Microstructural and Thermoelectric Properties of P-Type Te–Doped Bi0.5Sb1.5Te3 And N-Type SbI3-Doped Bi2Te2.85Se0.15 Compounds

1997 ◽  
Vol 478 ◽  
Author(s):  
J. Seo ◽  
K. Park ◽  
C. Lee ◽  
J. Kim

AbstractThe p-type Te-doped Bi0.5Sb1.5Te3 and n-type SbI3-doped Bi2Te2.85Se0.15 thermoelectric compounds were fabricated by hot pressing in the temperature range of 380 to 440 °C under 200 MPa in Ar. Both the compounds were highly dense and showed high crystalline quality. The grains of the compounds were preferentially oriented and contained many dislocations through the hot pressing. The fracture path followed the transgranular cleavage planes, which are perpendicular to the c-axis. In addition, with increasing the pressing temperature, the figure of merit was increased. The highest values of figure of merit for the p- and n-type compounds, which were obtained at 420 °C, were 2.69 × 10−3/K and 2.35×10−3/K, respectively.

1997 ◽  
Vol 478 ◽  
Author(s):  
Boo Yang Jung ◽  
Jae Shik Choi ◽  
Tae Sung Oh ◽  
Dow-Bin Hyun

AbstractThermoelectric properties of polycrystalline (Bi1−xSbx)2Te3 (0.75 ≤ x ≤ 0.85), fabricated by mechanical alloying and hot pressing methods, have been investigated. Formation of (Bi0.25Sb0.75)2Te3 alloy powder was completed by mechanical alloying for 5 hours at ball- to-material ratio of 5: 1, and processing time for (Bi1−xSbx)2Te3 formation increased with Sb2Te3 content x. When (Bi0.25Sb0.75)2Te3 was hot pressed at temperatures ranging from 300°C to 550°C for 30 minutes, figure-of-merit increased with hot pressing temperature and maximum value of 2.8 × 10−3/K could be obtained by hot pressing at 550°C. When hot pressed at 550°C, (Bi0.2Sb0.8)2Te3 exhibited figure-of-merit of 2.92 × 10−3/K, which could be improved to 2.97 × 10−3/K with addition of 1 wt% Sb as acceptor dopant.


1997 ◽  
Vol 478 ◽  
Author(s):  
K. Park ◽  
J. Seo ◽  
C. Lee

AbstractThe p-type Bi0.5Sb1.5Te3 compounds with Te dopant (4.0 and 6.0 wt%) and without dopant were fabricated by hot extrusion in the temperature range of 300 to 510 °C under an extrusion ratio of 20:1. The undoped and Te doped compounds were highly dense and showed high crystalline quality. The grains contained many dislocations and were fine equiaxed (˜ 1.0 μm) owing to the dynamic recrystallization during the extrusion. The hot extrusion gave rise to the preferred orientation of grains. The bending strength and the figure of merit of the undoped and Te doped compounds were increased with increasing the extrusion temperature. The Te dopant significantly increased the figure of merit. The values of the figure of merit of the undoped and 4.0 wt% Te-doped compounds hot extruded at 440 °C were 2.11×10−3/K and 2.94×10−3/K, respectively.


2018 ◽  
Vol 773 ◽  
pp. 145-151
Author(s):  
Min Soo Park ◽  
Gook Hyun Ha ◽  
Hye Young Koo ◽  
Yong Ho Park

