The Integration of Interlayer Dielectric Deposition and Chemical Mechanical Polishing

1997 ◽  
Vol 477 ◽  
Author(s):  
Anda McAfee ◽  
Daniel A. Koos ◽  
Stephen mcArdle ◽  
Mercedes Jacobs ◽  
Robert Hiatt
Keyword(s):  
Photoelectron Spectroscopy ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Important Process ◽  
Interlayer Dielectric ◽  
X Ray ◽  
Force Microscopy ◽  
Interfacial Delamination ◽  
Atomic Force ◽  
Process Issue

ABSTRACTThis paper addresses an important process issue in tie integration of chemical mechanical polishing (CMP) with interlayer dielectric (ILD) deposition for advanced back end processing. Gap fill between metal lines is achieved by using a dep-etch-dep technique for the tetraethylorthosilicate (TEOS) ILD deposition. The ILD layer is then planarized by CMP. Vias are etched through the ILD and filled with tungsten plugs in a blanket tungsten deposition and tungsten CMP sequence. Delamination has been observed at the interface between the TEOS layers following the blanket tungsten deposition and before or during tungsten CMP. The weak interface between the TEOS layers was found to be the result of residual carbon and fluorine from the tetraflouromethane (CF4) doped etch process. The interface between the TEOS layers was examined using X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). Experiments were carried out to determine if the residue and subsequent delamination could be eliminated by modifying the dep-etch-dep process. An improved process was identified and has been implemented on a 0.5μm CMOS and mixed-mode BiCMOS production line with no subsequent occurrence of interfacial delamination.

Effect of pH on ceria–silica interactions during chemical mechanical polishing

2005 ◽  
Vol 20 (5) ◽  
pp. 1139-1145 ◽  
Author(s):  
Jeremiah T. Abiade ◽  
Wonseop Choi ◽  
Rajiv K. Singh
Keyword(s):  
Photoelectron Spectroscopy ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Force Measurements ◽  
X Ray ◽  
Force Microscopy ◽  
Substrate Interaction ◽  
Atomic Force ◽  
Silica Removal

To understand the ceria–silica chemical mechanical polishing (CMP) mechanisms, we studied the effect of ceria slurry pH on silica removal and surface morphology. Also, in situ friction force measurements were conducted. After polishing; atomic force microscopy, x-ray photoelectron spectroscopy, and scanning electron microscopy were used to quantify the extent of the particle–substrate interaction during CMP. Our results indicate the silica removal by ceria slurries is strongly pH dependent, with the maximum occurring near the isoelectric point of the ceria slurry.

Chemical-Mechanical Polishing of Polymer Films: Comparison of Benzocyclobutene(BCB) and Parylene-N Films by XPS and AFM

1997 ◽  
Vol 476 ◽  
Author(s):  
G.-R. Yang ◽  
Y.-P. Zhao ◽  
Jan M. Neirynck ◽  
Shyam P. Murarka ◽  
Ronald J. Gutmann
Keyword(s):  
Photoelectron Spectroscopy ◽  
Chemical Mechanical Polishing ◽  
Surface Characteristics ◽  
Mechanical Polishing ◽  
Force Microscopy ◽  
Atomic Force ◽  
Good For ◽  
Deposited Film ◽  
Post Deposition

AbstractThe quality of benzocyclobutene (BCB) and Parylene-N (PA-N) films after chemical-mechanical polishing (CMP) is influenced by 3 factors: slurry composition, quality of the as-deposited film or post-deposition treated film, and polishing time. The quality of the films has been investigated by using X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). It is shown that the higher the quality of the as-deposited film (or post-deposition treated film), the higher the quality of the polished film. The polishing time has little effect on the surface characteristics of high quality PA-N films, however it has an effect on BCB film. This is attributed to the structure and thermal-stability and higher chemical resistance of PA-N. The RMS surface roughness measured by AFM, for as-deposited PA-N is 90Å. The roughness after CMP processes is greater than 200Å. The roughness for as-spin-coated and polished BCB film is 5A, and 20Å, respectively. The morphology of the PA-N film, either as-deposited or polished, is not as good as the BCB film. A slurry which is good for BCB polishing is not good for PA-N polishing, and vice versa. These results indicate that the nature of the polymer film, including its chemical structure as well as the quality of the as-deposited/post-deposition treated film, plays an important role in polymer CMP.

