Stress Controlled MBE-growth of GaN:Mg and GaN:Si

1997 ◽  
Vol 482 ◽  
Author(s):  
Y. Kim ◽  
R. Klockenbrink ◽  
C. Kisielowski ◽  
J. Krueger ◽  
D. Corlatan ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Defect Formation ◽  
Lattice Mismatch ◽  
Flux Ratio ◽  
Layer Growth ◽  
Mbe Growth ◽  
Lattice Constants ◽  
Thermal Expansion Coefficients ◽  
Stress Changes ◽  
Formation Energies

AbstractThe stress in GaN thin films grown on sapphire is shown to be determined by lattice mismatch, by differences in thermal-expansion-coefficients and by the incorporation of point defects. It can be controlled by the buffer layer thickness, the buffer layer growth temperature, the V/III flux ratio, and by doping. It is argued that a Fermi-level dependence of defect formation energies affects the material stoichiometry and thereby lattice constants and stresses. We observed that stress relaxation occurred if the stresses exceeded a critical compressive or tensile stress value. The stress changes materials properties. As an example, it is demonstrated that the electron Hall mobility in GaN:Si can be increased with constant electron carrier concentration if large compressive stress is present.

scholarly journals MOCVD Grown HgCdTe Heterostructures for Medium Wave Infrared Detectors

Coatings ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 611
Author(s):  
Waldemar Gawron ◽  
Jan Sobieski ◽  
Tetiana Manyk ◽  
Małgorzata Kopytko ◽  
Paweł Madejczyk ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Infrared Detectors ◽  
Lattice Mismatch ◽  
Layer Growth ◽  
Ex Situ ◽  
Current Status ◽  
Organic Chemical ◽  
Infrared Band ◽  
Donor And Acceptor ◽  
Wide Range

This paper presents the current status of medium-wave infrared (MWIR) detectors at the Military University of Technology’s Institute of Applied Physics and VIGO System S.A. The metal–organic chemical vapor deposition (MOCVD) technique is a very convenient tool for the deposition of HgCdTe epilayers, with a wide range of compositions, used for uncooled infrared detectors. Good compositional and thickness uniformity was achieved on epilayers grown on 2-in-diameter, low-cost (100) GaAs wafers. Most growth was performed on substrates, which were misoriented from (100) by between 2° and 4° in order to minimize growth defects. The large lattice mismatch between GaAs and HgCdTe required the usage of a CdTe buffer layer. The CdTe (111) B buffer layer growth was enforced by suitable nucleation procedure, based on (100) GaAs substrate annealing in a Te-rich atmosphere prior to the buffer deposition. Secondary-ion mass spectrometry (SIMS) showed that ethyl iodide (EI) and tris(dimethylamino)arsenic (TDMAAs) were stable donor and acceptor dopants, respectively. Fully doped (111) HgCdTe heterostructures were grown in order to investigate the devices’ performance in the 3–5 µm infrared band. The uniqueness of the presented technology manifests in a lack of the necessity of time-consuming and troublesome ex situ annealing.

Effect of N/Ga Flux Ratio in GaN Buffer Layer Growth by MBE on (0001) Sapphire on Defect Formation in the GaN Main Layer

1999 ◽  
Vol 572 ◽  
Author(s):  
S. Ruvimov ◽  
Z. Liliental-Weber ◽  
J. Washburn ◽  
Y. Kim ◽  
G. S. Sudhir ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Buffer Layer ◽  
Defect Formation ◽  
Flux Ratio ◽  
Growth Conditions ◽  
Buffer Layers ◽  
Simultaneous Increase ◽  
Growth Stages ◽  
Dislocation Generation ◽  
Gan Buffer Layer

ABSTRACTTransmission electron microscopy was employed to study the effect of N/Ga flux ratio in the growth of GaN buffer layers on the structure of GaN epitaxial layers grown by molecular-beamepitaxy (MBE) on sapphire. The dislocation density in GaN layers was found to increase from 1×1010 to 6×1010 cm−2 with increase of the nitrogen flux from 5 to 35 sccm during the growth of the GaN buffer layer with otherwise the same growth conditions. All GaN layers were found to contain inversion domain boundaries (IDBs) originated at the interface with sapphire and propagated up to the layer surface. Formation of IDBs was often associated with specific defects at the interface with the substrate. Dislocation generation and annihilation were shown to be mainly growth-related processes and, hence, can be controlled by the growth conditions, especially during the first growth stages. The decrease of electron Hall mobility and the simultaneous increase of the intensity of “green” luminescence with increasing dislocation density suggest that dislocation-related deep levels are created in the bandgap.