The Bi–Te thermoelectric system shows an excellent figure of merit (ZT) near room temperature. Research on increasing the ZT value for n‑type Bi–Te is imperative because the thermoelectric properties of this compound are inferior to those of the p-type material. For this purpose, n-type Bi2Te3-ySey powders with various amounts of Se dopant (0.3 ≤ y ≤ 0.6) were synthesized by a vacuum melting-grinding process to improve the physical properties. The ZT value of the sintered bodies was investigated in the temperature range of 298–423 K with regard to the electrical and thermal characteristics. As the Se content increased, the electrical conductivity decreased owing to a reduction in the carrier concentration, which improved the overall value of ZT. The thermal conductivity clearly decreased as the Se content increased in the temperature range of 298–373 K due to increased alloy scattering, as well as a reduction in the lattice thermal conductivity caused by crystal grain boundary scattering. At room temperature, Bi2Te2.7Se0.3 (y = 0.3) exhibited the highest ZT of 0.85. At increased temperatures, the ZT value was highest for Bi2Te2.55Se0.45 (y = 0.45), indicating that the optimal effect of the Se dopants varies depending on the temperature range.


2020 ◽  
Vol 21 (4) ◽  
pp. 628-634
Author(s):  
O. Kostyuk ◽  
B. Dzundza ◽  
M. Maksymuk ◽  
V. Bublik ◽  
L. Chernyak ◽  
...  

Bismuth antimony telluride is the most commonly used commercial thermoelectric material for power generation and refrigeration over the temperature range of 200–400 K. Improving the performance of these materials is a complected balance of optimizing thermoelectric properties. Decreasing the grain size of Bi0.5Sb1.5Te3 significantly reduces the thermal conductivity due to the scattering phonons on the grain boundaries. In this work, it is shown the advances of spark plasma sintering (SPS) for the preparation of nanocrystalline p-type thermoelectrics based on Bi0.5Sb1.5Te3 at different temperatures (240, 350, 400oC). The complex study of structural and thermoelectric properties of Bi0.5Sb1.5Te3 were presented. The high dimensionless thermoelectric figure of merit ZT ~ 1 or some more over 300–400 K temperature range for nanocrystalline p-type Bi0.5Sb1.5Te3 was obtained.


2013 ◽  
Vol 456 ◽  
pp. 490-493
Author(s):  
Jing Liu ◽  
Liang Ming Peng

The effects of nanophase additions on the thermoelectric properties of n-type AgPb18SbTe20 fabricated by combining fast melting and hot pressing were investigated. The presence of sovelthermally syntheszied AgPb18SbTe20 nanospheres or nanorods in the bulk yields remarkably improved thermoelectric properties. Nanophase additions produce a reduction in the Seebeck coefficent at about 300~550 K and the maximum Seebeck coefficient absolute values are, respectively, 378 and 380 μV·K-1 for LAST-18 with nanospheres and nanorods samples. The κ values of two samples with nanophases show a lower value in the entire temperature range compared to that of LAST-18 matrix. A maximum figure of merit, ZT=0.92 at 673K for the nanorod-containing composite is achieved mainly due to the reduced thermal conductivity. Furthermore, the temperature of ZT peak shift to a higher range originated from the enlarged energy gap.


Materials ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 3448
Author(s):  
Francisco Arturo López Cota ◽  
José Alonso Díaz-Guillén ◽  
Oscar Juan Dura ◽  
Marco Antonio López de la Torre ◽  
Joelis Rodríguez-Hernández ◽  
...  

This contribution deals with the mechanochemical synthesis, characterization, and thermoelectric properties of tetrahedrite-based materials, Cu12-xMxSb4S13 (M = Fe2+, Zn2+, Cd2+; x = 0, 1.5, 2). High-energy mechanical milling allows obtaining pristine and substituted tetrahedrites, after short milling under ambient conditions, of stoichiometric mixtures of the corresponding commercially available binary sulfides, i.e., Cu2S, CuS, Sb2S3, and MS (M = Fe2+, Zn2+, Cd2+). All the target materials but those containing Cd were obtained as single-phase products; some admixture of a hydrated cadmium sulfate was also identified by XRD as a by-product when synthesizing Cu10Cd2Sb4S13. The as-obtained products were thermally stable when firing in argon up to a temperature of 350–400 °C. Overall, the substitution of Cu(II) by Fe(II), Zn(II), or Cd(II) reduces tetrahedrites’ thermal and electrical conductivities but increases the Seebeck coefficient. Unfortunately, the values of the thermoelectric figure of merit obtained in this study are in general lower than those found in the literature for similar samples obtained by other powder processing methods; slight compositional changes, undetected secondary phases, and/or deficient sintering might account for some of these discrepancies.