Investigation of the Effect of Uv-Assisted Oxidation and Nitridation of Hafnium Metal Films

2003 ◽  
Vol 780 ◽  
Author(s):  
C. Essary ◽  
V. Craciun ◽  
J. M. Howard ◽  
R. K. Singh
Keyword(s):  
Uv Radiation ◽  
Photoelectron Spectroscopy ◽  
Grazing Angle ◽  
X Ray Diffraction ◽  
Metal Thin Films ◽  
X Ray ◽  
Force Microscopy ◽  
Si Substrates ◽  
Atomic Force ◽  
Silicon Interface

AbstractHf metal thin films were deposited on Si substrates using a pulsed laser deposition technique in vacuum and in ammonia ambients. The films were then oxidized at 400 °C in 300 Torr of O2. Half the samples were oxidized in the presence of ultraviolet (UV) radiation from a Hg lamp array. X-ray photoelectron spectroscopy, atomic force microscopy, and grazing angle X-ray diffraction were used to compare the crystallinity, roughness, and composition of the films. It has been found that UV radiation causes roughening of the films and also promotes crystallization at lower temperatures.Furthermore, increased silicon oxidation at the interface was noted with the UVirradiated samples and was shown to be in the form of a mixed layer using angle-resolved X-ray photoelectron spectroscopy. Incorporation of nitrogen into the film reduces the oxidation of the silicon interface.

Curcumin delivery by modified biosourced carbon-based nanoparticles

Nanomedicine ◽  
2022 ◽  
Author(s):  
Hossein Danafar ◽  
Marziyeh Salehiabar ◽  
Murat Barsbay ◽  
Hossein Rahimi ◽  
Mohammadreza Ghaffarlou ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Free System ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Good Biocompatibility ◽  
Drug Free ◽  
Mcf 7 ◽  
Carbon Based

Aim: To prepare a novel hybrid system for the controlled release and delivery of curcumin (CUR). Methods: A method for the ultrasound-assisted fabrication of protein-modified nanosized graphene oxide-like carbon-based nanoparticles (CBNPs) was developed. After being modified with bovine serum albumin (BSA), CUR was loaded onto the synthesized hybrid (labeled CBNPs@BSA–CUR). The structure and properties of the synthesized nanoparticles were elucidated using transmission electron microscopy (TEM), atomic force microscopy (AFM), ultraviolet-visible spectroscopy (UV-Vis), Fourier-transform infrared spectroscopy (FTIR) and x-ray photoelectron spectroscopy (XPS) methods. Results: CBNPs@BSA–CUR showed pH sensitivity and were calculated as controlled CUR release behavior. The drug-free system exhibited good biocompatibility and was nontoxic. However, CBNPs@BSA–CUR showed acceptable antiproliferative ability against MCF-7 breast cancer cells. Conclusion: CBNPs@BSA–CUR could be considered a highly promising nontoxic nanocarrier for the delivery of CUR with good biosafety.

Effect of Surface Chemistry on Ruthenium Wet Etching

2021 ◽  
Vol 314 ◽  
pp. 302-306
Author(s):  
Quoc Toan Le ◽  
E. Kesters ◽  
M. Doms ◽  
Efrain Altamirano Sánchez
Keyword(s):  
Surface Roughness ◽  
Photoelectron Spectroscopy ◽  
Etching Rate ◽  
Wet Etching ◽  
X Ray ◽  
Force Microscopy ◽  
Metal Free ◽  
Atomic Force ◽  
Different Types ◽  
Effect Of Surface

Different types of ALD Ru films, including as-deposited, annealed Ru, without and with a subsequent CMP step, were used for wet etching study. With respect to the as-deposited Ru, the etching rate of the annealed Ru film in metal-free chemical mixtures (pH = 7-9) was found to decrease substantially. X-ray photoelectron spectroscopy characterization indicated that this behavior could be explained by the presence of the formation of RuOx (x = 2,3) caused by the anneal. A short CMP step applied to the annealed Ru wafer removed the surface RuOx, at least partially, resulting in a significant increase of the etching rate. The change in surface roughness was quantified using atomic force microscopy.

Investigation of Ti/CuO interface by X-ray photoelectron spectroscopy and atomic force microscopy

2018 ◽  
Vol 51 (2) ◽  
pp. 246-253
Author(s):  
Dev Raj Chopra ◽  
Justin Seth Pearson ◽  
Darius Durant ◽  
Ritesh Bhakta ◽  
Anil R. Chourasia
Keyword(s):  
Atomic Force Microscopy ◽  
Photoelectron Spectroscopy ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force

Characterization of X-ray irradiated graphene oxide coatings using X-ray diffraction, X-ray photoelectron spectroscopy, and atomic force microscopy

2013 ◽  
Vol 28 (2) ◽  
pp. 68-71 ◽  
Author(s):  
Thomas N. Blanton ◽  
Debasis Majumdar
Keyword(s):  
Atomic Force Microscopy ◽  
Graphene Oxide ◽  
Photoelectron Spectroscopy ◽  
High Energy ◽  
X Ray Diffraction ◽  
Carbon Phase ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Before And After

In an effort to study an alternative approach to make graphene from graphene oxide (GO), exposure of GO to high-energy X-ray radiation has been performed. X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM) have been used to characterize GO before and after irradiation. Results indicate that GO exposed to high-energy radiation is converted to an amorphous carbon phase that is conductive.

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