Porous Silicon as a Sacrificial Material for Micromachining of Silicon Optical Platforms

1997 ◽  
Vol 486 ◽  
Author(s):  
M. Guendouz ◽  
P. Joubert ◽  
N. Pedrono ◽  
J. Le Rouzic

AbstractPorous silicon obtained by the anodization of heavily doped n+-type silicon wafers was used as a sacrificial layer to micromachine silicon platforms. The effect of experimental parameters, such as the nature of the masking layer, current density and anodization time, on the geometry of the porous Si formed in patterned substrate is shown. Advantages of this method on the orientation-dependent chemical etching (ODCE), which is classically used for optical fiber alignment, are discussed.

1992 ◽  
Vol 283 ◽  
Author(s):  
S. Mtyazaki ◽  
K. Sakamoto ◽  
K. Shiba ◽  
M. Hirose

ABSTRACTPhotoluminescence from l–3μm thick porous Si layers prepared by anodization of p-type c-Si wafers and subsequent chemical etching exhibits an anomalous temperature dependence and light-induced degradation. The luminescence intensity is almost quenched at temperatures below 30K and recovered by laser irradiation at 48K. This quenching phenomenon is not observed for PS thicker than 10μm. The luminescence fatigue is partially recovered by annealing at 150°C for 5min during which no further oxidation takes place. These observations are interpreted in terms of the structural metastability of hydrogen-terminated porous Si.


1996 ◽  
Vol 426 ◽  
Author(s):  
A. X. Coles ◽  
R. A. Gerhardt ◽  
A. Rohatgi

AbstractThe potential use of porous silicon as an antireflective coating on solar cells has recently been recognized. This study investigates the effect of current density, anodization time, and surface conditions on the reflectance of porous silicon which was fabricated by anodizing (100) float zone single crystal Si wafers. The wafers were coated on one side with Al prior to anodization, and a HFbased solution was used as the electrolyte. Current densities of 5 – 100 mA/cm2 were used to anodize both polished and unpolished wafers over time intervals ranging from 2sec - 30 minutes. Reflectance properties were tested over the 400 - 1100 nm range, and minimum reflectances of 3 – 5% were achieved. The reflectance of the best porous Si sample normalized with respect to the sun's spectrum compares favorably with the reflectance of a double layer ZnS/ MgF2 with prior texturing.


2004 ◽  
Vol 828 ◽  
Author(s):  
Sergey Ya. Andrushin ◽  
Leonid A. Balagurov ◽  
Sue C. Bayliss ◽  
Galina V. Liberova ◽  
Elena A. Petrova ◽  
...  

ABSTRACTFormation processes of porous silicon on insulating substrate were studied. It was demonstrated that both electrochemical and chemical formation methods allow to transform heavily doped p-type polycrystalline silicon into homogeneous porous silicon. Porous silicon was successfully used as sacrificial layer in the fabrication process of microbridge structures.


2021 ◽  
Vol 16 (1) ◽  
Author(s):  
Yijie Li ◽  
Nguyen Van Toan ◽  
Zhuqing Wang ◽  
Khairul Fadzli Bin Samat ◽  
Takahito Ono

AbstractPorous silicon (Si) is a low thermal conductivity material, which has high potential for thermoelectric devices. However, low output performance of porous Si hinders the development of thermoelectric performance due to low electrical conductivity. The large contact resistance from nonlinear contact between porous Si and metal is one reason for the reduction of electrical conductivity. In this paper, p- and n-type porous Si were formed on Si substrate by metal-assisted chemical etching. To decrease contact resistance, p- and n-type spin on dopants are employed to dope an impurity element into p- and n-type porous Si surface, respectively. Compared to the Si substrate with undoped porous samples, ohmic contact can be obtained, and the electrical conductivity of doped p- and n-type porous Si can be improved to 1160 and 1390 S/m, respectively. Compared with the Si substrate, the special contact resistances for the doped p- and n-type porous Si layer decreases to 1.35 and 1.16 mΩ/cm2, respectively, by increasing the carrier concentration. However, the increase of the carrier concentration induces the decline of the Seebeck coefficient for p- and n-type Si substrates with doped porous Si samples to 491 and 480 μV/K, respectively. Power factor is related to the Seebeck coefficient and electrical conductivity of thermoelectric material, which is one vital factor that evaluates its output performance. Therefore, even though the Seebeck coefficient values of Si substrates with doped porous Si samples decrease, the doped porous Si layer can improve the power factor compared to undoped samples due to the enhancement of electrical conductivity, which facilitates its development for thermoelectric application.


2013 ◽  
Author(s):  
Igor Iatsunskyi ◽  
Valentyn Smyntyna ◽  
Mykolai Pavlenko ◽  
Olga Kanevska ◽  
Yuliia Kirik ◽  
...  

2016 ◽  
Author(s):  
Evert Ebraert ◽  
Markus Wissmann ◽  
Nicole Barié ◽  
Markus Guttmann ◽  
Marc Schneider ◽  
...  

2017 ◽  
Vol 5 (35) ◽  
pp. 9005-9011 ◽  
Author(s):  
Ju Hwan Kim ◽  
Dong Hee Shin ◽  
Ha Seung Lee ◽  
Chan Wook Jang ◽  
Jong Min Kim ◽  
...  

The co-doping of graphene with Au nanoparticles and bis(trifluoromethanesulfonyl)-amide is employed for the first time to enhance the performance of graphene/porous Si solar cells.


2017 ◽  
Vol 2 (33) ◽  
pp. 10865-10870 ◽  
Author(s):  
Chien-Hsin Tang ◽  
Wen-Jin Li ◽  
Chia-Hsiang Hung ◽  
Po-Hsuan Hsiao ◽  
Chia-Yun Chen

2015 ◽  
Vol 86 (1-4) ◽  
pp. 953-961 ◽  
Author(s):  
K. G. P. Folkersma ◽  
G. R. B. E. Römer ◽  
D. M. Brouwer ◽  
J. L. Herder

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