Doping-Induced Lattice Mismatch and Misorientation in 4H-SiC Crystals

2012 ◽  
Vol 717-720 ◽  
pp. 481-484 ◽  
Author(s):  
Sho Sasaki ◽  
Jun Suda ◽  
Tsunenobu Kimoto
Keyword(s):  
Lattice Mismatch ◽  
Nitrogen Concentration ◽  
High Dose ◽  
Lattice Expansion ◽  
Free Standing ◽  
Reciprocal Space Mapping ◽  
Lattice Contraction ◽  
Lattice Constants ◽  
Thermal Expansion Coefficients ◽  
Heavily Doped

Thec- anda-lattice constants of nitrogen-doped 4H-SiC were measured in the wide temperature range (RT - 1100°C). The samples used in this study were heavily doped substrates and lightly-doped free-standing epilayers. The lattice constants at room temperature are almost identical for all the samples. However, the lattice contraction by heavy nitrogen doping was clearly observed at high temperatures, which indicates that the thermal expansion coefficients are dependent on the nitrogen concentration. The lattice mismatch (Δd/d) between a lightly-doped free-standing epilayer (Nd= 6x1014cm-3) and a heavily-doped substrate (Nd= 2x1019cm-3) was calculated as 1.7x10-4at 1100°C. The authors also investigated lattice constants of high-dose N+, P+, and Al+-implanted 4H-SiC. Reciprocal space mapping (RSM) was utilized to investigate the lattice mismatch and misorientation. The RSM images show thec-lattice expansion andc-axis tilt of the ion-implanted layers, irrespective of ion species. The authors conclude that the lattice expansion is not caused by heavy doping itself, but by secondary defects formed after the ion-implantation and activation-annealing process.

scholarly journals Effect of Buffer Layer and III/V Ratio on the Surface Morphology of Gan Grown by MBE

1999 ◽  
Vol 4 (S1) ◽  
pp. 417-422 ◽  
Author(s):  
E. C. Piquette ◽  
P. M. Bridger ◽  
R. A. Beach ◽  
T. C. McGill
Keyword(s):  
Surface Morphology ◽  
Buffer Layer ◽  
Flux Ratio ◽  
Plasma Source ◽  
Growth Conditions ◽  
Nitrogen Plasma ◽  
Layer Growth ◽  
Buffer Layers ◽  
Flat Surfaces ◽  
Aln Buffer

The surface morphology of GaN is observed by atomic force microscopy for growth on GaN and AlN buffer layers and as a function of III/V flux ratio. Films are grown on sapphire substrates by molecular beam epitaxy using a radio frequency nitrogen plasma source. Growth using GaN buffer layers leads to N-polar films, with surfaces strongly dependent on the flux conditions used. Flat surfaces can be obtained by growing as Ga-rich as possible, although Ga droplets tend to form. Ga-polar films can be grown on AlN buffer layers, with the surface morphology determined by the conditions of buffer layer deposition as well as the III/V ratio for growth of the GaN layer. Near-stoichiometric buffer layer growth conditions appear to support the flattest surfaces in this case. Three defect types are typically observed in GaN films on AlN buffers, including large and small pits and “loop” defects. It is possible to produce surfaces free from large pit defects by growing thicker films under more Ga-rich conditions. In such cases the surface roughness can be reduced to less than 1 nm RMS.

scholarly journals Effect of Buffer Layer and III/V Ratio on the Surface Morphology of Gan Grown by MBE

1998 ◽  
Vol 537 ◽  
Author(s):  
E. C. Piquette ◽  
P. M. Bridger ◽  
R. A. Beach ◽  
T. C. McGill
Keyword(s):  
Surface Morphology ◽  
Buffer Layer ◽  
Flux Ratio ◽  
Plasma Source ◽  
Growth Conditions ◽  
Nitrogen Plasma ◽  
Layer Growth ◽  
Buffer Layers ◽  
Flat Surfaces ◽  
Aln Buffer

