIMS. Thus an accurate depth profile in gate oxide layer can be achieved without the interference from surface.


1992 ◽  
Vol 262 ◽  
Author(s):  
J.W. Honeycutt ◽  
J. Ravi ◽  
G. A. Rozgonyi

ABSTRACTThe effects of Ti and Co silicidation on P+ ion implantation damage in Si have been investigated. After silicidation of unannealed 40 keV, 2×1015 cm-2 P+ implanted junctions by rapid thermal annealing at 900°C for 10–300 seconds, secondary ion mass spectrometry depth profiles of phosphorus in suicided and non-silicided junctions were compared. While non-silicided and TiSi2 suicided junctions exhibited equal amounts of transient enhanced diffusion behavior, the junction depths under COSi2 were significantly shallower. End-of-range interstitial dislocation loops in the same suicided and non-silicided junctions were studied by planview transmission electron microscopy. The loops were found to be stable after 900°C, 5 minute annealing in non-silicided material, and their formation was only slightly effected by TiSi2 or COSi2 silicidation. However, enhanced dissolution of the loops was observed under both TiSi2 and COSi2, with essentially complete removal of the defects under COSi2 after 5 minutes at 900°C. The observed diffusion and defect behavior strongly suggest that implantation damage induced excess interstitial concentrations are significantly reduced by the formation and presence of COSi2, and to a lesser extent by TiSi2. The observed time-dependent defect removal under the suicide films suggests that vacancy injection and/or interstitial absorption by the suicide film continues long after the suicide chemical reaction is complete.


BioResources ◽  
2016 ◽  
Vol 11 (2) ◽  
pp. 5581-5599
Author(s):  
Hong Yan Mou ◽  
Shubin Wu ◽  
Pedro Fardim

Time-of-flight secondary-ion mass spectrometry (ToF-SIMS) is an advanced surface-sensitive technique that can provide both spectral and imaging information about materials. Recently, ToF-SIMS has been used for advanced studies of lignocellulosic biomass. In the current article, the application of ToF-SIMS to the characterization of the surface chemical composition and distribution of biomass components in lignocelluloses is reviewed. Moreover, extended applications of ToF-SIMS in the study of pretreatments, modification of biomaterials, and enzyme activity of lignocellulosic materials are presented and discussed. Sample preparation prior to ToF-SIMS analysis and subsequent interpretation of results is a critical factor in ensuring reliable results. The focus of this review is to give a comprehensive understanding of and offer new hints about the effects of processing conditions on the surface chemistry of lignocellulosic biomass.


Author(s):  
В.В. Привезенцев ◽  
В.С. Куликаускас ◽  
В.А. Скуратов ◽  
О.С. Зилова ◽  
А.А. Бурмистров ◽  
...  

AbstractSingle-crystal n -Si(100) wafers are implanted with ^64Zn^+ ions with an energy of 50 keV and dose of 5 × 10^16 cm^–2. Then the samples are irradiated with ^132Xe^26+ ions with an energy of 167 MeV in the range of fluences from 1 × 10^12 to 5 × 10^14 cm^–2. The surface and cross section of the samples are visualized by scanning electron microscopy and transmission electron microscopy. The distribution of implanted Zn atoms is studied by time-of-flight secondary-ion mass spectrometry. After irradiation with Xe, surface pores and clusters consisting of a Zn–ZnO mixture are observed at the sample surface. In the amorphized subsurface Si layer, zinc and zinc-oxide phases are detected. After irradiation with Xe with a fluence of 5 × 10^14 cm^–2, no zinc or zinc-oxide clusters are detected in the samples by the methods used in the study.


2000 ◽  
Vol 650 ◽  
Author(s):  
Te-Sheng Wang ◽  
A.G. Cullis ◽  
E.J.H. Collart ◽  
A.J. Murrell ◽  
M.A. Foad

ABSTRACTBoron is the most important p-type dopant in Si and it is essential that, especially for low energy implantation, both as-implanted B distributions and those produced by annealing should be characterized in very great detail to obtain the required process control for advanced device applications. While secondary ion mass spectrometry (SIMS) is ordinarily employed for this purpose, in the present studies implant concentration profiles have been determined by direct B imaging with approximately nanometer depth and lateral resolution using energy-filtered imaging in the transmission electron microscopy. The as-implanted B impurity profile is correlated with theoretical expectations: differences with respect to the results of SIMS measurements are discussed. Changes in the B distribution and clustering that occur after annealing of the implanted layers are also described.


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