2013 ◽  
Vol 06 (05) ◽  
pp. 1340007 ◽  
Author(s):  
CELINE BARRETEAU ◽  
LIN PAN ◽  
YAN-LING PEI ◽  
LI-DONG ZHAO ◽  
DAVID BERARDAN ◽  
...  

During the past two years, we have underlined the great potential of p-type oxychalcogenides, with parent compound BiCuSeO , for thermoelectric applications in the medium temperature range (400–650°C). These materials, which do not contain lead and are less expensive than Te containing materials, exhibit large thermoelectric figure of merit, exceeding 1 in a wide temperature range, mainly due to an intrinsically very low thermal conductivity. This paper summarizes the main chemical and crystallographic features of this system, as well as the thermoelectric properties. It also gives new directions to improve these properties, and discuss the potential of these materials for wide scale applications in thermoelectric conversion system in the medium temperature range.


2009 ◽  
Vol 24 (2) ◽  
pp. 430-435 ◽  
Author(s):  
D. Li ◽  
H.H. Hng ◽  
J. Ma ◽  
X.Y. Qin

The thermoelectric properties of Nb-doped Zn4Sb3 compounds, (Zn1–xNbx)4Sb3 (x = 0, 0.005, and 0.01), were investigated at temperatures ranging from 300 to 685 K. The results showed that by substituting Zn with Nb, the thermal conductivities of all the Nb-doped compounds were lower than that of the pristine β-Zn4Sb3. Among the compounds studied, the lightly substituted (Zn0.995Nb0.005)4Sb3 compound exhibited the best thermoelectric performance due to the improvement in both its electrical resistivity and thermal conductivity. Its figure of merit, ZT, was greater than the undoped Zn4Sb3 compound for the temperature range investigated. In particular, the ZT of (Zn0.995Nb0.005)4Sb3 reached a value of 1.1 at 680 K, which was 69% greater than that of the undoped Zn4Sb3 obtained in this study.


1998 ◽  
Vol 545 ◽  
Author(s):  
Ke-Feng Cai ◽  
Ce-Wen Nan ◽  
Xin-Min Min

AbstractB4C ceramics doped with various content of Si (0 to 2.03 at%) are prepared via hot pressing. The composition and microstructure of the ceramics are characterized by means of XRD and EPMA. Their electrical conductivity and Seebeck coefficient of the samples are measured from room temperature up to 1500K. The electrical conductivity increases with temperature, and more rapidly after 1300K; the Seebeck coefficient of the ceramics also increases with temperature and rises to a value of about 320μVK−1. The value of the figure of merit of Si-doped B4C rises to about 4 × 10−4K−1 at 1500K.


2005 ◽  
Vol 297-300 ◽  
pp. 875-880
Author(s):  
Cheol Ho Lim ◽  
Ki Tae Kim ◽  
Yong Hwan Kim ◽  
Dong Choul Cho ◽  
Young Sup Lee ◽  
...  

P-type Bi0.5Sb1.5Te3 compounds doped with 3wt% Te were fabricated by spark plasma sintering and their mechanical and thermoelectric properties were investigated. The sintered compounds with the bending strength of more than 50MPa and the figure-of-merit 2.9×10-3/K were obtained by controlling the mixing ratio of large powders (PL) and small powders (PS). Compared with the conventionally prepared single crystal thermoelectric materials, the bending strength was increased up to more than three times and the figure-of-merit Z was similar those of single crystals. It is expected that the mechanical properties could be improved by using hybrid powders without degradation of thermoelectric properties.


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