AbstractThe surface morphology of GaN is observed by atomic force microscopy for growth on GaN and AlN buffer layers and as a function of III/V flux ratio. Films are grown on sapphire substrates by molecular beam epitaxy using a radio frequency nitrogen plasma source. Growth using GaN buffer layers leads to N-polar films, with surfaces strongly dependent on the flux conditions used. Flat surfaces can be obtained by growing as Ga-rich as possible, although Ga droplets tend to form. Ga-polar films can be grown on AlN buffer layers, with the surface morphology determined by the conditions of buffer layer deposition as well as the III/V ratio for growth of the GaN layer. Near-stoichiometric buffer layer growth conditions appear to support the flattest surfaces in this case. Three defect types are typically observed in GaN films on AlN buffers, including large and small pits and “loop” defects. It is possible to produce surfaces free from large pit defects by growing thicker films under more Ga-rich conditions. In such cases the surface roughness can be reduced to less than l nm RMS.

scholarly journals MBE Growth and Optical Properties of GaN, InN, and A3 B5 Nanowires on SiC/Si(111) Hybrid Substrate

2018 ◽  
Vol 2018 ◽  
pp. 1-5
Author(s):  
R. R. Reznik ◽  
K. P. Kotlyar ◽  
I. V. Ilkiv ◽  
A. I. Khrebtov ◽  
I. P. Soshnikov ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
Optical Properties ◽  
Buffer Layer ◽  
Silicon Substrate ◽  
Lattice Mismatch ◽  
Structural Quality ◽  
Optical Studies ◽  
Mbe Growth

The possibility of GaN, InN, and A3B5 nanowires MBE growth on a silicon substrate with a nanoscale SiC buffer layer has been demonstrated. Optical studies indicated a higher structural quality GaN NWs compared with the best structures of GaN NWs without silicon carbide buffer layer. The diameter of A3B5 NWs is smaller than diameter of similar NWs which were grown on a silicon substrate, because of higher lattice mismatch. In particular, InAs NWs diameter was evaluated as little as 10 nm, one of the smallest ever demonstrated for this NWs system.

Two-step Defect Reduction of GaAs/Si Epitaxy by Selective Aspect Ratio Trapping

2007 ◽  
Vol 1030 ◽  
Author(s):  
Jizhong Li ◽  
J. Bai ◽  
C. Major ◽  
M. Carroll ◽  
A. Lochtefeld ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Defect Formation ◽  
Lattice Mismatch ◽  
Defect Density ◽  
Layer Growth ◽  
Threading Dislocations ◽  
Cross Sectional ◽  
Defect Reduction ◽  
Plan View ◽  
Step Defect

AbstractWe report on the MOCVD growth of GaAs on patterned Si utilizing the Aspect Ratio Trapping (ART) method to reduce threading dislocations resulting from lattice mismatch. Defect-free GaAs was obtained from growth in sub-micron trenches formed in SiO2 on Si (001) substrates. Material quality has been characterized by cross-sectional and plan-view TEM and XRD. It was found that when growing GaAs above the trenched region, coalescence-induced threading dislocations (TDs) and planar defects were introduced at the coalescence junction interfaces. These defects were found to be unrelated to the misfit defects (MDs) on GaAs/Si interface that originated during initial epitaxial growth. Causes of coalescence defect formation were experimentally investigated by employing a two-step defect reduction scheme. It is concluded that by further optimizing growth conditions during coalesce layer growth, low defect-density GaAs material can be obtained on Si substrate.

Growth and Characterization of InAs Quantum Dots on GaAsSb

2012 ◽  
Vol 184-185 ◽  
pp. 1001-1005
Author(s):  
Guang Yan Liu ◽  
Wen Cai Wang
Keyword(s):  
Quantum Dots ◽  
Substrate Temperature ◽  
Size Distribution ◽  
Buffer Layer ◽  
Lattice Mismatch ◽  
Flux Ratio ◽  
High Energy ◽  
Inas Quantum Dots ◽  
Dot Density

The growth details of strained GaAsSb layers on GaAs(001) substrates were studied by reflection high energy electron diffraction (RHEED) beam intensity oscillations as a function of both substrate temperature and Sb/As flux ratio. Both the RHEED intensity and RHEED oscillation cycles are reduced with decreasing substrate temperature and Sb/As flux ratio. InAs QDs with high dot density, small dot size and narrow size distribution have been achieved on strained GaAs / GaAsSb buffer layer. The average lateral size of dots shows a trend toward to smaller size and dots’ density shows a trend toward to higher density as the surface Sb composition increasing. The QDs with higher density and smaller size distributions at high Sb composition, indicates that the Sb plays an important role in the dot formation under this growth condition. The lattice mismatch of InAs layer with the GaAsSb buffer layer is reduced with increasing of Sb composition in the GaAsSb interlayer. This result indicates that the density, size and size distribution of self-assembled quantum dots (QDs) can be controlled through the manipulation of the Sb-mediated strain field in the lattice mismatched system.

Thermal Expansion Behavior of ZnSe and ZnS0.03Se0.97 Epilayers on GaAs at Temperatures in the Range, 25°C - 250°C

1994 ◽  
Vol 340 ◽  
Author(s):  
J. R. Kim ◽  
R. M. Park ◽  
K. S. Jones
Keyword(s):  
Thermal Expansion ◽  
Room Temperature ◽  
Lattice Mismatch ◽  
X Ray Diffraction ◽  
Thermal Expansion Behavior ◽  
Lattice Constants ◽  
Thermal Expansion Coefficients ◽  
Expansion Behavior ◽  
Expansion Coefficients ◽  
Lattice Matched

ABSTRACTThe thermal expansion behavior of ZnSe and ZnS0.03Se0.97 epilayers grown on GaAs has been investigated using high resolution X-ray diffraction at temperatures between room temperature and the growth temperature. The lattice parameters perpendicular and parallel to the surface were measured with the Bond's method. The lattice mismatch for a partially relaxed ZnSe layer was Δa(⊥)/a =2300 ppm and Δa(‖)/a = 2600 ppm at room temperature(R.T.) and Δa (⊥)/a =3600 ppm and Δa(‖)/a =2400 ppm at 250°C. For ZnS0.03Se0.97 which is almost lattice matched at R.T. to GaAs, Δa(⊥)/a =200 ppm, Δa(⊥)/a =20ppmatR.T. and Δa(⊥)/a =1400ppm, Δa(⊥)/a =50ppm at 250°C. The relaxed lattice constants were evaluated and the thermal expansion coefficients of relaxed ZnSe layers were found to vary from 7.8*10−6/°C at room temperature to 12.2*10−6/°C at 250°C and for ZnS0.03Se0.97 layers the variation was from 7.5*10−6/°C at R.T. to 11.7*10−6/°C at 250°C.

Bound Exciton Energies, Biaxial Strains, and Defect Microstructures in GaN/AlN/6H-SiC(0001) Heterostructures

1996 ◽  
Vol 449 ◽  
Author(s):  
W. G. Perry ◽  
T. Zheleva ◽  
K. J. Linthicum ◽  
M. D. Bremser ◽  
R. F. Davis ◽  
...  
Keyword(s):  
Defect Formation ◽  
Lattice Mismatch ◽  
Compressive Strain ◽  
Lattice Parameter ◽  
Buffer Layers ◽  
Film Stress ◽  
Thermal Expansion Coefficients ◽  
Transmission Electron ◽  
Defect Microstructures

ABSTRACTBiaxial strains resulting from mismatches in thermal expansion coefficients and lattice parameters in 22 GaN films grown on A1N buffer layers previously deposited on vicinal and on-axis 6H-SiC(0001) substrates were measured via changes in the c-axis lattice parameter (c). Six of the films were in compression, indicating the residual strain due to lattice mismatch was not relieved. A Poisson's ratio of v=0.18 was calculated. The bound exciton energy (EBx) was a linear function of these strains. The shift in EBx with film stress was 23 meV/GPa. The role of the SiC off-axis tilt was investigated for GaN films grown concurrently on the vicinal and on-axis 6H-SiC substrates. Marked variations in EBx and c were observed, with a maximum shift of ΔEBx = 15 meV and Δc = 0.0042 Å. Threading dislocations densities of ~1010/cm2 and ~108/cm2 were determined for GaN films grown on vicinal and on-axis SiC, respectively. A 0.9% residual compressive strain at the GaN/AIN interface was observed by high resolution transmission electron microscopy (HRTEM). It is proposed that the on-axis SiC substrate does not offer a sufficient density of steps for defect formation to relieve the lattice mismatch between GaN and A1N and A1N and SiC.

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